Technologies in Electronic Manufacturing and Packaging: Increased Productivity and Quality |
Introduction / Imin Kao |
Interaction Between Wire and Ingot in Wiresaw Slicing / F. Yang ; J. C. M. Li |
An Integrated Model for Electromagnetic Field and Heat Transfer in a Cylindrical Silicon Tube Growth System / A. Roy ; Q.-S. Chen ; H. Zhang ; V. Prasad |
High Resolution Wafer Surface Topology Measurement Using Phase-Shifting Shadow Moire Technique / S. Wei ; E. Guan ; I. Kao ; F.-P. Chiang |
Computational Model for Free Abrasive Machining of Brittle Silicon Using a Wiresaw / M. Bhagavat |
Advanced Electronics Manufacturing, Packaging, and Process Technologies |
Reliability Analysis of Flip Chip on Board Assemblies Using No-Flow Underfill Materials / Daniel Baldwin ; Ryan Thorpe ; Daniel F. Baldwin |
Acoustic Emission Analysis for Fatigue Prediction of Lap Solder Joints in Mode Two Shear / Bryan J. Van De Wal ; Gay Kendall ; Chittaranjan Sahay |
Process Characterization and the Effect of Process Defects on Flip Chip Reliability / Brian Lewis ; Hilary Sasso |
Fundamental Analyses of Smart Tooling for Assembly of Thin Flexible Circuit and Board Systems / Ruijun Chen |
Electronics Manufacturing |
Design and Manufacturing Issues / C. Sahay ; Bahgat Sammakia |
A Performance and Manufacturability Evaluation of Bump Chip Carrier Packages / Lei L. Mercado ; Vijay Sarihan ; Russel Fiorenzo |
Artwork Scaling Factor for Inner Layers in Multi-Layer Board Manufacture / Owen Christofferson |
A Study of the Aperture Filling Process in Solder Paste Stencil Printing / J. Pan ; G. L. Tonkay |
Design and Implementation of a Flexible Intelligent Electronics Remanufacturing System / I. Fidan ; Russell P. Kraft ; Stephen J. Derby |
Thermal Management and Transport in Manufacturing |
Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages / V. H. Adams ; K. Ramakrishna |
Performance of Thermal Enhancements in Chip on Flex / Gary Miller |
Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock / Tien-Yu T. Lee ; Jeff Cook |
Thermal Issues That Arise Due to Manufacturing Processes: Evaluation and Measurement Techniques / Sanjeev Sathe |
Structural Mechanics and Materials Issues in Manufacturing |
A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling / A. Chandra ; Y. Huang ; Z. Q. Jiang ; K. X. Hu |
Constitutive and Cyclic Damage Model of 63Sn-37Pb Solder / V. Stolkarts ; L. M. Keer ; M. E. Fine |
A Dual-Phase-Lag Diffusion Model for Predicting Thin Film Growth / J. K. Chen ; J. E. Beraun ; D. Y. Tzou |
Effect of Volume on Ceramic Ball-Grid Array Solder Life / Stephen A. McKeown |
In-Situ Warpage Measurement During Thermal Cycling of Dielectric Coated SS Substrate for Large Area MCM-D Packaging / Anh X. H. Dang ; I. Charles Ume ; Swapan Bhattacharya |
Author Index |
Technologies in Electronic Manufacturing and Packaging: Increased Productivity and Quality |
Introduction / Imin Kao |
Interaction Between Wire and Ingot in Wiresaw Slicing / F. Yang ; J. C. M. Li |
An Integrated Model for Electromagnetic Field and Heat Transfer in a Cylindrical Silicon Tube Growth System / A. Roy ; Q.-S. Chen ; H. Zhang ; V. Prasad |
High Resolution Wafer Surface Topology Measurement Using Phase-Shifting Shadow Moire Technique / S. Wei ; E. Guan ; I. Kao ; F.-P. Chiang |
Computational Model for Free Abrasive Machining of Brittle Silicon Using a Wiresaw / M. Bhagavat |