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Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications / edited by Martin A. Schmidt ... [et al. ; sponsored by the] Electronics and Dielectric Science and Technology Divisions

資料種別:

図書

出版情報:

Pennington, NJ : Electrochemical Society, c1993

形態:

x, 485 p. ; 23 cm

シリーズ名:

Proceedings / [Electrochemical Society] ; v. 93-29 <BA01323290>

著者名:

ISBN:

9781566770682 [1566770688]

書誌ID:

BA22331898

子書誌情報

フルテキスト

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書誌詳細

注記:	Symposium held at Hawaii, May 16-21, 1993 Includes bibliographical references and indexes
言語:	英語

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