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1.

図書

図書
International Institute of Refrigeration. Commission B2 ; International Institute of Refrigeration. Commission C2 ; International Institute of Refrigeration. Commission E2
出版情報: Buenos Aires : Its Organizing Committee, 1992  364 p. ; 25 cm
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2.

図書

図書
editors, Hisham Z. Massoud ... [et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c2000  xiv, 539 p. ; 27 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2000-2
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3.

図書

図書
editors, Hisham Z. Massoud, Edward H. Poindexter, C. Robert Helms
出版情報: Pennington, NJ : Electrochemical Society, c1996  xv, 780 p. ; 27 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 96-1
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4.

図書

図書
edited by Ernst-Rüdiger Olderog
出版情報: Amsterdam ; New York : Elsevier, 1994  x, 592 p. ; 23 cm
シリーズ名: IFIP transactions ; A . Computer science and technology ; 56
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5.

図書

図書
issued by International Institute of Refrigeration ; [editor, Kostadin Fikiin] = edité par Institut International du Froid
出版情報: Paris : Institut International du Froid, c2000  701 p. ; 24 cm
シリーズ名: Science et technique du froid = Refrigeration science and technology ; 1998-6
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6.

図書

図書
International Institute of Refrigeration
出版情報: Paris, France : Institut international du froid (International Institute of Refrigeration), 1990  871 p. ; 24 cm
シリーズ名: Science et technique du froid = Refrigeration science and technology ; 1990-4
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7.

図書

図書
International Institute of Refrigeration. Commission B1
出版情報: Paris, France : Institut international du froid, [1988]  409 p. ; 24 cm
シリーズ名: Science et technique du froid = Refrigeration science and technology ; 1988-1
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8.

図書

図書
E2S2-CREATE and AIChE Waste Management Conference ; American Institute of Chemical Engineers ; E2S2-CREATE
出版情報: New York : AIChE , Red Hook, NY : Printed from e-media with permission by Curran Associates, 2021, c2019  62 p. ; 28 cm
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9.

図書

図書
édité par Institut international du froid = issued for International Institute of Refrigeration
出版情報: Paris, France : Institut International du Froid, [1994]  372 p. ; 24 cm
シリーズ名: Science et technique du froid = Refrigeration science and technology ; 1994-5
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10.

図書

図書
issued for International Institute of Refrigeration = edité par Institute international de froid
出版情報: [St. Joseph, Mich.] : American Society of Agricultural Engineers, c1996  viii, 318 p. ; 23 cm
シリーズ名: Science et technique du froid = Refrigeration science and technology ; 1996-6
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11.

図書

図書
editors, H. Z. Massoud ... [et al.]; sponsoring divisions, Electronics and Photonics, Dielectrics Science and Technology
出版情報: Pennington, N.J. : Electrochemical Society, c2005  ix, 304 p. ; 24 cm
シリーズ名: ECS transactions ; vol. 1, no. 1
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12.

図書

図書
Herbert Kaplan
出版情報: Bellingham, Wash. : SPIE Optical Engineering Press, c1993  xiv, 137 p. ; 26 cm
シリーズ名: Tutorial texts in optical engineering ; v. TT 13
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目次情報: 続きを見る
Preface
Basics and Instrument Overview / Part I:
Introduction / Chapter 1:
The Reasons for Using Infrared Instruments / 1.1:
Advantages of Noncontact Thermal Measurement / 1.2:
Some Historical Background / 1.3:
An Overview of This Text / 1.4:
Basics of Noncontact Thermal Measurements / Chapter 2:
Heat Transfer and Radiation Exchange Basics / 2.1:
Heat and Temperature / 2.1.1:
Converting Temperature Units / 2.1.2:
The Three Modes of Heat Transfer / 2.1.3:
Conduction / 2.1.4:
Convection / 2.1.5:
Radiation / 2.1.6:
Radiation Exchange at the Target Surface / 2.1.7:
Specular and Diffuse Surfaces / 2.1.8:
Transient Heat Exchange / 2.1.9:
The Infrared Measurement Problem / 2.2:
Noncontact Thermal Measurements / 2.2.1:
The Target Surface / 2.2.2:
The Transmitting Medium / 2.2.3:
The Measuring Instrument / 2.2.4:
Introduction to Thermal Scanning and Imaging Instruments / 2.3:
Line Scanning / 2.3.1:
Two-dimensional Scanning / 2.3.2:
Multidetector Scanners and SPRITE Technology / 2.3.3:
Infrared Focal Plane Array (IRFPA) Imagers / 2.3.4:
Pyroelectric Vidicon Thermal Imagers / 2.3.5:
Matching the Instrument to the Application / Chapter 3:
Point-Sensing Instruments / 3.1:
Scanners and Imagers--Qualitative and Quantitative / 3.2:
Performance Parameters of Imaging Radiometers / 3.2.1:
Thermal Imaging Software / 3.3:
Overview of Instruments / Chapter 4:
Introduction and Classification of Instruments / 4.1:
Instrument Manufacturers / 4.2:
Discussion of Instruments / 4.3:
Point Sensors (Radiation Thermometers) / 4.3.1:
Infrared Thermocouples and Probes / 4.3.1.1:
Portable Hand-held Group / 4.3.1.2:
On-line Monitoring and Control / 4.3.1.3:
Special / 4.3.1.4:
Line Scanners / 4.3.2:
Portable Line Scanner / 4.3.2.1:
On-line (Monitoring and Control) Line Scanners / 4.3.2.2:
Thermographic / 4.3.3:
Mechanically Scanned Thermal Viewers / 4.3.3.1:
Electronically Scanned Thermal Viewers (Pyrovidicon Imagers) / 4.3.3.2:
"Staring" FPA Thermal Viewers (Qualitative) / 4.3.3.3:
Thermographic Raster Scanners (Imaging Radiometers) / 4.3.3.4:
FPA Imaging Radiometers (Quantitative) / 4.3.3.5:
Thermal Imaging Diagnostic Software / 4.4:
Quantitative Thermal Measurements of Targets / 4.4.1:
Detailed Processing and Image Diagnostics / 4.4.2:
Image Recording, Storage and Recovery / 4.4.3:
Image Comparison / 4.4.4:
Report and Database Preparation / 4.4.5:
Recording, Hard Copy and Storage of Images and Data / 4.5:
Using Ir Sensing and Imaging Instruments / Chapter 5:
Introduction: The Thermal Behavior of the Target / 5.1:
Emissivity Difference / 5.1.1:
Reflectance Difference / 5.1.2:
Transmittance Difference / 5.1.3:
Geometric Difference / 5.1.4:
Mass Transport Difference / 5.1.5:
Phase-change Difference / 5.1.6:
Thermal Capacitance Difference / 5.1.7:
Induced Heating Difference / 5.1.8:
Energy Conversion Difference / 5.1.9:
Direct Heat Transfer Difference / 5.1.10:
Learning about the Target Environment / 5.1.11:
Preparation of Equipment for Operation / 5.2:
Calibration / 5.2.1:
Checking Calibration / 5.2.1.1:
Transfer Calibration / 5.2.1.2:
The Equipment Checklist / 5.2.2:
Equipment Checkout and Calibration / 5.2.3:
Batteries / 5.2.4:
Avoiding Common Mistakes in Instrument Operation / 5.3:
Start-up Procedure / 5.3.1:
Memorizing the Default Values / 5.3.2:
Setting the Correct Emissivity / 5.3.3:
Filling the IFOV meas for Accurate Temperature Measurements / 5.3.4:
Aiming Normal to the Target Surface / 5.3.5:
Recognizing and Avoiding Reflections from External Sources / 5.3.6:
Avoiding Radiant Heat Damage to the Instrument / 5.3.7:
Instrument Applications / Part II:
Introduction to Applications / Chapter 6:
Plant Condition Monitoring and Predictive Maintenance / Chapter 7:
Electrical / 7.1:
High Electrical Resistance / 7.2.1:
Short Circuits / 7.2.2:
Open Circuits / 7.2.3:
Inductive Currents / 7.2.4:
Energized Grounds / 7.2.5:
Condition Guidelines / 7.2.6:
Mechanical / 7.3:
Friction / 7.3.1:
Valve or Pipe Blockage/Leakage / 7.3.2:
Insulation within the Plant or Facility / 7.3.3:
Miscellaneous Applications / 7.4:
Rebar Location / 7.4.1:
Condenser Air In-leakage / 7.4.2:
Containment Spray Ring Headers / 7.4.3:
Hydrogen Igniters / 7.4.4:
Effluent Thermal Plumes / 7.4.5:
Buildings and Infrastructure / Chapter 8:
Measuring Insulating Properties / 8.1:
Considering the Total Structure / 8.3:
Industrial Roof Moisture Detection / 8.4:
Thermographic Inspection of Our Aging Infrastructure / 8.5:
Materials Testing / Chapter 9:
Materials Testing--Infrared Nondestructive Testing / 9.1:
Failure Modes and Establishment of Acceptance Criteria / 9.2:
Selecting the IR Imaging System / 9.3:
Pulsed Heat Injection Applications / 9.4:
Boiler Tube Corrosion Thinning Assessment / 9.4.1:
Infrastructure NDT / 9.5:
Product and Process Monitoring and Control / Chapter 10:
The Evolution of Noncontact Process Control / 10.1:
Full Image Process Monitoring / 10.2:
Product Monitoring of Semiconductors / 10.3:
Steel Wire Drawing Machine Monitoring / 10.4:
Full Image Process Control / 10.5:
Closing the Loop--Examples / 10.6:
Night Vision, Security and Surveillance / Chapter 11:
Nonmilitary Applications / 11.1:
Aerial and Ground (Sea) Based Search and Rescue / 11.2.1:
Firefighting / 11.2.2:
Space and Airborne Reconnaissance / 11.2.3:
Police Surveillance and Crime Detection and Security / 11.2.4:
Drivers' Aid Night Vision / 11.2.5:
Commercial Instrument Performance Characteristics / Appendix A:
Manufacturers of Ir Sensing and Imaging Instruments / Appendix B:
Generic Emissivities of Materials / Appendix C:
Preface
Basics and Instrument Overview / Part I:
Introduction / Chapter 1:
13.

図書

図書
edited by David Gries, Willem-Paul de Roever
出版情報: London : Chapman & Hall, c1998  viii, 486 p. ; 24 cm
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14.

図書

図書
issued for International Institute of Refrigeration = edité pour Institut International du Froid
出版情報: Paris : Institut International du Froid, [1994]  xxxii, 837 p. ; 24 cm
シリーズ名: Science et technique du froid = Refrigeration science and technology ; 1994-2
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15.

図書

図書
edited by Ronald F. Boisvert, Ping Tak Peter Tang
出版情報: Boston : Kluwer Academic Publishers, c2001  xx, 358 p. ; 25 cm
シリーズ名: The International Federation for Information Processing ; 60
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16.

図書

図書
sponsored by ACM SIGSAC
出版情報: New York : Association for Computing Machinery, c1994  x, 293 p. ; 28 cm
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17.

図書

図書
Ecole Nationale Superieure du Petrole et des Moteurs
シリーズ名: Collection Colloques et Seminaires ;
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18.

図書

図書
Ecole Nationale Superieure du Petrole et des Moteurs
シリーズ名: Collection Colloques et Seminaires ;
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19.

図書

図書
Society of Automotive Engineers
出版情報: SAE, 1983
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20.

図書

図書
ACM Workshop on General Purpose Processing on Graphics Processing Units
出版情報: New York : Association for Computing Machinery, c2009
シリーズ名: ACM international conference proceedings series ; 383
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21.

図書

図書
edited by M. Broy, C.B. Jones
出版情報: Amsterdam ; New York : North-Holland , New York, N.Y., U.S.A. : Elsevier Science Pub. Co., distributors for the U.S. and Canada, c1990  viii, 581 p. ; 24 cm
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22.

図書

図書
issued by International Institute of Refrigeration = edité par Institut International du Froid
出版情報: Paris : Institut International du Froid, [1998]  766 p ; 24 cm
シリーズ名: Science et technique du froid = Refrigeration science and technology ; 1998-4
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23.

図書

図書
U.S. Symposium on Rock Mechanics ; US-Canada Rock Mechanics Symposium ; American Rock Mechanics Association
出版情報: Alexandria, Va. : American Rock Mechanics Association , Red Hook, NY : Printed from e-media with permission by: Curran Associates, c2008  p. 654-1308 ; 27 cm
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24.

図書

図書
edited by Patrick Y.-K. Wong and Edward A. Dennis
出版情報: New York : Plenum Press, c1990  viii, 199 p. ; 26 cm
シリーズ名: Advances in experimental medicine and biology ; v. 275
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25.

図書

図書
C. J. Gantes
出版情報: Southampton : WIT Press, c2001  352 p. ; 25 cm
シリーズ名: High performance structures and materials ; v. 2
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目次情報: 続きを見る
Preface
Overview / Part I:
Introduction / Chapter 1:
The concept of deployable structures / 1.1:
Motivation for research / 1.2:
Potential applications / 1.3:
Advantages / 1.4:
Types of deployable structures / 1.5:
Research centers for deployable structures / 1.6:
Layout of the book / 1.7:
Earth-Based Deployable Structures / Chapter 2:
Classification / 2.1:
Deployable structures based on pantographs / 2.2:
Deployable structures based on 2-D panels / 2.3:
Cable and membrane deployable structures / 2.4:
Pneumatic deployable structures / 2.5:
Tensegrity deployable structures / 2.6:
Retractable roofs / 2.7:
Other architectural applications / 2.8:
Deployable Structures for Space Applications / Chapter 3:
Early designs / 3.1:
The concept of adaptivity / 3.2:
Recent designs / 3.3:
Snap-Through Type Deployable Structures / Part II:
Introductory Remarks / Chapter 4:
The concept of snap-through / 4.1:
Examples of bi-stable structures / 4.2:
Historical evolution / 4.3:
Structural behavior / 4.4:
Geometric Design / Chapter 5:
The geometric design approach / 5.1:
Polygonal units for flat structures / 5.2:
Geometric constraints / 5.2.1:
Geometric design / 5.2.2:
Discrete joint dimensions / 5.2.3:
Geometric constraints for flat unit assemblages / 5.3:
Polygonal units for curved structures / 5.4:
Geometric constraints for curved unit assemblages / 5.4.1:
Polyhedra with polygons of one order i[subscript 1] / 5.5.1:
Polyhedra with polygons of two orders i[subscript 1] and i[subscript 2] / 5.5.2:
Polyhedra with polygons of three orders i[subscript 1], i[subscript 2], and i[subscript 3] / 5.5.3:
Trapezoidal units for flat structures / 5.6:
Structures with arbitrary geometry / 5.6.1:
Prismatic units / 5.7.1:
Pyramidal units / 5.7.1.1:
Experimental verification / 5.7.2.1:
Description of experimental program / 5.8.1:
Small-scale models / 5.8.2:
Medium-scale models / 5.8.3:
Hub design / 5.8.4:
Full-size model / 5.8.5:
Testing / 5.8.6:
Suggestions for future experimental work / 5.8.7:
Concluding remarks on geometric design / 5.9:
Structural Analysis / Chapter 6:
Analysis in the deployed configuration / 6.1:
The finite element approach / 6.2.1:
Modeling of deployable flat slabs via equivalent continua / 6.2.2:
Substitution of SLEs by uniform beams / 6.2.2.1:
Substitution of equivalent grid by equivalent slab / 6.2.2.2:
Model verification and limitations / 6.2.2.3:
Analysis during deployment / 6.3:
Basic considerations for single units / 6.3.1:
Friction: main mechanism and proposed model / 6.3.2:
The proposed friction model / 6.3.2.1:
Exact model for pivotal connection between two bars / 6.3.2.2:
Exact model for hinged connections between bars and hubs / 6.3.2.3:
Approximate model for pivotal connection / 6.3.2.4:
Approximate model for hinged connection / 6.3.2.5:
Implementation of the proposed model / 6.3.2.6:
Verification of the proposed numerical model / 6.3.2.7:
Conclusions on finite element modeling for single deployable units / 6.3.3:
Deployment results for multi-unit structures / 6.3.4:
Proposed approximate model for multi-unit structures / 6.3.4.1:
Analytical prediction of snap-through intensity / 6.3.5:
Derivation of approximate models for flat units / 6.3.5.1:
Verification of approximate models for flat units / 6.3.5.2:
Derivation of approximate model for curved units / 6.3.5.3:
Verification of approximate models for curved units / 6.3.5.4:
Concluding remarks / 6.3.5.5:
Design Methodology / Chapter 7:
Introductory remarks / 7.1:
A general design methodology / 7.2:
A design methodology for flat structures / 7.3:
Optimization of material and cross-section properties / 7.4:
Design Examples / Chapter 8:
Presentation of case studies / 8.1:
Deployable flat slab / 8.2:
Deployable semi-circular arch / 8.3:
Airship cover / 8.4:
Temporary shelter / 8.5:
Deployable scaffolding / 8.6:
References
World Wide Web Sites of Related Interest
List of Figures and Figure Credits
Index
Preface
Overview / Part I:
Introduction / Chapter 1:
26.

図書

図書
Annual California Regional Meeting, 56, Oakland, California,86.4.2-4
出版情報: Society of Petroleum Engineers, 1986
シリーズ名: SPE Technical Meeting Proceedings ;
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27.

図書

図書
Computer Measurement Group
出版情報: Turnersville, N.J. : Computer Measurement Group, c2001  2 v. (xx, 968 p.) ; 28 cm
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28.

図書

図書
Workshop on ns-2: the IP Network Simulator ; VALUETOOLS
出版情報: New York, NY : Association for Computing Machinery, c2006  84 p. ; 28 cm
シリーズ名: ACM international conference proceedings series ; 202
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29.

図書

図書
Association for Computing Machinery
出版情報: New York : Association for Computing Machinery, c2008  222 p. ; 28 cm
シリーズ名: ACM international conference proceedings series ; 290
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30.

図書

図書
edité par Institut International du Froid
出版情報: Paris : Institut International du Froid, [1997]  258 p. ; 24 cm
シリーズ名: Science et technique du froid = Refrigeration science and technology ; 1974-4
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31.

図書

図書
International Institute of Refrigeration. Commission C2
出版情報: Paris, France : Institut international du froid, 1988  295 p. ; 24 cm
シリーズ名: Science et technique du froid = Refrigeration science and technology ; 1988-3
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32.

図書

図書
issued by International Institute of Refrigeration = edité par Institut International du Froid
出版情報: Paris : Institut International du Froid, [1998]  424 p. ; 24 cm
シリーズ名: Science et technique du froid = Refrigeration science and technology ; 1998-5
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33.

図書

図書
edited by M. Ould-Khaoua & B. Caminero ; sponsored by ACM SIGSIM & IEEE Computer Society
出版情報: New York : Association for Computing Machinery, c2006  105 p. ; 28 cm
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34.

図書

図書
Offshore Technology Conference
出版情報: Richardson, Tex. : Offshore Technology Conference , Red Hook, NY : Printed by Curran Associates, 2022  p. 714-1429 ; 28 cm
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35.

図書

図書
International Conference on Microbiome Engineering ; American Institute of Chemical Engineers
出版情報: New York : AIChE , Red Hook, NY : Printed from e-media with permission by Curran Associates, 2020. c2019  [3], 40, [2] p. ; 28 cm
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36.

図書

図書
National Conference on Artificial Intelligence ; Association for the Advancement of Artificial Intelligence
出版情報: Palo Alto, Calif. : Association for the Advancement of Artificial Intelligence , Red Hook, NY : Printed with permission by Curran Associates, 2021  p. 1343-1797 ; 27 cm
シリーズ名: 35th AAAI Conference on Artificial Intelligence (AAAI-21) : online 2-9 February 2021 ; v. 2
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37.

図書

図書
David L. Waltz, general chairman ; sponsored by the Association for Computational Linguistics, the Association for Computing Machinery, SIGART (ACM Special Interest Group in Artificial Intelligence)
出版情報: New York : ACM, c1978  iii, 253 p. ; 28 cm
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38.

図書

図書
edited by Jan-Olof Eklundh ; sponsored by International Association for Pattern Recognition
出版情報: unknown  2 v. ; 25 cm
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39.

図書

図書
American Helicopter Society. Annual Forum
出版情報: Alexandria, VA. : American Helicopter Society, c1986  2 v. ; 28 cm
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40.

図書

図書
guest editors, André van Amstel, Peter van Velthoven and Arjan Hensen
出版情報: Abingdon : Taylor & Francis, 2015  168 p. ; 25 cm
シリーズ名: Journal of integrative environmental sciences ; v. 12, suppl. 1
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41.

図書

図書
European Space Agency
出版情報: Noordwijk, Netherlands : European Space Agency, [2002]  xii, 130 p. ; 30 cm
シリーズ名: ESA SP ; 504
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42.

図書

図書
National Electronic Packaging and Production Conference
出版情報: Norwalk, CT : Reed Exhibition Companies, c1995  3 v. ; 28 cm
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43.

図書

図書
edited by Anil B. Mukherjee
出版情報: New York : Plenum Press, c1990  viii, 264 p., [1] leaf of plates ; 26 cm
シリーズ名: Advances in experimental medicine and biology ; v. 279
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44.

図書

図書
edited by Tosiyasu L. Kunii
出版情報: Amsterdam ; Tokyo : North-Holland, 1989  xiii, 546 p. ; 23 cm
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45.

図書

図書
National Electronic Packaging and Production Conference
出版情報: Norwark, CT : Reed Exhibition Companies, c2000  2 v. ; 28 cm
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46.

図書

図書
International Workshop on Use of P2P, Grid and Agents for the Development of Content Networks ; SIGARCH ; IEEE Computer Society ; University of Arizona ; Association for Computing Machinery
出版情報: New York : Association for Computing Machinery, c2007  81 p. ; 28 cm
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47.

図書

図書
International Institute of Refrigeration. Commission B1 ; International Institute of Refrigeration. Commission B2 ; International Institute of Refrigeration. Commission E1 ; International Institute of Refrigeration. Commission E2
出版情報: Paris, France : Issued for International Institute of Refrigeration, 1996  xix, 810 p. ; 21 cm
シリーズ名: Science et technique du froid = Refrigeration science and technology ; 1996-3
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48.

図書

図書
Internatoinal Institute of Refrigeration = Institut International du Froid
出版情報: Luxembourg : Office for Official Publications of the European Communities, c1999  333 p. ; 23 cm
シリーズ名: Science et technique du froid = Refrigeration science and technology ; 1997-2
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49.

図書

図書
ANTEC ; Society of Plastics Engineers
出版情報: Brookfield Center, CT : Society of Plastics Engineers, c1993  3 v. ; 28 cm
シリーズ名: Technical papers / Society of Plastic Engineers ; v. 39
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50.

図書

図書
David L. Nelson, editor, M. Stanley Whittingham, editor, Thomas F. George, editor
出版情報: Washington, DC : American Chemical Society, 1987-  v. ; 24 cm
シリーズ名: ACS symposium series ; 351, 377
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目次情報: 続きを見る
Overview of High-Temperature Superconductivity: Theory, Surfaces, Interfaces, and Bulk Systems
Analysis of Thermodynamic and Transport Properties of La2-xMx CuO4 and YBa2Cu3O7- Gd
Superconductors Electronic Structure and High Critical Temperature in Oxide
Superconductors High-Temperature Superconductivity from Charged Boson Pairing
Topological Aspects of Chemical Bonding in Superconductors Bonds, Bands, Charge-Transfer
Excitations, and High-Temperature Superconductivity
Electron Spectroscopic Data for High-Temperature Superconductors
Theory of High-Temperature Superconductivity: Overlap of Wannier Functions and the Role of Dielectric Screening
Dynamic Polarization Theory of Superconductivity Polarization-Induced Pairing
An Excitonic Mechanism for High-Temperature Superconductivity
Determination of the Homogeneity Range of La2CuO4
Physical Properties and Phase Identification in Yttrium-Alkaline
Earth-Bismuth-Cooper Oxide Systems Valence, Charge Transfer, and Carrier
Type for Bi2Sr2Can-1Cun O2n+4+ Gd and Related High-Temperature
Ceramic Superconductors Preparation of the High-Temperature Superconductor YBa2Cu307-x High-Temperature
Processing of Oxide Superconductors and Superconducting Oxide-Silver
Oxide Composite Photogeneration of Self-Localized Polarons in YBa2Cu3O7-xd and La2CuO4
Electron-Transfer Studies at YBa2Cu3O7, Bi2Sr2.2Ca0.8 Cu2O8 and Tl2Ba2Ca2Cu3O10
Microwave Absorption at Various Preparation Stages of YBa2Cu3 O7-6
Superconductor Advances in Processing High-Temperature
Superconducting Thin Films with Lasers
Preparation of Superconducting Oxide Films from Metal
Trifluoroacetate Solution Precursors Surface and Interface
Properties of High-Temperature Superconductors
Chemical Compatibility of High-Temperature
Superconductors with Other Materials
A New Layered Copper Oxide:LaSrCuAlO5 Structure-Property
Correlations in Superconducting Copper Oxides
Overview of High-Temperature Superconductivity: Theory, Surfaces, Interfaces, and Bulk Systems
Analysis of Thermodynamic and Transport Properties of La2-xMx CuO4 and YBa2Cu3O7- Gd
Superconductors Electronic Structure and High Critical Temperature in Oxide
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