Preface |
Acknowledgments |
Introduction / Chapter 1: |
Laminates and Substrates / Chapter 2: |
Teflon Fiberglas Laminates / 2.1: |
Woven Teflon Fiberglas Material / 2.2.1: |
Microfiber Teflon Fiberglas Laminates / 2.2.2: |
High-Dielectric PTFE / 2.2.3: |
Other Teflon Laminates / 2.2.4: |
Alumina Substrates / 2.3: |
Sapphire, Quartz, and Beryllia Substrates / 2.4: |
Chapter Summary / 2.5: |
Metals / Chapter 3: |
Aluminum / 3.1: |
Copper / 3.3: |
Silver / 3.4: |
Gold / 3.5: |
Miscellaneous Metals / 3.6: |
Indium / 3.6.1: |
Tin / 3.6.2: |
Lead / 3.6.3: |
Kovar and Invar / 3.6.4: |
Metal Applications / 3.7: |
Microwave Artwork / 3.8: |
Microwave Drawings / 4.1: |
Microwave Layouts / 4.3: |
PC Tape / 4.3.1: |
Rubyliths / 4.3.2: |
Automated Rubylith / 4.3.3: |
CALMA Systems / 4.3.4: |
Autoart / 4.3.5: |
Other Computer-Aided Design Programs / 4.3.6: |
Films / 4.5: |
Etching Techniques / Chapter 5: |
Photo Resists / 5.1: |
Artwork Placement and Exposure / 5.3: |
Etching / 5.4: |
Bonding Techniques / 5.5: |
Solder / 6.1: |
Epoxy / 6.3: |
Bonds / 6.4: |
Thermocompression Bonding / 6.4.1: |
Ultrasonic Bonding / 6.4.2: |
Thermosonic Bonding / 6.4.3: |
Component and Substrate Attachment / 6.5: |
Connectors and Transitions / 6.6: |
Microwave Connectors / 7.1: |
SMA Connectors / 7.2.1: |
TNC Connectors / 7.2.2: |
Type-N Connectors / 7.2.3: |
APC-7 Connector / 7.2.4: |
K Connector / 7.2.5: |
Transitions / 7.3: |
Microwave Packaging / 7.4: |
Microstrip Packages / 8.1: |
Stripline Packaging / 8.3: |
Package Sealing / 8.4: |
Dielectric Constants / 8.5: |
Coefficients of Expansion / Appendix B: |
Chemical Symbols / Appendix C: |
Melting Points / Appendix D: |
Temperature Conversion / Appendix E: |
Data Sheets for Microwave Laminates / Appendix F: |
References |
Index |
Preface |
Acknowledgments |
Introduction / Chapter 1: |
Laminates and Substrates / Chapter 2: |
Teflon Fiberglas Laminates / 2.1: |
Woven Teflon Fiberglas Material / 2.2.1: |