| PFC Emissions Reduction / A.： |
| An Efficient, Highly Reliable Plasma Tool for PFC Abatement / X. Chen ; W. Holber ; M. Peter |
| Litmas Plasma Abatement Long-Term Reliability Test / V. Vartanian ; L. Beu ; T. Stephens ; J. Rivers ; B. Perez ; M. Kiehlbauch ; E. Tonnisand D. Graves |
| Optimization of a C[subscript 2]F[subscript 6] Clean for an Applied Materials' TEOS PECVD Process: Reduced PFC Emissions and Faster Clean Times / A. D. Johnson ; W. R. Entley ; R. N. Vrtis ; J. Langan ; P. Maroulis ; C. M. Chen ; C. T. Chen ; Y. C. Chang ; O. H. Yam |
| Chamber Clean Optimization for Silicon Carbide Films Using C[subscript 3]F[subscript 8] in a Novellus Concept One PECVD System / C. Beatty ; K. Sonti ; J. Williams ; L. Zazzera ; L. Tousignant ; S. Kesari |
| Evaluation of the Applied Materials Remote Clean Technology for Lamp Heated CVD Chambers for Perfluorocompound (PFC) Emissions Reduction / L. Mendicino ; C. Nauert ; J. Flood ; P. T. Brown ; A. Atherton ; T. Nowak ; D. Silvetti |
| Process Emissions Characterization / B.： |
| High Pressure Sampling Mass Spectrometry of Semiconductor Tool Process Emissions / B. Baker ; J. Arnold ; S. Quarmby ; M. Platt |
| Air Monitoring and Odor Elimination in a Semiconductor Photolithography Area / M. Villars ; A. Sevier ; D. Kaczmarik |
| Continuous Real-Time Detection of Molecular Fluorine (F2) Emitted as a By-Product Of CVD and Etch Processes / C. Laush |
| Point of Use Abatement for CVD Precursors and Reaction Products / P. Brown ; K. Reid ; J. Van Gompel |
| FTIR Analysis of a New High K Gate Material for MOCVD Applications / V. Cole |
| Alternative Clean Processes and Water Usage Reduction / C.： |
| Manufacturing Qualification of an All Dry DeVeil Plasma Process / D. Dopp ; L. Mikus ; A. Horn ; R. Bersin ; H. Xu ; M. Boumerzoug |
| EHS Concerns with Ozonated Water Spray Processing / K. McCormack ; K. Barbee |
| An Environmentally Benign BEOL Clean / K. Shrinivasan ; K. Reinhardt ; A. Shimanovich ; P. Sadkowski |
| Reduction of De-ionized Water Usage in Photoresist Stripping Processes / T. Kamal ; D. W. Hess |
| Microbial Control in Ultra-pure Water During Ultra-low Flow Conditions / B. Hoyt ; J. Molloy |
| General Technologies / D.： |
| Addressing the Environment, Safety and Health Challenges of the 1999 International Technology Roadmap for Semiconductors / S. Gibson |
| Risk-Based Evaluation of Bulk Anhydrous Hydrogen Chloride Delivery Alternatives Used in the Semiconductor Industry / P. T. Brow |
| Copper Removal from Chemical Mechanical Polishing Effluent / C. Riley ; J. Filson |
| The Environmental Value Systems (ENV-S) Analysis: Application to CMP Effluent Treatment Options / N. Krishnan ; S. Thurwachter ; P. Sheng ; T. Francis |
| Development and Implementation of an ISO Modeled Environmental, Health and Safety Management System / T. Nasi ; T. McCay ; R. Reblin |
| Safety and Environmental Concerns of CVD Copper Precursors / B. Zorich ; J. Norman ; M. Majors |
| Treatability of Chemical Mechanical Planarization (CMP) Wastewater / B. J. Davis ; S. Sue |
| PFC Emissions Reduction / A.： |
| An Efficient, Highly Reliable Plasma Tool for PFC Abatement / X. Chen ; W. Holber ; M. Peter |
| Litmas Plasma Abatement Long-Term Reliability Test / V. Vartanian ; L. Beu ; T. Stephens ; J. Rivers ; B. Perez ; M. Kiehlbauch ; E. Tonnisand D. Graves |
| Optimization of a C[subscript 2]F[subscript 6] Clean for an Applied Materials' TEOS PECVD Process: Reduced PFC Emissions and Faster Clean Times / A. D. Johnson ; W. R. Entley ; R. N. Vrtis ; J. Langan ; P. Maroulis ; C. M. Chen ; C. T. Chen ; Y. C. Chang ; O. H. Yam |
| Chamber Clean Optimization for Silicon Carbide Films Using C[subscript 3]F[subscript 8] in a Novellus Concept One PECVD System / C. Beatty ; K. Sonti ; J. Williams ; L. Zazzera ; L. Tousignant ; S. Kesari |
| Evaluation of the Applied Materials Remote Clean Technology for Lamp Heated CVD Chambers for Perfluorocompound (PFC) Emissions Reduction / L. Mendicino ; C. Nauert ; J. Flood ; P. T. Brown ; A. Atherton ; T. Nowak ; D. Silvetti |
