11th International Congress Molded Interconnect Devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg/Fuerth, Germany

>> Google Books

所蔵情報QRコード

11th International Congress Molded Interconnect Devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg/Fuerth, Germany / edited by Jörg Franke ... [et al.]

資料種別:

図書

出版情報:

Pfaffikon : Trans Tech Publications, c2014

形態:

x, 124 p. ; 24 cm

シリーズ名:

Advanced materials research ; v. 1038 <BA24926058>

著者名:

ISBN:

9783038352525 [3038352527] (: pbk)

書誌ID:

BB18508935

子書誌情報

フルテキスト

所蔵情報

他の版・巻

書誌詳細

その他の標題:

11th International Congress Molded Interconnect Devices : scientific proceedings : 3-D MID

注記:

Includes bibliographical references and indexes
Other editors: Thomas Kuhn, Albert Birkicht and Andreas Pojtinger

言語:

英語

目次情報:

Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices / Thomas Schierbaum; JÃ¼rgen Gausemeier; Roman Dumitrescu

Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools / Jochen Zeitler; Bernhard GÃ¶tze; Christian Fischer; JÃ¶rg Franke

Optimized Process Sequences for Prototyping of Molded Interconnect Devices / Christoph JÃ¼rgenhake; Christian Fechtelpeter; Roman Dumitrescu; Daniel Heidsiek

Integration of Functional Circuits into FDM Parts / Alissa Wild

Printing of Functional Structures on Molded 3D Devices / Bernhard Polzinger; Vladimir Matic; Laura Liedtke; JÃ¼rgen Keck; Daniel Hera; Thomas GÃ¼nther; Wolfgang Eberhardt; Heinz KÃ¼ck

Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing / RenÃ© Schramm; Johannes HÃ¶rber; Christoph Dold; JÃ¶rg Franke

Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing / Oleksandr Kravchuk; Kristina Grunewald; Joachim Bahr; Florian Hofmann; Marcus Reichenberger

Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing / K. Cheval; J. Coulm; S. Gout; Y. Layouni; P. Lombard; D. Leonard; F. Bessueille; V. Semet; Michel Cabrera

Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz / Quang Huy Dao; Aline Friedrich; Bernd Geck

Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray Method / Min Chieh Chou; Tune Hune Kao; Meng Chi Huang; Wen Hua Zhang; Wei Yu Li; Tzi Huei Lai

Experimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography / Bernd Niese; Philipp Amend; Uwe Urmoneit; Stephan Roth; Michael Schmidt

MID Fabricated by Ultrasonic Processing / Werner Karl Schomburg; Ji Li; Sijie Liao; Christof Gerhardy; Johannes Sackmann

Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation / Arnd Buschhaus; JÃ¶rg Franke

Study of MID Technologies for Automotive Lighting and Light Signaling Devices / Franco Marcori; M. Antonipieri; I. di Vora; S. Padovani; I. Riolino

Design and Solder Process Optimization in MID Technology for High Power Applications / Aarief Syed-Khaja; JÃ¶rg Franke

Hot Pin Pull Method - New Test Procedure for the Adhesion Measurement for 3D-MID / Christian Goth; Thomas Kuhn; Gerald Gion; JÃ¶rg Franke

Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools / Jochen Zeitler; Bernhard GÃ¶tze; Christian Fischer; JÃ¶rg Franke

Optimized Process Sequences for Prototyping of Molded Interconnect Devices / Christoph JÃ¼rgenhake; Christian Fechtelpeter; Roman Dumitrescu; Daniel Heidsiek

Integration of Functional Circuits into FDM Parts / Alissa Wild

Printing of Functional Structures on Molded 3D Devices / Bernhard Polzinger; Vladimir Matic; Laura Liedtke; JÃ¼rgen Keck; Daniel Hera; Thomas GÃ¼nther; Wolfgang Eberhardt; Heinz KÃ¼ck

Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing / RenÃ© Schramm; Johannes HÃ¶rber; Christoph Dold; JÃ¶rg Franke

続きを見る

東工大ブックレビュー

類似資料:

1 図書 Green factory bavaria colloquium 2014 : selected, peer reviewed papers from the 1st Green Factory Colloquium, September 30-October 1, 2014, Nuremberg, Germany (: pbk) Green Factory Colloquium, Franke, Jörg, Kreitlein, Sven Trans Tech Publications	7 電子ブック 2016 12th International Congress Molded Interconnect Devices (MID) IEEE Electronic Library (IEL) Conference Proceedings, IEEE
2 図書 WGP Congress 2014 : progress in production engineering : selected, peer reviewed papers from the 2014 WGP Congress, September 9-10, 2014, Erlangen, Germany (: pbk) WGP Congress, Merklein, Marion, Franke, Jörg, Hagenah, Hinnerk Trans Tech Publications	8 電子ブック 2021 14th International Congress Molded Interconnect Devices (MID) IEEE Electronic Library (IEL) Conference Proceedings, IEEE
3 図書 Robotics and automated production lines : selected, peer reviewed papers from the 1st MHI Colloquium, February 24-25, 2016, Hamburg, Germany (: pbk) MHI Colloquium, Schüppstuhl, Thorsten, Tracht, Kirsten, Franke, Jörg Trans Tech Publications	9 図書 WGP Congress 2013 : progress in production engineering : selected, peer reviewed papers from the 2013 WGP Congress, July 22-23, 2013, Erlangen, Germany (: pbk) WGP Congress, Merklein, Marion, Franke, Jörg, Hagenah, Hinnerk, German academic society for production engineering Trans Tech Publications
4 図書 Energy efficiency in strategy of sustainable production IV : 5th Green Factory Bavaria Colloquium : selected, peer reviewed papers from the 5th Green Factory … (: pbk) Green Factory Bavaria Colloquium, Franke, Jörg, Scholz, Michael, Höft, Annika Trans Tech Publications	10 図書 11th International Fatigue Congress : selected, peer reviewed papers from the 11th International Fatigue Congress 2014, March 2-7, 2014, Melbourne, Australia (: [set] ; Part 1 ; Part 2) International Fatigue Congress, Clark, Graham, Wang, Chun H. Trans Tech Publications
5 電子ジャーナル Congress Molded Interconnect Devices (MID), 2016 12th International IEEE Electronic Library (IEL) Conference Series, IEEE	11 図書 Advances in civil engineering and transportation IV : selected, peer reviewed papers from the 4th International Conference on Civil Engineering and … (: [set] - Part 3) International Conference on Civil Engineering and Transportation, Zhang, Xiangdong, Zhang, Bin Trans Tech Publications
6 電子ブック 2018 13th International Congress Molded Interconnect Devices (MID) IEEE Electronic Library (IEL) Conference Proceedings, IEEE	12 図書 Advances in civil structures IV : selected, peer reviewed papers from the 4th International Conference on Civil, Architecture and Building Materials (CEABM … (: [set] ; Part 1 ; Part 2) International Conference on Civil, Architecture and Building Materials, Chen, Chaohe, Li, Guangfan, Shen, Qizhong, … Trans Tech Publications