Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California / sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Materials Division, ASME ; edited by Tien Y. Wu ... [et al.]
- 資料種別:
- 図書
- 出版情報:
- New York : American Society of Mechanical Engineers, c1995
- 形態:
- vi, 271 p. ; 28 cm
- シリーズ名:
- EEP ; v. 11 <BA14250087>
MD ; v. 64 <BA07638589> - 著者名:
- ISBN:
- 9780791817360 [0791817369]
- 書誌ID:
- BA44130608
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