Packaging, reliability and manufacturing issues associated with electronic and photonic products : presented at the 2001 ASME International Mechanical Engineering Congress and Exposition, November 11-16, 2001, New York, New York

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Packaging, reliability and manufacturing issues associated with electronic and photonic products : presented at the 2001 ASME International Mechanical Engineering Congress and Exposition, November 11-16, 2001, New York, New York / sponsored by the Electronic and Photonic Packaging Division, ASME ; edited by I. Charles Ume ... [et al.]

資料種別:

図書

出版情報:

New York, N.Y. : American Society of Mechanical Engineers, c2001

形態:

vii, 305 p. ; 28 cm

シリーズ名:

EPP ; vol. 1 <BA6132699X>

著者名:

ISBN:

9780791835654 [0791835650]

書誌ID:

BA61327085

子書誌情報

フルテキスト

所蔵情報

他の版・巻

書誌詳細

注記:

Includes bibliographical references and index

言語:

英語

目次情報:

Thermal and Thermo-Mechanical Issues in Electronic Packaging

Warpage Analysis of Wafers With Film Coating / Hai Ding ; I. Charles Ume ; Cheng Zhang

An Active Radial Countercurrent Heat Sink Driven by a Synthetic Jet Actuator / Jelena Vukasinovic ; Ari Glezer

Vibration-Induced Droplet Atomization (VIDA) for Two-Phase Thermal Management / Bojan Vukasinovic ; Samuel N. Heffington ; Marc K. Smith

Nano- and Micro-Scale Compliant Interconnects for Electronic Packages

Bumpless Build-Up Layer Packaging / Steven N. Towle ; Henning Braunisch ; Chuan Hu ; Richard D. Emery ; Gilroy J. Vandentop

Alternative Compliant Interconnects: Thermo-Mechanical Reliability, Design and Testing / Lunyu Ma ; Qi Zhu ; Suresh Sitaraman

Design Features of Compliant Packages and Their Impact on Reliability / Ilyas Mohammed ; Young-Gon Kim

Compliant Wafer Level Package / Chirag Patel ; Kevin P. Martin ; James D. Meindl

Nano-Micro Scale Characterization of Dielectric Materials / Paul A. Kohl ; Sue Ann Bidstrup Allen

Microtensile Methodology for Mechanical Characterization of Thin Films / Betty H. Yeung ; Bill Lytle ; Vijay Sarihan ; David T. Read ; Yifan Guo

Mechanics Issues at Micro-Scale Modeling of Electronic Packages / Raghuram V. Pucha ; Gnyaneshwar Ramakrishna ; Suresh K. Sitaraman

Thermal Management of Packaging Problems

Miniature Vapor Compression Refrigeration Systems for Active Cooling of High Performance Computers / Ali Heydari ; Kathy Russell

A Mixed Thermal Convection Criteria for a Printed Circuit Board / E. Kehoe ; R. Grimes ; M. Davies

Thermal Analysis of EPAS Power Module / Ram Farhi

Noninvasive Measurements and Computational Modeling of SMT Assemblies / Ryszard J. Pryputniewicz ; David Rosato ; Cosme Furlong

Wafer Electronic Manufacturing in Semiconductor Processing

Silicon Carbide Wafer Polishing With Gas Cluster Ion Beams / V. DiFilippo ; J. A. Bennett ; D. B. Fenner ; J. K. Hirvonen ; L. C. Feldman ; A. Saigal

Equilibrium Elasto-Hydrodynamic Analysis in Wafer Slicing Process Using Wiresaw / Liqun Zhu ; Imin Kao

A Neural-Taguchi Based Quasi Time-Optimal Control Strategy for Chemical-Mechanical Polishing Processes / Gou-Jen Wang ; Meng-Hsian Chou

Experimental Investigation on Chemical-Mechanical Polishing of Wafers With Low-Conductivity Dielectrics / Jhy-Cherng Tsai ; Charles Liu ; Ming-Hsih Tsai ; Bao-Tong Dai

Mechanics of Smt and Photonic Structures

A Methodology for Evaluating the Mechanical Reliability of Alternatives to Tin-Lead Solder Electronic Interconnection Systems (Focus on Electrically Conductive Adhesives) / Anthony J. Rafanelli

Computational and Experimental Study of Thermo-Mechanics in a New Design of a Transceiver for High Speed Telecommunications / Steven A. Weller ; Sam R. Shaw ; William L. Herb

DSC, TMA, DMA, and TGA of Epoxies for Fiber-Optic Transceiver Applications / John Lau ; Steve Erasmus ; Fred Sporon-Fiedler ; Chris Chang

Corrosion Analysis of a Fiber-Optic Transceiver Housing / J. H. Lau ; C. L. Jiaa ; S. J. Erasmus

New Hybrid Methodology for the Development of MEMS Multivariable Sensors / Emily J. Pryputniewicz ; John P. Angelosanto ; Gordon C. Brown

Finite Element Modeling of Processes in Optoelectronic Alignment / Ben Ting ; Vincent P. Manno

Failure Mechanisms and Modeling in High Power Optical Device Packaging: Semiconductor Laser Diodes--A Case Study / Ajit R. Dhamdhere ; W. F. Schmidt ; Ajay P. Malshe ; W. D. Brown ; S. N. Yedave

Computational and Experimental Study of Laser Microwelding Processes for Electronic Packaging / Wei Han

Reliable Low-Cost Flip Chip Interconnections / Z. W. Zhong

Dynamic Characterization of Shape Memory Alloys for Integration With Electronic Packaging / Shivananda P. Mizar

Creep Behavior of Pb-Free Solders / F. Hua ; C. M. Garner ; H. G. Song ; J. W. Morris

Multi-Axial Cyclic and Monotonic Behavior of a 63Sn-37Pb Solder Alloy / T. Jesse Lim ; Wei-Yang Lu

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB) / Shi-Wei Ricky Lee ; Lan Hong Dai

Failure Analysis of Miniature Solder Specimen / Y. Wei ; C. L. Chow ; H. E. Fang ; M. K. Neilsen ; T. J. Lim ; W. Lu

Novel Experimental-Computational Method for Quantitative Applications in Electronic Packaging

Reliability Analysis on the Chaos Induced by the Effect of the Transient Temperature Variation of a Printed Wiring Board / Xiaoling He ; Robert Fulton

Analysis of Thermal Stresses in a Layered Circuit Board / James C. Gerdeen

High Digital Speed Level-2 Interconnections Via a New Microcontact Design / Dariusz R. Pryputniewicz ; Dimitry G. Grabbe

Mechanical Considerations of Shin-Etsu Elastomer as a Z-Axis Interconnect / C. Cox ; M. H. Gordon ; W. Marsh ; G. Bates ; M. Lucas

Reliability of Plastic Package With Partially Exposed Die / Tiao Zhou

Selection of Method for Fatigue Life Prediction Under Random Loading / Amit Awasthi ; Stephen Mckeown ; C. Sahay ; Bahgat Sammakia

Author Index

Thermal and Thermo-Mechanical Issues in Electronic Packaging

Warpage Analysis of Wafers With Film Coating / Hai Ding ; I. Charles Ume ; Cheng Zhang

An Active Radial Countercurrent Heat Sink Driven by a Synthetic Jet Actuator / Jelena Vukasinovic ; Ari Glezer

Vibration-Induced Droplet Atomization (VIDA) for Two-Phase Thermal Management / Bojan Vukasinovic ; Samuel N. Heffington ; Marc K. Smith

Nano- and Micro-Scale Compliant Interconnects for Electronic Packages

Bumpless Build-Up Layer Packaging / Steven N. Towle ; Henning Braunisch ; Chuan Hu ; Richard D. Emery ; Gilroy J. Vandentop

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