Advances in chemical-mechanical polishing : symposium held April 13-15, 2004, San Francisco, California, U.S.A.

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Advances in chemical-mechanical polishing : symposium held April 13-15, 2004, San Francisco, California, U.S.A. / editors, Duane S. Boning ... [et al.]

資料種別:

図書

出版情報:

Warrendale, Pa. : Materials Research Society, c2004

形態:

xi, 292 p. ; 24 cm

シリーズ名:

Materials Research Society symposium proceedings ; v. 816 <BA00013775>

著者名:

ISBN:

9781558997660 [1558997660]

書誌ID:

BA69082866

子書誌情報

フルテキスト

所蔵情報

他の版・巻

書誌詳細

注記:

Includes bibliographical references and indexes

言語:

英語

目次情報:

Preface

Materials Research Society Symposium Proceedings

Copper CMP

Challenges and Rewards of Low-Abrasive Copper CMP: Evaluation and Integration for Single-Damascene Cu/Low-k Interconnects for the 90 nm Node / Christopher L. Borst ; Stanley M. Smith ; Mona Eissa

Investigation of the Influence of Different Copper Slurry Systems on Post CMP Topography Performance / Goetz Springer ; Peter Thieme ; Pierre Klose

Copper CMP Formulation for 65 nm Device Planarization / Gregory T. Stauf ; Karl Boggs ; Peter Wrschka ; Craig Ragaglia ; Michael Darsillo ; Jeffrey F. Roeder ; Mackenzie King ; Jun Liu ; Thomas Baum

Effect of Hydrogen Peroxide on Oxidation of Copper in CMP Slurries Containing Glycine and Cu Sulfate / Tianbao Du ; Arun Vijayakumar ; Vimal Desai

Modified Abrasives Based on Fumed SiO[subscript 2] and Al[subscript 2]O[subscript 3] for the Cu CMP Process / D. Zeidler ; J.W. Bartha ; W. Lortz ; R. Brandes

Novel Pure Organic Particles for Copper CMP at Low Down Force / K. Cheemalapati ; A. Chowdhury ; V. Duvvuru ; Yong Lin ; Kwok Tang ; Guomin Bian ; Lily Yao ; Yuzhuo Li

Effect of Nao-Size Silica Abrasives in Chemical Mechanical Polishing of Copper / Su-Ho Jung ; Rajiv K. Singh

Metal CMP Modeling

A Model of Cu-CMP / Ed Paul ; Vlasta Brusic ; Fred Sun ; Jian Zhang ; Robert Vacassy ; Frank Kaufman

Coherent Chip-Scale Modeling for Copper CMP Pattern Dependence / Hong Cai ; Tae Park ; Duane Boning ; Hyungjun Kim ; Youngsoo Kang ; Sibum Kim ; Jeong-Gun Lee

Planarization Equipment

Polish Profile Control Using Magnetic Control Head / Manabu Tsujimura ; Yu Ishii ; Norio Kimura ; Masahiro Ota

Adaptive Piezo-Controlled Carrier for CMP Processing / Christian-Toralf Weber ; Jurgen Weiser ; Dieter Zeidler ; Johann W. Bartha

Metrological Assessment of the Coefficient of Friction of Various Types of Silica Using the Motor Current During ILD-CMP / Harald Jacobsen ; Eric Stachowiak ; Gerfried Zwicker ; Wolfgang Lortz ; Ralph Brandes

Poster Session

A Study on the Self-Stopping CMP Process for the Planarization of the High Step Height(@step height[greater than sign]1.5 um) Pattern / Kwang-Bok Kim ; Hyo-Jin Lee ; Ki-Hoon Jang ; Joung-Duk Ko ; Kyung-Hyun Kim ; In-Seac Hwang ; Yong-Sun Ko ; Chang-Lyong Song

Modeling of Pattern Density Dependent Pressure Non-Uniformity at a Die Scale for ILD Chemical Mechanical Planarization / Jihong Choi ; David A. Dornfeld

Effect of Abrasive in Cu-CMP Slurry on Global Planarization / Yutaka Nomura ; Hiroshi Ono ; Hiroki Terazaki ; Yasuo Kamigata ; Masato Yoshida

Investigation of Mechanical Integrity and Its Effect on Polishing for Novel Polyurethane Polishing Pad / Parshuram Zantye ; S. Mudhivarthi ; A.K. Sikder ; Ashok Kumar ; S. Ostapenko ; Julie Harmon

Interaction Between Abrasive Particles and Film Surfaces in Low Down Force Cu CMP / Yuchun Wang ; Isaac Zomora ; Joe Hawkins ; Renjie Zhou ; Roy Martinez ; Bin Lu ; Shumin Wang

Effect of Particle Interaction on Agglomeration of Silica-Based CMP Slurries / A. Sorooshian ; R. Ashwani ; H.K. Choi ; M. Moinpour ; A. Oehler ; A. Tregub

Measurement of Electroplated Copper Overburden for Advanced Process Development and Control / Joshua Tower ; Alexei Maznev ; Michael Gostein ; Koichi Otsubo

Polishing Pads

Micro Feature Pad Development and Its Performance in Chemical Mechanical Planarization / Sunghoon Lee

Characterization of CMP Pad Surface Texture and Pad-Wafer Contact / Gregory P. Muldowney ; David B. James

Modeling CMP Transport and Kinetics at the Pad Groove Scale

In Situ Friction and Pad Topography Measurements During CMP / Caprice Gray ; Daniel Apone ; Chris Barns ; Moinpour Monsour ; Sriram Anjur ; Vincent Manno ; Chris Rogers

Metrology of Psiloquest's Application Specific Pads (ASP) for CMP Applications / Parshuram B. Zantye ; Arun K. Sikder ; Yaw Obeng

CMP Corrosion and Cleaning

Influence of Electrochemical Plating Process Parameters on Corrosion of Cu Damascene Interconnects / D. Ernur ; W. Wu ; S.H. Brongersma ; V. Terzieva ; K. Maex

Novel CMP Applications

Advances in the CMP Process on Fixed Abrasive Pads for the Polishing of SOI-Substrates With High Degree of Flatness / Martin Kulawski ; Hannu Luoto ; Kimmo Henttinen ; Ilkka Suni ; Frauke Weimar ; Jari Makinen

Analysis of Nanotopography in Silicon Generated by the Polishing Process / Hiromichi Isogai ; Katsuyoshi Kojima

The Application of Chemical Mechanical Polishing for Nickel Used in MEMS Devices / Kalpathy B. Sundaram

CMP Modeling and Characterization for Polysilicon MEMS Structures / Brian Tang

Planarization Issues in Wafer-Level Three-Dimensional (3D) Integration / J.-Q. Lu ; G. Rajagopalan ; M. Gupta ; T.S. Cale ; R.J. Gutmann

CMP Modeling

Pad Asperity Parameters for CMP Process Simulation / Takafumi Yoshida

Assessment of Planarization Length Variation by the Step-Polish-Response (SPR) Method / Tilo Bormann ; Kathrin Estel

Oxide and STI CMP

Cerium Oxide Abrasives--Observations and Analysis / David R. Evans

Material Removal Mechanisms of Oxide and Nitride CMP With Ceria and Silica-Based Slurries--Analysis of Slurry Particles Pre- and Post-Dielectric CMP / Naga Chandrasekaran

WID Rnit Variation Improvements for HSS STI CMP Process Using Modified Scribe Lane Pattern Design / Hyuk Kwon ; Yong-Soo Choi ; Sang-Hwa Lee ; Geun-Min Choi ; Yong-Wook Song ; Gyu-Han Yoon

Characterizing STI CMP Processes With an STI Test Mask Having Realistic Geometric Shapes / Xiaolin Xie ; Aaron Smith ; Paul Allard ; Neil Patel

Investigation and Control of Chemical and Surface Chemical Effects During Dielectric CMP / J.T. Abiade ; W. Choi ; V. Khosla ; R.K. Singh

Author Index

Subject Index

Preface

Materials Research Society Symposium Proceedings

Copper CMP

Challenges and Rewards of Low-Abrasive Copper CMP: Evaluation and Integration for Single-Damascene Cu/Low-k Interconnects for the 90 nm Node / Christopher L. Borst ; Stanley M. Smith ; Mona Eissa

Investigation of the Influence of Different Copper Slurry Systems on Post CMP Topography Performance / Goetz Springer ; Peter Thieme ; Pierre Klose

Copper CMP Formulation for 65 nm Device Planarization / Gregory T. Stauf ; Karl Boggs ; Peter Wrschka ; Craig Ragaglia ; Michael Darsillo ; Jeffrey F. Roeder ; Mackenzie King ; Jun Liu ; Thomas Baum

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