| Preface |
| The Science and Technology of the Functional Water / M. Toda ; S. Uryuu |
| Single Wafer Cleaning |
| Effective Post-Etch Residue Removal on Low-k Films Using Single Wafer Processing / E. Kesters ; J. Ghekiere ; P. Van Doorne ; G. Vereecke ; P.W. Mertens ; M.M. Heyns |
| Aqueous Single Pass Single Wafer Al/Via Cleaning / S. Verhaverbeke ; C. Beaudry ; P. Boelen |
| Improved Rinsing Efficiency on Post-Etch Residue Wet Clean for Cu/Low-k Damascene Structures / C.K. Chang ; C.F. Tsang ; V. Nguyen ; Q. Zhang ; T.H. Foo |
| Single Wafer Wet Cleaning Based on Short Cycle Time, Ambient Temperature and a Small Amount of Chemical / K.-I. Sano ; A. Izumi |
| Innovative Surface Preparation Solutions for Sub-90 nm Ic Devices / E. Baiya ; J. Rosato ; R. Yalamanchili |
| Predictive Model-Based Control of Critical Oxide Etches for Sub-100 nm Processes in a Single Wafer Wet Processing System / Y. Lu ; M.R. Yalamanchili |
| Non-IPA Wafer Drying Technology for Single-Spin Wet Cleaning / K. Miya ; T. Kishimoto |
| Front End of the Line Cleaning |
| Integration of High-k Gate Dielectrics--Wet Etch Cleaning and Surface Conditioning / S. De Gendt ; S. Beckx ; M. Caymax ; M. Claes ; T. Conard ; A. Delabie ; W. Deweerd ; D. Hellin ; H. Kraus ; B. Onsia ; V. Parishev ; R. Puurunen ; E. Rohr ; J. Snow ; W. Tsai ; S. Van Elshocht ; J. Vertommen ; T. Witters ; M. Heyns |
| Study of the Effect of Silicon Surfce Treatment on Eot in High-k Dielectric Mos Gate Stack / K. Chang ; K. Shanmugasundaram ; D.-O. Lee ; P. Roman J. Shallenberger ; F.-M. Chang ; J. Wang ; R. Beck P. Mumbauer ; R. Grant ; J. Ruzyllo |
| Atomic Layer Deposition of Silicon Nitride Barrier Layer for Self-Aligned Gate Stack / C. Finstad ; A. Muscat |
| Sub-Nanometer High -k Gate Stack Scaling Using the Hf-Last/NH[subscript 3] Anneal Interface / J. Peterson ; J. Barnett ; C. Young ; A. Hou ; J. Gutt ; S. Gopalan ; C.H. Lee ; H.J. Li ; N. Moumen ; N. Chaudhary ; B.H. Lee ; G. Bersuker ; P. Zietzoff ; G.A. Brown ; P. Lysaght ; M. Gardner ; R.W. Murto ; H. Huff |
| Improvements in Advanced Gate Oxide Electrical Performance by the Use of an Ozonated Water Clean Rpocess / D. Riley |
| Effect of Rie Sequence and Post-Rie Surface Processing on the Reliability of Gate Oxide in a Trench / T. Grebs ; R. Ridley ; C.-T. Wu ; R. Agarwal ; J. Mytych ; W. Dimachkie ; G. Dolny ; J. Michalowicz |
| Minimizing Oxide Loss in Immersion SC-1 Process / J. Butterbaugh ; S. Loper ; T. Wagener |
| Performance of an Advanced Front of the Line Clean Compared to the Process of Record Clean in a Manufacturing Environment / R. Novak ; I. Kashkoush ; J. Nolan ; J. Hunter ; J. Straight |
| The Mechanism of Poly-Si Etching During Poly/W Gate Cleaning by Fluorine Based Cleaning Solution / S.Y. Kim ; S.J. Choi ; C.K. Hong ; W.S. Han ; J.T. Moon |
| Physical and Chemical Methods of Particle Removal |
| Mechanisms of Particle Removal During Brush Scrubber Cleaning / K. Xu ; R. Vos ; P. Mertens ; C. Vinckier ; J. Fransaer |
| Evaluation of Megasonic Cleaning Systems for Particle Removal Efficiency and Damaging / F. Holsteyns ; J. Veltens ; M. Lux ; S. Arnatus ; K. Kenis |
| Mechanical Resistance of Fine Microstructures Related to Particle Cleaning Mechanisms / F. Tardif ; O. Raccurt ; J.C. Barbe ; F. De Crecy ; P. Besson ; A. Danel |
| Evaluation of Megasonic Cleaning Processes / A. Riskin ; A. Maes |
| Study of the Cleaning Control Using a Megahertz Nozzle Sound Pressure Monitor System for Single-Plate Spin Cleaners / H. Fujita ; N. Hayamizu ; T. Goshizono ; N. Sakurai |
| Experimental Validation of a Science-Based Undercut Removal Model for the Cleaning of Micron-Scale Particles from Surfaces / G. Kumar ; S. Beaudoin |
| Resonance Damage of Semiconductors by Acoustic Excitation / K. Christenson |
| Substrate Damage-Free Laser Shock Cleaning of Particles / J.G. Park ; A. Busnaina ; J.M. Lee ; S.Y. You |
| Effect of Surfactants on Particle Contamination of Silicon Surface in HF Solutions / T. Vehmas ; H. Ritala ; O. Anttila |
| Supercritical, Cryogenic, and Dry Cleaning |
| In Situ Process for Periodic Cleaning of Low Temperature Nitride Furnaces / D. Foster ; R. Herring ; J. Ellenberg ; A. Johnson ; C. Hartz |
| Making Supercritical Co[subscript 2] Cleaning Work: Proper Selection of Co-Solvents and Other Issues / A. Sehgal |
| Chemical Additive Formulations for Silicon Surface Cleaning in Supercritical Carbon Dioxide / M. Korzenski ; C. Xu ; T. Baum ; K. Saga ; H. Kuniyasu ; T. Hattori |
| Surfactant Enabled Supercritical Co[subscript 2] Cleaning Processes for Beol Applications: Post-Barrier Breakthrough / J. DeYoung ; S. Gross ; M. Wagner ; Z. Hatcher ; C. Ma |
| Co[subscript 2]--Expanded Liquids as Alternatives to Conventional Solvents for Resist and Residue Removal / M. Spuller ; D. Hess |
| Photoresist Stripping Using Supercritical Co[subscript 2]--Based Processes / V. Perrut ; C. Millet ; J. Daviot ; M. Rignon |
| Post-Etch Cleaning of 300 mm Dual Damascene Low-k Dielectric Structures Using Supercritical Co[subscript 2] / R.B. Turkot, Jr. ; V.S. RamachandraRao ; S.A. Iyer ; S.C. Clark |
| Impact of Phase Behavior on Photresist Removal Using Co[subscript 2] Based Mixtures / G. Levitin ; S. Myneni |
| Copper Low-k Contaminantion and Post Etch Residues Removal Using Supercritical Co[subscript 2]-Based Processes / L. Broussous ; O. Renault |
| Water Removal and Repair of Porous Ultra-Low k Films Using Supercritical Co[subscript 2] / B. Xie |
| Cleaning of Fragile Fine Structurers With Cryogenic Nitrogen Aerosols / H. Saito ; A. Munakata ; D. Ichishima ; T. Yamanishi ; A. Okamoto |
| Post-CMP Cleaning |
| Advanced Front end of the Line Clean for Post-CMP Processes / T. Nolan ; D. Nemeth |
| Low Carbon Contamination and Water Mark Free Post-CMP Cleaning of Hydrophobic Osg Dielectrics / K. Bartosh ; E. Brown ; S. Naghshineh ; D. Peters ; E. Walker |
| Adhesion and Removal of Silica and Alumina Slurry Particles During Cu CMP Process / J. Park ; A.A. Busnaina |
| Post-Copper CMP Cleaning Galvanic Phenomenon Investigated by Eis / C. Gabrielli ; E. Ostermann ; H. Perrot ; S. Mege |
| Aqueous Cryogenically Enhanced Post-Copper CMP Cleaning / S. Banerjee ; A. Via ; S. Joshi ; J. Eklund |
| Organic and Metal Contaminant Removal |
| Characterizing Etch Residue Removal From Low-k Ild Structures Using Aqueous and Non-Aqueous Chemistries / J. Moore ; C. Meuchel |
| Reversing of Silicon Surface Aging by Lamp Cleaning / J. Shallenberger |
| Advanced Photo Resist Removal Using O[subscript 3] and Moist Upw in Semiconductor Production / G. Philit ; L. von Aswege ; M. Madore ; K. Wolke ; M.-C. Clech ; E. Asselin-Degrange ; A. Chabli ; D. Louis |
| Cleaning Chemistry with Complexing Agents (CAs): Ca Degradation Monitoring by UV/VIS Spectroscopy / O. Doll ; B. Kolbesen |
| Additive Technologies for Sub 100 nm Device Cleaning / H. Morinaga ; A. Itou ; H. Mochizuki ; M. Ikemoto |
| Degradation of Oxide Properties Caused by Low-Level Metallic Contamination / A. Hoff ; E. Oborina ; S. Aravamudhan ; A. Isti |
| Cleaning Chemistry with Complexing Agents (CAs): Decomposition of CAs in Hydrogen Peroxide and Apm Studied with Hplc / S. Metzger ; B.O. Kolbesen |
| Cleaning of Metal Gate Stacks for the Sub 90 nm Technology Node / K. Vermeyen ; W. Fyen ; F. Kovacs |
| Passivation of Aluminum and Aluminum Copper Alloys in Aqueous Acid / I. Rink ; M. Knotter |
| Behaviour of Aluminum in Ozonated Water, optical and Electrochemical Study / A. Pehkonen ; K. Solehmainen ; L. Gronberg |
| Influence of Aluminum Bond Pad Suraface Condition on Probe Ability / K. Gunturu ; C. Hatcher ; K. Burnside ; T. Corsetti ; R. Lappan ; J. Prasad |
| Open Circuit and Galvanostatic Behavior of Copper Oxidized and Reduced in Various Solutions / M. Hughes |
| Author Index |
| Subject Index |
| Preface |
| The Science and Technology of the Functional Water / M. Toda ; S. Uryuu |
| Single Wafer Cleaning |
| Effective Post-Etch Residue Removal on Low-k Films Using Single Wafer Processing / E. Kesters ; J. Ghekiere ; P. Van Doorne ; G. Vereecke ; P.W. Mertens ; M.M. Heyns |
| Aqueous Single Pass Single Wafer Al/Via Cleaning / S. Verhaverbeke ; C. Beaudry ; P. Boelen |
| Improved Rinsing Efficiency on Post-Etch Residue Wet Clean for Cu/Low-k Damascene Structures / C.K. Chang ; C.F. Tsang ; V. Nguyen ; Q. Zhang ; T.H. Foo |
図書
Cleaning and surface conditioning technology in semiconductor device manufacturing 10 (: CD-ROM)