Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read
- 資料種別:
- 図書
- 出版情報:
- New York, N.Y. : American Society of Mechanical Engineers, c1997
- 形態:
- vi, 193 p. ; 28 cm
- シリーズ名:
- AMD ; vol. 222 <BA00053361>
EEP ; vol. 20 <BA14250087> - 著者名:
- ISBN:
- 9780791818275 [0791818276]
- 書誌ID:
- BA44033918
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