Statistical theory of extended radar targets : a translation from the Russian of Statisticheskaya teoriya radiolokatsii protyazhennyz [sic] tselei

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Statistical theory of extended radar targets : a translation from the Russian of Statisticheskaya teoriya radiolokatsii protyazhennyz [sic] tselei / by R.V. Ostrovityanov & F.A. Basalov ; translated by William F. Barton and David K. Barton

資料種別:

図書

出版情報:

Dedham, MA : Artech House, 1985

形態:

xviii, 364 p. ; 24 cm

著者名:

ISBN:

9780890061442 [0890061440]
9780890061145 [0890061149] ((cover))

書誌ID:

BA04042403

子書誌情報

フルテキスト

所蔵情報

他の版・巻

書誌詳細

その他の標題:

Statisticheskai︠a︡ teorii︠a︡ radiolokat︠s︡ii proti︠a︡zhennykh t︠s︡eleĭ
Statisticheskaya teoriya radiolokatsii protyazhennykh tselei

注記:

Translation of: Statisticheskai︠a︡ teorii︠a︡ radiolokat︠s︡ii proti︠a︡zhennykh t︠s︡eleĭ
Bibliography: p. [357]-364

主題:

Radar targets

言語:

英語

目次情報:

Introduction / 1.0：

Purpose

Objective / 1.2：

Orientation / 1.3：

Scope / 1.4：

Sources and Coupling of Em Energy / 2.0：

The Environment / 2.1：

Environment Sources / 2.2：

General Signal Characteristics / 2.2.1：

Pulse Signal / 2.2.2：

Signal Transmission / 2.2.3：

Radiated Energy / 2.3：

The Radiation Field / 2.3.1：

Distinction Between Induction and Radiation Fields / 2.3.2：

Nonlinear Environmental Effects / 2.3.3：

Propagation Effects / 2.3.4：

The GSE Radiated Environments / 2.3.5：

Conducted Energy / 2.4：

Conducted Routes / 2.4.1：

The GSE Conducted Environment / 2.4.2：

Combined Effects / 2.5：

Design Considerations / 3.0：

General Guidelines / 3.1：

Electrical Design / 3.1.1：

Physical Layout of Components / 3.1.2：

Mechanical Factors / 3.1.3：

Safety / 3.2：

The Effects of High RF Fields / 3.2.1：

Safety Procedures and Design Criteria / 3.2.2：

Factors Influencing Gse Emc / 3.3：

EMC Maintenance Considerations / 3.3.1：

Cost Benefit Considerations / 3.3.2：

Microprocessors and Digital Systems / 3.3.3：

Examples of Avionic and Gse Designs / 3.4：

Flight or Hangar Deck Operation / 3.4.1：

Shop Testing / 3.4.2：

Control and Test Planning / 4.0：

General / 4.1：

The Emc Control Plan / 4.2：

The Role of the Control Plan / 4.2.1：

The Contents of the Control Plan / 4.2.2：

Control Plan Checklist / 4.2.3：

The Emc Test Plan / 4.3：

Shielding / 5.0：

General Shield Design Considerations / 5.1：

Solid Shielding Materials / 5.2：

Shielding Analysis / 5.2.1：

Additional Comments on Magnetic Shielding / 5.2.2：

Multiple Solid Shields / 5.2.3：

Coating and Thin-Film Shielding / 5.2.4：

Non-Solid Shielding Materials / 5.3：

Types of Discontinuities / 5.3.1：

Composite Materials / 5.3.2：

Cables and Connectors / 5.4：

Cable Shielding / 5.4.1：

Cable Shield Terminations and Connectors / 5.4.2：

New Connector Technology / 5.4.3：

Fiber Optics / 5.4.4：

Other Design Techniques to Maintain Shielding Effectiveness / 5.5：

Seams Without Gaskets / 5.5.1：

Seams With Gaskets / 5.5.2：

Use of Waveguide Attenuators / 5.5.3：

Panel Openings / 5.5.4：

Required Visual Openings / 5.5.5：

Shielding Tests / 5.6：

Low Impedance Magnetic Field Testing Using Small Loops / 5.6.1：

Low Impedance Magnetic Field Testing Using a Helmholtz Coil / 5.6.3：

High Impedance Electric Field Testing Using Rod Antennas / 5.6.4：

High Impedance Electric Field Testing Using a Parallel Line Radiator / 5.6.5：

Plane Wave Testing Using Antennas / 5.6.6：

Plane Wave Testing Using a Parallel Plate Transmission Line / 5.6.7：

MIL-STD-1377 Testing / 5.6.8：

Summary of Good Shielding Practices / 5.7：

Bonding / 6.0：

Surface Treatment / 6.1：

Corrosion / 6.3：

Bonding Effectiveness Characteristics / 6.4：

Bond Jumper Equivalent Circuit / 6.4.1：

Equipment Effects on Indirect Bonds / 6.4.2：

Bonding Resistance / 6.4.3：

Bonding Tests / 6.5：

DC Resistance Measurement / 6.5.1：

Swept Frequency/Shunt-T Insertion Loss Measurement / 6.5.3：

Single Vs. Multi-Point Bonding / 6.6：

Bonding Design Guidelines / 6.7：

Grounding / 7.0：

Grounding Techniques / 7.1：

Circuit Grounding Considerations / 7.3：

Power Supply Considerations / 7.4：

Prime Power Considerations / 7.5：

Cabling Considerations / 7.6：

Grounding Design Guidelines / 7.7：

Fil Tering / 8.0：

Filter Desing / 8.1：

Low-Pass Filters / 8.2.1：

High Pass Filters / 8.2.2：

Bandpass Filters / 8.2.3：

Band-Rejection Filters / 8.2.4：

Transient Suppression / 8.3：

Inductive Loads / 8.3.1：

Mechanical Switches / 8.3.2：

Transformer Switching / 8.3.3：

Semiconductor Transients / 8.3.4：

Active Power Line Filters / 8.4：

Noise Blanking, Cancelling, And Limiting circuits / 8.5：

Noise Blanking / 8.5.1：

Cancellation / 8.5.2：

Limiting / 8.5.3：

Filter Tests / 8.6：

MIL-STD-220A Insertion Loss Test / 8.6.1：

Filter Admittance Transfer Test / 8.6.3：

Parallel Signal Injection Test / 8.6.4：

Series Signal Injection Test / 8.6.5：

Current Injection Probes / 8.6.6：

Leakage Current Test / 8.6.7：

Filter Installation And Mounting / 8.7：

Specifying Fil Ters / 8.8：

Testing Requirements and Techniques / 9.0：

Shielded Enclosure Requirements / 9.1：

Enclosure Limitations / 9.2.1：

Enclosure Design Considerations / 9.2.2：

Microwave Absorbers / 9.2.3：

Testing Guidelines / 9.3：

Signal Sources / 9.3.1：

Sweep Generators and Oscillators / 9.3.3：

Attenuators / 9.3.4：

Detectors / 9.3.5：

Radiated And Conducted Equipment Testing / 9.4：

Emission Tests / 9.4.1：

Susceptibility Tests / 9.4.3：

Transient Testing / 9.4.4：

Specifications and Standards / 10.0：

Applicable Specifications / 10.1：

Obtaining Specifications / 10.3：

Tables And Nomographs / 11.0：

Order Of Contents / 11.1：

Introduction / 1.0：

Purpose

Objective / 1.2：

Orientation / 1.3：

Scope / 1.4：

Sources and Coupling of Em Energy / 2.0：

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