CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

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CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.]

資料種別:

図書

出版情報:

New York : American Society of Mechanical Engineers, c1997

形態:

v, 109 p. ; 28 cm

シリーズ名:

EEP ; vol. 23 <BA14250087>
HTD ; vol. 356 <BA00053441>

著者名:

ISBN:

9780791818527 [0791818527]

書誌ID:

BA44133264

子書誌情報

フルテキスト

所蔵情報

他の版・巻

書誌詳細

注記:	Includes bibliographical references and index
主題:	Computer-aided engineering--Congresses; Electronic apparatus and appliances--Temperature control--Congresses; Electronic packaging--Design--Data processing--Congresses; Heat sinks (Electronics)--Congresses; Heat--Transmission--Data processing--Congresses
言語:	英語

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