Design, test, integration and packaging of MEMS/MOEMS 2003 : DTIP 2003 : 5-7 May, 2003, Cannes, France | 東京工業大学附属図書館蔵書検索

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Design, test, integration and packaging of MEMS/MOEMS 2003 : DTIP 2003 : 5-7 May, 2003, Cannes, France / Keren Bergman ... [et al.] chairs/editors ; sponsored by CNRS-INPG-UJF ... [et al.]

資料種別:

図書

出版情報:

Piscataway, N.J. : IEEE, c2003

形態:

xi, 411 p. ; 28 cm

著者名:

ISBN:

9780780370661 [078037066X]

書誌ID:

BA77386243

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書誌詳細

その他の標題:	DTIP 2003
注記:	"IEEE Catalog Number 03EX713"--T.p. verso "2003 proceedings, Fifth Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS"--T.p. verso Includes bibliographical references and partial author index
主題:	Microelectromechanical systems--Congresses; Microelectronic packaging--Congresses; Micromachining--Congresses; Optoelectronic devices--Congresses
言語:	英語

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