Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

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Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Chao-pin Yeh, Charles Ume

資料種別:

図書

出版情報:

New York, N.Y. : American Society of Mechanical Engineers, c1996

形態:

v, 125 p. ; 28 cm

シリーズ名:

EEP ; vol. 17 <BA14250087>

著者名:

ISBN:

9780791815489 [079181548X]

書誌ID:

BA44131043

子書誌情報

フルテキスト

所蔵情報

他の版・巻

書誌詳細

注記:	Includes bibliographical references and index
主題:	Electronic packaging--Congresses; Multichip modules (Microelectronics)--Congresses
言語:	英語

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