Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November, 5-10, 2000, Orlando, Florida

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Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November, 5-10, 2000, Orlando, Florida / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by G. J. Kowalski ... [et al.]

資料種別:

図書

出版情報:

New York, N.Y. : American Society of Mechanical Engineers, c2000

形態:

vi, 300 p. ; 28 cm

シリーズ名:

EEP ; vol. 28 <BA14250087>

著者名:

ISBN:

9780791819302 [0791819302]

書誌ID:

BA51029229

子書誌情報

フルテキスト

所蔵情報

他の版・巻

書誌詳細

注記:

Includes bibliographic references and author index

主題:

Electronic packaging Congresses

言語:

英語

目次情報:

12th Symposium on Mechanics of Smt and Photonic Structures

Nonuniform Temperature Distribution in Electronic Devices Cooled by Flow in Parallel Microchannels / G. Hetsroni ; Z. Segal ; A. Mosyak

Stress Concentration in a Connectorized Optical Fiber / J. F. Malluck ; W. W. King

Nonlinear Thermal and Mechanical Analysis in the Vibration of a Printed Wiring Board / X. He ; R. Fulton

Key Parameters Affecting Solder Joint Life of Chip Resistors and Chip Capacitors Mounted on Insulated Metal Substrate / N. Sangalli ; D. B. Barker

Thermal-Mechanical Analysis of an NCA Type of Chip-on-Glass Assemblies / H.-C. Cheng ; M.-H. Lee ; K.-N. Chiang ; C.-W. Chang

Thermal Cycling Guidelines for Automotive, Computer, Portable, and Implantable Medical Device Applications / R. Raghunathan ; R. V. Pucha ; S. K. Sitaraman

Wafer Level Underfill Processing / L. Nguyen ; C. Quentin ; P. Nguyen

Parametric Design and Reliability Analysis of WIT Wafter Level Packaging / Y. T. Lin ; P. J. Tang ; K. N. Chiang

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100ln Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board / J. H. Lau ; S. Pan ; C. Chang

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints / S. H. Pan

Interfacial Delamination Propagation in Multi-Layered High-Density Wiring Electronic Packaging Structures / H. Hu ; W. Xie ; S. Sitaraman

Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint / T. E. Wong ; F. W. Palmieri ; L. A. Kachatorian

Thermomechanical Durability in High I/O BGA Packages / P. Davuluri ; A. Dasgupta ; S. Young

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface / T. P. Ferguson ; J. Qu

Nonlinear-Time-Dependent Analysis of Micro via-In-Pad Substrates for Solder Bumped Flip Chip Applications / S. W. Ricky Lee

Effect of Moisture on Durability of Flip-Chip-on-Board (FCOB) Interconnects / J. H. Okura ; J. F. J. M. Caers

Interfacial versus Cohesive Failure on Underfill-Aluminum Interface: Effects of Interface Roughness / Q. Yao

Damage Mechanics Based Fatigue Life Prediction for 63Sn-37Pb Solder Material / Y. Wei ; C. L. Chow ; M. K. Neilsen ; H. E. Fang

Thermal Aging Effect on the Ball Shear Strength of Pb-Free Solders on a Ceramic Substrate With Pd/Ag Surface Metallization / X. J. Huang ; S.-W. Ricky Lee ; W. S. Tse

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling / P. Sharma

Durability Properties Characterization of SN62PB36AG2 Solder Alloy / P. Haswell

Application of a Novel Flip Chip Solder Joint Inspection System to Chips on an FR-4 Substrate / D. S. Erdahl ; S. Liu ; I. C. Ume

Alternatives to Lead Solder: Views, Concerns, and Issues in Military Electronics and Other Harsh Environments I: Technical Advances in Lead-Free Interconnection Technologies

A Review of Electrically Conductive Adhesive Technology for Use in Surface-Mount Microelectronics / A. J. Rafanelli

Length Scale and Aging Effect on the Mechanical Properties of a 63Sn-37-Pb Solder Alloy / T. J. Lim ; W.-Y. Lu

Thermal Fatigue Life Analysis of PBGA Solder Joints With the Consideration of Damage Evolution / K. Newman ; L. Hu

Research and Technological Advances in Wafer and Electronic Manufacturing

Free Vibration Analysis for Thin Wire of Modern Wiresaw Between Sliced Wafers in Wafer Manufacturing Processes / S. Wei ; I. Kao

Experimental Investigation of Pressure and Velocity on Chemical Mechanical Planarization / Jhy-Cherngng Tsai ; Mingyi Tsai

Optimizing a Lithium Niobate Slicing Process Using ID Saw in Wafer Manufacturing / T. Fang ; D. Jundt ; J. C. Lambropoulos

Analysis of the Interaction Between Thin-Film Fluid Hydrodynamics and Wire Vibration in Wafer Manufacturing Using Wiresaw / Liqun Zhu ; Milind Bhagavat ; Imin Kao

Stress Analysis of Wiresaw Slicing Piezoelectric Materials / F. Yang

Cooling Technique for Outdoor Electronic Enclosures Using Phase Change Materials / H. A. Hadim ; I. Mehmedagic

Characterization of the Performance of Flat Heat Pipes for Electronics Cooling / U. Vadakkan ; S. V. Garimella ; C. B. Sobhan

Analysis of a Thermoelectric Cooler With Non-Uniform Heating / M. J. Ellsworth, Jr. ; R. E. Simons

Refrigeration Cooled Computers: Application and Review / R. R. Schmidt ; R. C. Chu ; D. Agonafer

Mathematical Model for Thermostatic Expansion Valve / Y. Ding ; R. Schmidt

Cooling of a PWB With Irregular Populated Chips / E. Short

Author Index

12th Symposium on Mechanics of Smt and Photonic Structures

Nonuniform Temperature Distribution in Electronic Devices Cooled by Flow in Parallel Microchannels / G. Hetsroni ; Z. Segal ; A. Mosyak

Stress Concentration in a Connectorized Optical Fiber / J. F. Malluck ; W. W. King

Nonlinear Thermal and Mechanical Analysis in the Vibration of a Printed Wiring Board / X. He ; R. Fulton

Key Parameters Affecting Solder Joint Life of Chip Resistors and Chip Capacitors Mounted on Insulated Metal Substrate / N. Sangalli ; D. B. Barker

Thermal-Mechanical Analysis of an NCA Type of Chip-on-Glass Assemblies / H.-C. Cheng ; M.-H. Lee ; K.-N. Chiang ; C.-W. Chang

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