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Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA / [editors, G. S. Mathad ... [et al.]]

資料種別:
図書
出版情報:
Pennington, N.J. : Electrochemical Society, c2006
形態:
186 p. ; 24 cm
シリーズ名:
ECS transactions ; vol. 1, no. 11 <BA78566502>
著者名:
ISBN:
9781566774994 [1566774993]
書誌ID:
BA81203303
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