Mechanical microsensors

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Mechanical microsensors / M. Elwenspoek, R. Wiegerink

資料種別:

図書

出版情報:

Berlin : Springer-Verlag, c2001

形態:

x, 295 p. ; 25 cm

シリーズ名:

Microtechnology and MEMS <BA51409718>

著者名:

ISBN:

9783540675822 [3540675825] (: gw)

書誌ID:

BA51428020

子書誌情報

フルテキスト

所蔵情報

他の版・巻

書誌詳細

ISSN:

16158326

注記:

"Physics and Astronomy online library"--Half t.p
Includes bibliographical references (p. [274]-290) and index

主題:

Detectors--Design and construction; Microelectromechanical systems--Design and construction; Micromachining; Silicon; Transducers

言語:

英語

目次情報:

Introduction / 1：

MEMS / 2：

Miniaturisation and Systems / 2.1：

Examples for MEMS / 2.2：

Bubble Jet / 2.2.1：

Actuators / 2.2.2：

Micropumps / 2.2.3：

Small and Large: Scaling / 2.3：

Electromagnetic Forces / 2.3.1：

Coulomb Friction / 2.3.2：

Mechanical Strength / 2.3.3：

Dynamic Properties / 2.3.4：

Available Fabrication Technology / 2.4：

Technologies Based on Lithography / 2.4.1：

Silicon Micromachining / 2.4.1.1：

LIGA / 2.4.1.2：

Miniaturisation of Conventional Technologies / 2.4.2：

Introduction into Silicon Micromachining / 3：

Photolithography / 3.1：

Thin Film Deposition and Doping / 3.2：

Silicon Dioxide / 3.2.1：

Chemical Vapour Deposition / 3.2.2：

Evaporation / 3.2.3：

Sputterdeposition / 3.2.4：

Doping / 3.2.5：

Wet Chemical Etching / 3.3：

Isotropic Etching / 3.3.1：

Anisotropic Etching / 3.3.2：

Etch Stop / 3.3.3：

Waferbonding / 3.4：

Anodic Bonding / 3.4.1：

Silicon Fusion Bonding / 3.4.2：

Plasma Etching / 3.5：

Plasma / 3.5.1：

Anisotropic Plasma Etching Modes / 3.5.2：

Configurations / 3.5.3：

Black Silicon Method / 3.5.4：

Surface Micromachining / 3.6：

Thin Film Stress / 3.6.1：

Sticking / 3.6.2：

Mechanics of Membranes and Beams / 4：

Dynamics of the Mass Spring System / 4.1：

Strings / 4.2：

Beams / 4.3：

Stress and Strain / 4.3.1：

Bending Energy / 4.3.2：

Radius of Curvature / 4.3.3：

Lagrange Function of a Flexible Beam / 4.3.4：

Differential Equation for Beams / 4.3.5：

Boundary Conditions for Beams / 4.3.6：

Examples / 4.3.7：

Mechanical Stability / 4.3.8：

Transversal Vibration of Beams / 4.3.9：

Diaphragms and Membranes / 4.4：

Circular Diaphragms / 4.4.1：

Square Membranes / 4.4.2：

Buckling of Bridges / Appendix 4.1：

Principles of Measuring Mechanical Quantities: Transduction of Deformation / 5：

Metal Strain Gauges / 5.1：

Semiconductor Strain Gauges / 5.2：

Piezoresistive Effect in Single Crystalline Silicon / 5.2.1：

Piezoresistive Effect in Polysilicon Thin Films / 5.2.2：

Transduction from Deformation to Resistance / 5.2.3：

Capacitive Transducers / 5.3：

Electromechanics / 5.3.1：

Diaphragm Pressure Sensors / 5.3.2：

Force and Pressure Sensors / 6：

Force Sensors / 6.1：

Load Cells / 6.1.1：

Pressure Sensors / 6.2：

Piezoresistive Pressure Sensors / 6.2.1：

Capacitive Pressure Sensors / 6.2.2：

Force Compensation Pressure Sensors / 6.2.3：

Resonant Pressure Sensors / 6.2.4：

Miniature Microphones / 6.2.5：

Tactile Imaging Arrays / 6.2.6：

Acceleration and Angular Rate Sensors / 7：

Acceleration Sensors / 7.1：

Bulk Micromachined Accelerometers / 7.1.1：

Surface Micromachined Accelerometers / 7.1.3：

Force Feedback / 7.1.4：

Angular Rate Sensors / 7.2：

Flow sensors / 8：

The Laminar Boundary Layer / 8.1：

The Navier-Stokes Equations / 8.1.1：

Heat Transport / 8.1.2：

Hydrodynamic Boundary Layer / 8.1.3：

Thermal Boundary Layer / 8.1.4：

Skin Friction and Heat Transfer / 8.1.5：

Heat Transport in the Limit of Very Small Reynolds Numbers / 8.2：

Thermal Flow Sensors / 8.3：

Anemometer Type Flow Sensors / 8.3.1：

Two-Wire Anemometers / 8.3.2：

Calorimetric Type Flow Sensors / 8.3.3：

Sound Intensity Sensors - The Microflown / 8.3.4：

Time of Flight Sensors / 8.3.5：

Skin Friction Sensors / 8.4：

"Dry Fluid Flow" Sensors / 8.5：

"Wet Fluid Flow" Sensors / 8.6：

Resonant Sensors / 9：

Basic Principles and Physics / 9.1：

The Differential Equation of a Prismatic Microbridge / 9.1.1：

Solving the Homogeneous, Undamped Problem using Laplace Transforms / 9.1.3：

Solving the Inhomogeneous Problem by Modal Analysis / 9.1.4：

Response to Axial Loads / 9.1.5：

Quality Factor / 9.1.6：

Nonlinear Large-Amplitude Effects / 9.1.7：

Excitation and Detection Mechanisms / 9.2：

Electrostatic Excitation and Capacitive Detection / 9.2.1：

Magnetic Excitation and Detection / 9.2.2：

Piezoelectric Excitation and Detection / 9.2.3：

Electrothermal Excitation and Piezoresistive Detection / 9.2.4：

Optothermal Excitation and Optical Detection / 9.2.5：

Dielectric Excitation and Detection / 9.2.6：

Examples and Applications / 9.3：

Electronic Interfacing / 10：

Piezoresistive Sensors / 10.1：

Wheatstone Bridge Configurations / 10.1.1：

Amplification of the Bridge Output Voltage / 10.1.2：

Noise and Offset / 10.1.3：

Feedback Control Loops / 10.1.4：

Interfacing with Digital Systems / 10.1.5：

Analog-to-Digital Conversion / 10.1.5.1：

Voltage to Frequency Converters / 10.1.5.2：

Capacitive Sensors / 10.2：

Impedance Bridges / 10.2.1：

Capacitance Controlled Oscillators / 10.2.2：

Frequency Dependent Behavior of Resonant Sensors / 10.3：

Realizing an Oscillator / 10.3.2：

One-Port Versus Two-Port Resonators / 10.3.3：

Oscillator Based on One-Port Electrostatically Driven Beam Resonator / 10.3.4：

Oscillator Based on Two-Port Electrodynamically Driven H-shaped Resonator / 10.3.5：

Packaging / 11：

Packaging Techniques / 11.1：

Standard Packages / 11.1.1：

Chip Mounting Methods / 11.1.2：

Wafer Level Packaging

Interconnection Techniques / 11.1.3：

Multichip Modules / 11.1.4：

Encapsulation Processes / 11.1.5：

Stress Reduction / 11.2：

Inertial Sensors / 11.3：

References / 11.5：

Index

Introduction / 1：

MEMS / 2：

Miniaturisation and Systems / 2.1：

Examples for MEMS / 2.2：

Bubble Jet / 2.2.1：

Actuators / 2.2.2：

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