Arjavalingam, Gnanalingam, Pazaris, James, DeFonzo, Alfred P., International Symposium on Advances in Interconnection …
SPIE
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Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS, Hartzell, Allyson L., Ramesham, Rajeshuni, Society …
SPIE
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Photonics Packaging, Integration, and Interconnects, Earman, Allen M., Chen, Ray T., Society of Photo-optical …
SPIE
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Descour, Michael R., Rantala, Juha T., Society of Photo-optical Instrumentation Engineers
SPIE
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Chen, Ray T., Neff, John A., Society of Photo-optical Instrumentation Engineers
SPIE
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Descour, Michael R., Rantala, Juha T., Society of Photo-optical Instrumentation Engineers
SPIE
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Chen, Ray T., Society of Photo-optical Instrumentation Engineers
SPIE
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Design, Characterization, and Packaging for MEMS and Microelectronics (Conference), Courtois, B. (Bernard), Demidenko, …
SPIE
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Design and Process Integration for Microelectronic Manufacturing (Conference), Wong, Alfred Kwok-Kit, Singh, Vivek K., …
SPIE
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Design, Characterization, and Packaging for MEMS and Microelectronics (Conference), Franzon, Paul D., Society of …
SPIE
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Behringer, Uwe F. W., Uttamchandani, Deepak, Society of Photo-optical Instrumentation Engineers, Scottish Enterprise, …
SPIE
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DeFonzo, Alfred P., Optical Society of America, Society of Photo-optical Instrumentation Engineers, Metallurgical …
SPIE
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