CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

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CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by D. Agonafer, R.E. Fulton

資料種別:

図書

出版情報:

New York : American Society of Mechanical Engineers, c1994

形態:

v, 89 p. ; 28 cm

シリーズ名:

EEP ; vol. 9 <BA14250087>

著者名:

ISBN:

9780791814604 [0791814602]

書誌ID:

BA24206911

子書誌情報

フルテキスト

所蔵情報

他の版・巻

書誌詳細

言語:

英語

東工大ブックレビュー

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