Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA | 東京科学大学図書館　蔵書検索（大岡山図書館、すずかけ台図書館）

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Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA / [editors, G. S. Mathad ... [et al.]]

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図書

出版情報:

Pennington, N.J. : Electrochemical Society, c2006

形態:

186 p. ; 24 cm

シリーズ名:

ECS transactions ; vol. 1, no. 11 <BA78566502>

著者名:

ISBN:

9781566774994 [1566774993]

書誌ID:

BA81203303

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書誌詳細

注記:	"Sponsoring Divisions: Dielectric Science and Technology, Electronics and Photonics, Electrodeposition." Includes bibliographical references and indexes
主題:	Copper--Congresses; Dielectric films--Congresses; Electroplating--Congresses; Integrated circuits--Materials--Congresses
言語:	英語

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