Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A. | 東京工業大学附属図書館蔵書検索

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Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A. / editors, Ting Y. Tsui ... [et al.]

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図書

出版情報:

Warrendale, Pa. : Materials Research Society, c2006

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xvii, 462 p. ; 24 cm

シリーズ名:

Materials Research Society symposium proceedings ; v. 914 <BA00013775>

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書誌ID:

BA78618898

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注記:	"... Symposium F, "Materials, Technology and Reliability of Low-k Dielectrics and Cooper Interconnects," held April 18-21 at the 2006 MRS Spring Meeting in San Francisco, California ..."--Pref Includes bibliographical references and indexes
主題:	Dielectric films--Congresses; Integrated circuits--Materials--Congresses; Integrated circuits--Reliability--Congresses; Semiconductors--Junctions--Congresses; Semiconductors--Materials--Congresses
言語:	英語

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