Thermal deformation in machine tools

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Thermal deformation in machine tools / edited by Yoshimi Ito

資料種別:: 図書
出版情報:: New York : McGraw-Hill, c2010
形態:: xx, 214 p. ; 24 cm
著者名:: 伊東, 誼(1940-) <DA00472269>
ISBN:: 9780071635172 [0071635173]
書誌ID:: BB03035920

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注記:

Includes bibliographical references and index

著者名ヨミ:

イトウ, ヨシミ

主題:

Machine-tools--Materials; Metals--Ductility; Metals--Effect of temperature on; Thermal stresses

言語:

英語

目次情報:

Preface

Abbreviations

Nomenclature

Table for Conversation

Fundamentals in Design of Structural Body Components / 1：

Necessities and Importance of Lightweighted Structure in Reduction of Thermal Deformation-Discussion Using Mathematical Models / 1.1：

First-hand View for Lightweighted Structures with High Stiffness and Damping in Practice / 1.2：

Axi-symmetrical Configuration-Portal Column (Column of Twin-Pillar Type) / 1.2.1：

Placement and Allocation of Structural Configuration Entities / 1.2.2：

References

What Is Thermal Deformation? / 2：

General Behavior of Thermal Deformation / 2.1：

Estimation of Heat Sources and Their Magnitudes / 2.2：

Estimation of Heat Source Position / 2.2.1：

Estimation of Magnitude of Heat Generation / 2.2.2：

Estimation of Thermal Deformation of Machine Tools / 2.3：

Estimation of Thermal Deformation in General / 2.3.1：

Thermal Deformation Caused by Inner Heat Sources / 2.3.2：

Thermal Deformation Caused by Both Inner and Outer Heat Sources / 2.3.3：

Heat Sources Generated by Chips and Their Dissipation / 2.4：

Mathematical Model of Chips / 2.4.1：

Thermal Properties of Chips-Equivalent Thermal Conductivity and Contact Resistance / 2.4.2：

An Example of Heat Transfer from Piled Chips to Machine Tool Structure / 2.4.3：

Dissipation of Chips / 2.4.4：

Future Perspectives in Research and Development for Heat Sources and Dissipation / 2.5：

Structural Materials and Design for Preferable Thermal Stability / 3：

Remedies Concerning Raw Materials for Structural Body Components / 3.1：

Concrete / 3.1.1：

Painting and Coating Materials / 3.1.2：

New Materials / 3.1.3：

Remedies Concerning Structural Configurations and Plural-Spindle Systems / 3.2：

Non-Sensitive Structure / 3.2.1：

Non-Constraint Structure / 3.2.2：

Deformation Minimization Structure / 3.2.3：

Plural-Spindle Systems-Twin-Spindle Configuration Including Spindle-over-Spindle Type / 3.2.4：

Future Perspectives in Research and Development for Structural Configuration to Minimize Thermal Deformation / 3.3：

Two-Layered Spindle with Independent Rotating Function / 3.3.1：

Selective Modular Design for Advanced Quinaxial-Controlled MC with Turning Function / 3.3.2：

Various Remedies for Reduction of Thermal Deformation / 4：

Thermal Deformations and Effective Remedies / 4.1：

Classification of Remedies for Reduction of Thermal Deformation / 4.2：

Separation of Heat Sources / 4.2.1：

Reduction of Generated Heat / 4.2.2：

Equalization of Temperature Distribution / 4.2.3：

Compensation of Thermal Deformations / 4.2.4：

Innovative Remedies for Minimizing Thermal Deformation in the Near Future / 4.3：

Appendix

Optimization of Structural Design / A.1：

Finite Element Analysis for Thermal Behavior / 5：

Numerical Computation for Thermal Problems in General / 5.1：

Introduction / 5.1.1：

Finite Element Method / 5.1.2：

Finite Differences Method / 5.1.3：

Decision Making for the Selection of Methods / 5.1.4：

Procedure for Thermal Finite Element Analysis / 5.2：

Discretisation / 5.2.1：

Materials / 5.2.3：

Assembling Components to an Entire Machine Tool Model / 5.2.4：

Boundary Conditions / 5.2.5：

Loadcases / 5.2.6：

Linear and Non-Linear Thermal Computation / 5.2.7：

Determination of Boundary Conditions / 5.3：

Convection Heat Transfer Coefficients / 5.3.1：

Emission Coefficients and View Factors / 5.3.3：

Heat Sources and Sinks / 5.3.4：

Thermomechanical Simulation Process / 5.4：

Serial Processing / 5.4.1：

Coupled Processing / 5.4.3：

Future Perspectives in Research and Development for Thermal FEA / 5.5：

Engineering Computation for Thermal Behavior and Thermal Performance Test / 6：

Tank Model / 6.1：

Bond Graph Simulation to Estimate Thermal Behavior within High-Voltage and NC Controllers / 6.2：

Thermal Performance Testing / 6.3：

Index

Preface

Abbreviations

Nomenclature

Table for Conversation

Fundamentals in Design of Structural Body Components / 1：

Necessities and Importance of Lightweighted Structure in Reduction of Thermal Deformation-Discussion Using Mathematical Models / 1.1：

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