Proceedings of the International Symposium on Thin Film Materials, Processes, Reliability, and Applications, Thin Film Processes

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Proceedings of the International Symposium on Thin Film Materials, Processes, Reliability, and Applications, Thin Film Processes / editors, G.S. Mathad, M. Meyyappan, M. Engelhardt ; Dielectric Science & Technology, Electronics, and Electrodeposition Divisions

Format:

Book

Published:

Pennington, NJ : Electrochemical Society, c1998

Description:

ix, 370 p. ; 23 cm

Series:

Proceedings / [Electrochemical Society] ; v. 97-30 <BA01323290>

Authors:

International Symposium on Thin Film Materials, Processes, Reliability, and Applications: Thin Film Processes

Mathad, G. S. <DA03249537>

Meyyappan, M.

Engelhardt, M. (Michael)

Electrochemical Society. Dielectric Science and Technology Division <DA06421624>

Electrochemical Society. Electronics Division <DA0357072X>

Electrochemical Society. Electrodeposition Division <DA06133470>

Electrochemical Society. Meeting <DA03398898>

International Society of Electrochemistry. Meeting <DA12237583>

4 more

ISBN:

9781566771832 [1566771838]

NCID:

BA43162777

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Bibliography Details

Other titles:	Thin film materials, processes, reliability, and applications: thin film processes
Note:	"Held as a part of the Joint International Meeting of the Electrochemical Society, Inc. and the International Society for Electrochemistry in Paris, France, Aug. 31-Sept. 5, 1997"--P. iii Includes bibliographical references and indexes
Subject:	Plasma etching--Congresses; Thin film devices--Design and construction--Congresses; Thin films--Congresses
Language:	English

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