Preface |
Fabrication / Part I: |
Introduction / Chapter 1: |
What are MEMS? / 1.1: |
Why MEMS? / 1.2: |
Low cost, redundancy and disposability / 1.2.1: |
Favorable scalings / 1.2.2: |
How are MEMS made? / 1.3: |
Roadmap and perspective / 1.4: |
Essay: The Role of Surface to Volume Atoms as Magnetic Devices Miniaturize |
The substrate and adding material to it / Chapter 2: |
The silicon substrate / 2.1: |
Silicon growth / 2.2.1: |
It's a crystal / 2.2.2: |
Miller indices / 2.2.3: |
It's a semiconductor / 2.2.4: |
Additive technique: Oxidation / 2.3: |
Growing an oxide layer / 2.3.1: |
Oxidation kinetics / 2.3.2: |
Additive technique: Physical vapor deposition / 2.4: |
Vacuum fundamentals / 2.4.1: |
Thermal evaporation / 2.4.2: |
Sputtering / 2.4.3: |
Other additive techniques / 2.5: |
Chemical vapor deposition / 2.5.1: |
Electrodeposition / 2.5.2: |
Spin casting / 2.5.3: |
Wafer bonding / 2.5.4: |
Essay: Silicon Ingot Manufacturing |
Creating and transferring patterns-Photolithography / Chapter 3: |
Keeping it clean / 3.1: |
Photoresist / 3.3: |
Positive resist / 3.3.1: |
Negative resist / 3.3.2: |
Working with resist / 3.4: |
Applying photoresist / 3.4.1: |
Exposure and pattern transfer / 3.4.2: |
Development and post-treatment / 3.4.3: |
Masks / 3.5: |
Resolution / 3.6: |
Resolution in contact and proximity printing / 3.6.1: |
Resolution in projection printing / 3.6.2: |
Sensitivity and resist profiles / 3.6.3: |
Modeling of resist profiles / 3.6.4: |
Photolithography resolution enhancement technology / 3.6.5: |
Mask alignment / 3.6.6: |
Permanent resists / 3.7: |
Essay: Photolithography-Past, Present and Future |
Creating structures-Micromachining / Chapter 4: |
Bulk micromachining processes / 4.1: |
Wet chemical etching / 4.2.1: |
Dry etching / 4.2.2: |
Surface micromachining / 4.3: |
Surface micromachining processes / 4.3.1: |
Problems with surface micromachining / 4.3.2: |
Lift-off / 4.3.3: |
Process integration / 4.4: |
A surface micromachining example / 4.4.1: |
Designing a good MEMS process flow / 4.4.2: |
Last thoughts / 4.4.3: |
Essay: Introduction to MEMS Packaging |
Solid mechanics / Chapter 5: |
Fundamentals of solid mechanics / 5.1: |
Stress / 5.2.1: |
Strain / 5.2.2: |
Elasticity / 5.2.3: |
Special cases / 5.2.4: |
Non-isotropic materials / 5.2.5: |
Thermal strain / 5.2.6: |
Properties of thin films / 5.3: |
Adhesion / 5.3.1: |
Stress in thin films / 5.3.2: |
Peel forces / 5.3.3: |
Applications / Part II: |
Thinking about modeling / Chapter 6: |
What is modeling? / 6.1: |
Units / 6.2: |
The input-output concept / 6.3: |
Physical variables and notation / 6.4: |
Preface to the modeling chapters / 6.5: |
MEMS transducers-An overview of how they work / Chapter 7: |
What is a transducer? / 7.1: |
Distinguishing between sensors and actuators / 7.2: |
Response characteristics of transducers / 7.3: |
Static response characteristics / 7.3.1: |
Dynamic performance characteristics / 7.3.2: |
MEMS sensors: principles of operation / 7.4: |
Resistive sensing / 7.4.1: |
Capacitive sensing / 7.4.2: |
Piezoelectric sensing / 7.4.3: |
Resonant sensing / 7.4.4: |
Thermoelectric sensing / 7.4.5: |
Magnetic sensing / 7.4.6: |
MEMS actuators: principles of operation / 7.5: |
Capacitive actuation / 7.5.1: |
Piezoelectric actuation / 7.5.2: |
Thermo-mechanical actuation / 7.5.3: |
Thermo-electric cooling / 7.5.4: |
Magnetic actuation / 7.5.5: |
Signal conditioning / 7.6: |
A quick look at two applications / 7.7: |
RF applications / 7.7.1: |
Optical applications / 7.7.2: |
Piezoresistive transducers / Chapter 8: |
Modeling piezoresistive transducers / 8.1: |
Bridge analysis / 8.2.1: |
Relating electrical resistance to mechanical strain / 8.2.2: |
Device case study: Piezoresistive pressure sensor / 8.3: |
Capacitive transducers / Chapter 9: |
Capacitor fundamentals / 9.1: |
Fixed-capacitance capacitor / 9.2.1: |
Variable-capacitance capacitor / 9.2.2: |
An overview of capacitive sensors and actuators / 9.2.3: |
Modeling a capacitive sensor / 9.3: |
Capacitive half-bridge / 9.3.1: |
Conditioning the signal from the half-bridge / 9.3.2: |
Mechanical subsystem / 9.3.3: |
Device case study: Capacitive accelerometer / 9.4: |
Piezoelectric transducers / Chapter 10: |
Modeling piezoelectric materials / 10.1: |
Mechanical modeling of beams and plates / 10.3: |
Distributed parameter modeling / 10.3.1: |
Statics / 10.3.2: |
Bending in beams / 10.3.3: |
Bending in plates / 10.3.4: |
Case study: Cantilever piezoelectric actuator / 10.4: |
Thermal transducers / Chapter 11: |
Basic heat transfer / 11.1: |
Conduction / 11.2.1: |
Convection / 11.2.2: |
Radiation / 11.2.3: |
Case study: Hot-arm actuator / 11.3: |
Lumped element model / 11.3.1: |
Distributed parameter model / 11.3.2: |
FEA model / 11.3.3: |
Essay: Effect of Scale on Thermal Properties |
Introduction to microfluidics / Chapter 12: |
Basics of fluid mechanics / 12.1: |
Viscosity and flow regimes / 12.2.1: |
Entrance lengths / 12.2.2: |
Basic equations of fluid mechanics / 12.3: |
Conservation of mass / 12.3.1: |
Conservation of linear momentum / 12.3.2: |
Conservation equations at a point: Continuity and Navier-Stokes equations / 12.3.3: |
Some solutions to the Navier-Stokes equations / 12.4: |
Couette flow / 12.4.1: |
Poiseuille flow / 12.4.2: |
Electro-osmotic flow / 12.5: |
Electrostatics / 12.5.1: |
Ionic double layers / 12.5.2: |
Navier-Stokes with a constant electric field / 12.5.3: |
Electrophoretic separation / 12.6: |
Essay: Detection Schemes Employed in Microfluidic Devices for Chemical Analysis |
Microfabrication laboratories / Part III: |
Hot-arm actuator as a hands-on case study / Chapter 13: |
Overview of fabrication of hot-arm actuators / 13.2: |
Cleanroom safety and etiquette / 13.3: |
Experiments / 13.4: |
Wet oxidation of a silicon wafer / Experiment 1: |
Photolithography of sacrificial layer / Experiment 2: |
Depositing metal contacts with evaporation / Experiment 3: |
Wet chemical etching of aluminum / Experiment 4: |
Plasma ash release / Experiment 5: |
Characterization of hot-arm actuators / Experiment 6: |
Notation / Appendix A: |
Periodic table of the elements / Appendix B: |
The complimentary error function / Appendix C: |
Color chart for thermally grown silicon dioxide / Appendix D: |
Glossary |
Subject Index |
Preface |
Fabrication / Part I: |
Introduction / Chapter 1: |