Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing

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Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing / editors, S. Raghavan, R.L. Opila, L. Zhang ; Electronics and Dielectric Science and Technology Divisions [of the Electrochemical Society]

Format:

Book

Published:

Pennington, N. J. : Electrochemical Society, c1998

Description:

viii, 274 p. ; 23 cm

Series:

Proceedings / [Electrochemical Society] ; v. 98-7 <BA01323290>

Authors:

International Symposium on Chemical Mechanical Planarization <DA10888875>

Raghavan, S. (Srini) <DA10888897>

Opila, Robert Leon, 1953- <DA12254039>

Zhang, L.

Electrochemical Society. Electronics Division <DA0357072X>

Electrochemical Society. Dielectric Science and Technology Division <DA06421624>

Electrochemical Society. Meeting <DA03398898>

2 more

ISBN:

9781566772013 [156677201X]

NCID:

BA4328413X

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Bibliography Details

Other titles:	Chemical mechanical planarization in integrated circuit device manufacturing
Note:	"Electronics and Dielectric Science and Technology Divisions." "This volume contains most of the papers presented at the Second International Symposium on Chemical Mechanical Planarization (CMP) in Integrated Circuit (IC) Device Manufacturing held at the 193rd Annual Meeting of Electrochemical Society in San Diego during May 5-7, 1998." Includes bibliographical references and indexes
Subject:	Grinding and polishing Congresses; Metals--Pickling Congresses; Microelectronics--Materials Congresses; Semiconductors--Surfaces Congresses
Language:	English

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