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Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A. / editors, Ting Y. Tsui ... [et al.]

資料種別:
図書
出版情報:
Warrendale, Pa. : Materials Research Society, c2006
形態:
xvii, 462 p. ; 24 cm
シリーズ名:
Materials Research Society symposium proceedings ; v. 914 <BA00013775>
著者名:
書誌ID:
BA78618898
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