| The Future |
| Matching Customer Information Needs With RandD Strategy: Predicting Market Demographics to Achieve Market Driven Innovation / Ralph W. Wyndrum, Jr |
| Microelectronics: It Is Polymer World in the 21st Century / Rao R. Tummala |
| High-Speed, Low-Loss Polymer Optical Fiber / Yasuhiro Koike ; Takaaki Ishigure |
| Modeling of the Mechanical Behavior of Polymers / S. Matsuoka |
| Physics of Polymeric Materials |
| Effects of Temperature on Viscoelastic Properties of Thermosetting Resin During Curing Process / Kozo Ikegami ; Hiroaki Matsui |
| A Novel Positive Working Photosensitive Polybenzoxazole for Semiconductor Surface Coating / Takashi Hirano ; Toshio Banba ; Hiroaki Makabe |
| Crazing in Thin Polymer Films / T. N. Krupenkin |
| Thermal Phenomena In Polymeric Materials and Plastic Packages of Ic Devices |
| Improvement of the Thermo-Mechanical Performance of Advanced Packages by Experimentally Assisted FE-Analysis / Bernd Michel ; Rainer Dudek ; Andreas Schubert |
| Consideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages / Thomas Winkler ; Eberhard Kaulfersch |
| Silicon Test Structures for Investigating the Thermomechanical Impact of Polymeric Packaging Materials on Microsystem Performance and Reliability / Jon B. Nysaether ; Johan Liu ; Bernt Liver[o slash]d ; Andre Larsen ; Per A. Ohickers |
| Thermal Management Enhancement for GaAs Devices Using CVD Diamond Heat Spreaders in a Plastic Package Environment / Philip M. Fabis ; Henry Windischmann |
| Over-Temperature Protection on Electronic Packages Through a Transient R-C Model / Ben-Je Lwo ; Kun-Fu Tseng ; Ching-Hsing Kao ; Luke Su Lu |
| Electronic Packaging Polymerics Extension to Cool Irrigation Technology / Dale L. Schruben ; Bo Yang ; Carlos R. Corleto ; Mario A. Medina |
| Mechanical Performance of Polymeric Materials |
| New Reworkable High Temperature (in Excess of 350[degree]-400[degree]C) Adhesives for MCM-D Assembly / C. P. Wong ; Jiali Wu ; Randy T. Pike |
| Fracture Behavior of Silica Particulate Filled Epoxide Resin for Semiconductor Packaging / Kikuo Kishimoto ; Mitsuo Notomi ; Toshikazu Shibuya ; Noriyasu Kawamura ; Takashi Kawakami |
| In-Situ Measurement of Mechanical Properties of Polyimide Films Using Micromachined Resonant String Structures / Yong-Jun Kim ; Mark G. Allen |
| On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications / Jang-hi Im ; Ed O. Schaffer II ; Ted Stokich, Jr. ; Andrew Strandjord ; Jack Hetzner ; Jim Curphy ; Cheryl Karas ; Greg Meyers ; Dave Hawn ; Ashok Chakrabarti ; Steve Froelicher |
| Application of Dynamic-Order Operators to the Problems of Contact Mechanics / D. Ingman ; J. Suzdainitsky ; M. Zeifman |
| Mechanical Reliability of Composites and Plastic Packages of IC Devices |
| Strength of CFRP Composites in Space Environment / Yoshihito Ozawa ; Hiroshi Suzuki |
| Quantifying the Effect of Prebaking on Delamination in Plastic IC Packages / A. A. O. Tay ; T. Y. Lin |
| The Effect of Polymer Die Attach Material on Solder Joint Reliability / Masazumi Amagai |
| Polymer Interface Crack and Adhesion Resistance / M. N. Perelmuter |
| Experimental Techniques |
| Characterization of Plastic Encapsulant Materials as a Baseline for Reliability Testing / L. Lantz ; M. G. Pecht |
| Study of Residual Stresses in PBGA Electronic Packages / Zhu Wu ; Jian Lu ; Yifan Guo |
| Microdeformation Analysis of Packages and Interconnects by the MicroDAC Method / Dietmar Vogel |
| Microwave Imaging for Nondestructive Inspection of Delamination in IC Packages by Open-Ended Coaxial Line Sensor / Yang Ju ; Masumi Saka ; Hiroyuki Abe |
| Manufacturing and Moisture Sensitivity Problems |
| Hygrothermo-Mechanical Behavior of Mold Compound Materials at Elevated Environment / Sung Yi ; Guan Hock Neo |
| SN Ratio Decibel (Taguchi) in Molding, Manufacturing or Other Processes / Tadao Shibayama |
| Elastic-Plastic Finite Element Analysis of Auto-Body Panel Stamping Processes Using Dynamic Explicit Time Integration Scheme / Dong Won Jung |
| Hygrothermally Induced Residual Stresses in a Plastic BGA / Chee Yoon Yue |
| Moisture Ingress and Absorption in a CCD Package Characterisation, Modelisation and Measurement / O. Puig ; P. Roustan |
| Polymer Coated Optical Fibers |
| Coated Optical Fiber Interconnect Subjected to the Ends Off-Set and Axial Loading / E. Suhir |
| Critical Strain and Postbuckling Stress in Polymerically Coated Optical Fiber Interconnect: What Could Be Gained by Using Thicker Coating? |
| Author Index |
| The Future |
| Matching Customer Information Needs With RandD Strategy: Predicting Market Demographics to Achieve Market Driven Innovation / Ralph W. Wyndrum, Jr |
| Microelectronics: It Is Polymer World in the 21st Century / Rao R. Tummala |
| High-Speed, Low-Loss Polymer Optical Fiber / Yasuhiro Koike ; Takaaki Ishigure |
| Modeling of the Mechanical Behavior of Polymers / S. Matsuoka |
| Physics of Polymeric Materials |
