Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

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Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California / sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling

資料種別:

図書

出版情報:

New York : American Society of Mechanical Engineers, c1995

形態:

v, 117 p. ; 28 cm

シリーズ名:

EEP ; vol. 13 <BA14250087>
AMD ; vol. 214 <BA00053361>

著者名:

ISBN:

9780791817391 [0791817393]

書誌ID:

BA44129777

子書誌情報

フルテキスト

所蔵情報

他の版・巻

書誌詳細

注記:	Includes bibliographical references and index
主題:	Electronic packaging--Congresses; Mechanics, Applied--Congresses
言語:	英語

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