Thermal management, solder technology, optoelectronics packaging : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993

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Thermal management, solder technology, optoelectronics packaging : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 / sponsored by the American Society of Mechanical Engineers ; edited by P.A. Engel, W.T. Chen

資料種別:

図書

出版情報:

New York (345 E. 47th St., New York) : American Society of Mechanical Engineers, c1993

形態:

xi, 551-1200 p. ; 28 cm

シリーズ名:

EEP ; vol. 4-2 <BA14250087>

著者名:

ISBN:

9780791806869 [0791806863]

書誌ID:

BA21835761

子書誌情報

フルテキスト

所蔵情報

他の版・巻

書誌詳細

主題:	Electronic packaging--Congresses
言語:	英語

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