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Thermal management, solder technology, optoelectronics packaging : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 / sponsored by the American Society of Mechanical Engineers ; edited by P.A. Engel, W.T. Chen

資料種別:
図書
出版情報:
New York (345 E. 47th St., New York) : American Society of Mechanical Engineers, c1993
形態:
xi, 551-1200 p. ; 28 cm
シリーズ名:
EEP ; vol. 4-2 <BA14250087>
著者名:
ISBN:
9780791806869 [0791806863]
書誌ID:
BA21835761
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