Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.

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Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C. / sponsored by the Electronic and Photonic Packaging Division, ASME ; organized by Ricky Lee ... [et al.]

資料種別:

図書

出版情報:

New York, N.Y. : American Society of Mechanical Engineers, c2003

形態:

xi, 893 p. ; 28 cm

シリーズ名:

EPP ; v. 3 <BA6132699X>

著者名:

ISBN:

9780791837146 [0791837149]

書誌ID:

BA75359534

子書誌情報

フルテキスト

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書誌詳細

注記:	Includes bibliographical references and index
主題:	Electronic packaging--Congresses; Integrated circuits--Wafer-scale integration--Congresses; Microelectromechanical systems--Congresses; Microelectronic packaging--Congresses; Nanotechnology--Congresses; Photonics--Congresses; Surface mount technology--Congresses
言語:	英語

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