1.
図書
International Institute of Refrigeration. Commission B2 ; International Institute of Refrigeration. Commission C2 ; International Institute of Refrigeration. Commission E2
出版情報:
Buenos Aires : Its Organizing Committee, 1992 364 p. ; 25 cm
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2.
図書
editors, Hisham Z. Massoud ... [et al.]
3.
図書
editors, Hisham Z. Massoud, Edward H. Poindexter, C. Robert Helms
4.
図書
edited by Ernst-Rüdiger Olderog
5.
図書
issued by International Institute of Refrigeration ; [editor, Kostadin Fikiin] = edité par Institut International du Froid
6.
図書
International Institute of Refrigeration
7.
図書
7. Les Chaînes du froid sous l'angle économique : compte rendu des réunions de Commissions B1, B2, C2, D1, D2/3 = Cold chains in economic perspective : proceedings of meetings of Commissions B1, B2, C2, D1, D2/3, May 17-20, 1988
International Institute of Refrigeration. Commission B1
8.
図書
E2S2-CREATE and AIChE Waste Management Conference ; American Institute of Chemical Engineers ; E2S2-CREATE
出版情報:
New York : AIChE , Red Hook, NY : Printed from e-media with permission by Curran Associates, 2021, c2019 62 p. ; 28 cm
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9.
図書
édité par Institut international du froid = issued for International Institute of Refrigeration
10.
図書
issued for International Institute of Refrigeration = edité par Institute international de froid
11.
図書
editors, H. Z. Massoud ... [et al.]; sponsoring divisions, Electronics and Photonics, Dielectrics Science and Technology
12.
図書
Herbert Kaplan
目次情報:
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Preface
Basics and Instrument Overview / Part I:
Introduction / Chapter 1:
The Reasons for Using Infrared Instruments / 1.1:
Advantages of Noncontact Thermal Measurement / 1.2:
Some Historical Background / 1.3:
An Overview of This Text / 1.4:
Basics of Noncontact Thermal Measurements / Chapter 2:
Heat Transfer and Radiation Exchange Basics / 2.1:
Heat and Temperature / 2.1.1:
Converting Temperature Units / 2.1.2:
The Three Modes of Heat Transfer / 2.1.3:
Conduction / 2.1.4:
Convection / 2.1.5:
Radiation / 2.1.6:
Radiation Exchange at the Target Surface / 2.1.7:
Specular and Diffuse Surfaces / 2.1.8:
Transient Heat Exchange / 2.1.9:
The Infrared Measurement Problem / 2.2:
Noncontact Thermal Measurements / 2.2.1:
The Target Surface / 2.2.2:
The Transmitting Medium / 2.2.3:
The Measuring Instrument / 2.2.4:
Introduction to Thermal Scanning and Imaging Instruments / 2.3:
Line Scanning / 2.3.1:
Two-dimensional Scanning / 2.3.2:
Multidetector Scanners and SPRITE Technology / 2.3.3:
Infrared Focal Plane Array (IRFPA) Imagers / 2.3.4:
Pyroelectric Vidicon Thermal Imagers / 2.3.5:
Matching the Instrument to the Application / Chapter 3:
Point-Sensing Instruments / 3.1:
Scanners and Imagers--Qualitative and Quantitative / 3.2:
Performance Parameters of Imaging Radiometers / 3.2.1:
Thermal Imaging Software / 3.3:
Overview of Instruments / Chapter 4:
Introduction and Classification of Instruments / 4.1:
Instrument Manufacturers / 4.2:
Discussion of Instruments / 4.3:
Point Sensors (Radiation Thermometers) / 4.3.1:
Infrared Thermocouples and Probes / 4.3.1.1:
Portable Hand-held Group / 4.3.1.2:
On-line Monitoring and Control / 4.3.1.3:
Special / 4.3.1.4:
Line Scanners / 4.3.2:
Portable Line Scanner / 4.3.2.1:
On-line (Monitoring and Control) Line Scanners / 4.3.2.2:
Thermographic / 4.3.3:
Mechanically Scanned Thermal Viewers / 4.3.3.1:
Electronically Scanned Thermal Viewers (Pyrovidicon Imagers) / 4.3.3.2:
"Staring" FPA Thermal Viewers (Qualitative) / 4.3.3.3:
Thermographic Raster Scanners (Imaging Radiometers) / 4.3.3.4:
FPA Imaging Radiometers (Quantitative) / 4.3.3.5:
Thermal Imaging Diagnostic Software / 4.4:
Quantitative Thermal Measurements of Targets / 4.4.1:
Detailed Processing and Image Diagnostics / 4.4.2:
Image Recording, Storage and Recovery / 4.4.3:
Image Comparison / 4.4.4:
Report and Database Preparation / 4.4.5:
Recording, Hard Copy and Storage of Images and Data / 4.5:
Using Ir Sensing and Imaging Instruments / Chapter 5:
Introduction: The Thermal Behavior of the Target / 5.1:
Emissivity Difference / 5.1.1:
Reflectance Difference / 5.1.2:
Transmittance Difference / 5.1.3:
Geometric Difference / 5.1.4:
Mass Transport Difference / 5.1.5:
Phase-change Difference / 5.1.6:
Thermal Capacitance Difference / 5.1.7:
Induced Heating Difference / 5.1.8:
Energy Conversion Difference / 5.1.9:
Direct Heat Transfer Difference / 5.1.10:
Learning about the Target Environment / 5.1.11:
Preparation of Equipment for Operation / 5.2:
Calibration / 5.2.1:
Checking Calibration / 5.2.1.1:
Transfer Calibration / 5.2.1.2:
The Equipment Checklist / 5.2.2:
Equipment Checkout and Calibration / 5.2.3:
Batteries / 5.2.4:
Avoiding Common Mistakes in Instrument Operation / 5.3:
Start-up Procedure / 5.3.1:
Memorizing the Default Values / 5.3.2:
Setting the Correct Emissivity / 5.3.3:
Filling the IFOV meas for Accurate Temperature Measurements / 5.3.4:
Aiming Normal to the Target Surface / 5.3.5:
Recognizing and Avoiding Reflections from External Sources / 5.3.6:
Avoiding Radiant Heat Damage to the Instrument / 5.3.7:
Instrument Applications / Part II:
Introduction to Applications / Chapter 6:
Plant Condition Monitoring and Predictive Maintenance / Chapter 7:
Electrical / 7.1:
High Electrical Resistance / 7.2.1:
Short Circuits / 7.2.2:
Open Circuits / 7.2.3:
Inductive Currents / 7.2.4:
Energized Grounds / 7.2.5:
Condition Guidelines / 7.2.6:
Mechanical / 7.3:
Friction / 7.3.1:
Valve or Pipe Blockage/Leakage / 7.3.2:
Insulation within the Plant or Facility / 7.3.3:
Miscellaneous Applications / 7.4:
Rebar Location / 7.4.1:
Condenser Air In-leakage / 7.4.2:
Containment Spray Ring Headers / 7.4.3:
Hydrogen Igniters / 7.4.4:
Effluent Thermal Plumes / 7.4.5:
Buildings and Infrastructure / Chapter 8:
Measuring Insulating Properties / 8.1:
Considering the Total Structure / 8.3:
Industrial Roof Moisture Detection / 8.4:
Thermographic Inspection of Our Aging Infrastructure / 8.5:
Materials Testing / Chapter 9:
Materials Testing--Infrared Nondestructive Testing / 9.1:
Failure Modes and Establishment of Acceptance Criteria / 9.2:
Selecting the IR Imaging System / 9.3:
Pulsed Heat Injection Applications / 9.4:
Boiler Tube Corrosion Thinning Assessment / 9.4.1:
Infrastructure NDT / 9.5:
Product and Process Monitoring and Control / Chapter 10:
The Evolution of Noncontact Process Control / 10.1:
Full Image Process Monitoring / 10.2:
Product Monitoring of Semiconductors / 10.3:
Steel Wire Drawing Machine Monitoring / 10.4:
Full Image Process Control / 10.5:
Closing the Loop--Examples / 10.6:
Night Vision, Security and Surveillance / Chapter 11:
Nonmilitary Applications / 11.1:
Aerial and Ground (Sea) Based Search and Rescue / 11.2.1:
Firefighting / 11.2.2:
Space and Airborne Reconnaissance / 11.2.3:
Police Surveillance and Crime Detection and Security / 11.2.4:
Drivers' Aid Night Vision / 11.2.5:
Commercial Instrument Performance Characteristics / Appendix A:
Manufacturers of Ir Sensing and Imaging Instruments / Appendix B:
Generic Emissivities of Materials / Appendix C:
Preface
Basics and Instrument Overview / Part I:
Introduction / Chapter 1:
13.
図書
edited by David Gries, Willem-Paul de Roever
出版情報:
London : Chapman & Hall, c1998 viii, 486 p. ; 24 cm
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14.
図書
14. CFCs, the day after, Padova, 21-23 Sept. 1994 : proceedings of meetings of commissions B1, B2, E1, E2 = L'après CFC, Padova, 21-23 Sept. 1994 : compte rendu de la réunion des commisions B1, B2, E1, E2
issued for International Institute of Refrigeration = edité pour Institut International du Froid
15.
図書
edited by Ronald F. Boisvert, Ping Tak Peter Tang
16.
図書
sponsored by ACM SIGSAC
出版情報:
New York : Association for Computing Machinery, c1994 x, 293 p. ; 28 cm
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17.
図書
Ecole Nationale Superieure du Petrole et des Moteurs
シリーズ名:
Collection Colloques et Seminaires ;
子書誌情報:
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18.
図書
Ecole Nationale Superieure du Petrole et des Moteurs
シリーズ名:
Collection Colloques et Seminaires ;
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19.
図書
Society of Automotive Engineers
出版情報:
SAE, 1983
子書誌情報:
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20.
図書
ACM Workshop on General Purpose Processing on Graphics Processing Units
21.
図書
edited by M. Broy, C.B. Jones
出版情報:
Amsterdam ; New York : North-Holland , New York, N.Y., U.S.A. : Elsevier Science Pub. Co., distributors for the U.S. and Canada, c1990 viii, 581 p. ; 24 cm
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22.
図書
issued by International Institute of Refrigeration = edité par Institut International du Froid
23.
図書
U.S. Symposium on Rock Mechanics ; US-Canada Rock Mechanics Symposium ; American Rock Mechanics Association
出版情報:
Alexandria, Va. : American Rock Mechanics Association , Red Hook, NY : Printed from e-media with permission by: Curran Associates, c2008 p. 654-1308 ; 27 cm
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24.
図書
edited by Patrick Y.-K. Wong and Edward A. Dennis
25.
図書
C. J. Gantes
目次情報:
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Preface
Overview / Part I:
Introduction / Chapter 1:
The concept of deployable structures / 1.1:
Motivation for research / 1.2:
Potential applications / 1.3:
Advantages / 1.4:
Types of deployable structures / 1.5:
Research centers for deployable structures / 1.6:
Layout of the book / 1.7:
Earth-Based Deployable Structures / Chapter 2:
Classification / 2.1:
Deployable structures based on pantographs / 2.2:
Deployable structures based on 2-D panels / 2.3:
Cable and membrane deployable structures / 2.4:
Pneumatic deployable structures / 2.5:
Tensegrity deployable structures / 2.6:
Retractable roofs / 2.7:
Other architectural applications / 2.8:
Deployable Structures for Space Applications / Chapter 3:
Early designs / 3.1:
The concept of adaptivity / 3.2:
Recent designs / 3.3:
Snap-Through Type Deployable Structures / Part II:
Introductory Remarks / Chapter 4:
The concept of snap-through / 4.1:
Examples of bi-stable structures / 4.2:
Historical evolution / 4.3:
Structural behavior / 4.4:
Geometric Design / Chapter 5:
The geometric design approach / 5.1:
Polygonal units for flat structures / 5.2:
Geometric constraints / 5.2.1:
Geometric design / 5.2.2:
Discrete joint dimensions / 5.2.3:
Geometric constraints for flat unit assemblages / 5.3:
Polygonal units for curved structures / 5.4:
Geometric constraints for curved unit assemblages / 5.4.1:
Polyhedra with polygons of one order i[subscript 1] / 5.5.1:
Polyhedra with polygons of two orders i[subscript 1] and i[subscript 2] / 5.5.2:
Polyhedra with polygons of three orders i[subscript 1], i[subscript 2], and i[subscript 3] / 5.5.3:
Trapezoidal units for flat structures / 5.6:
Structures with arbitrary geometry / 5.6.1:
Prismatic units / 5.7.1:
Pyramidal units / 5.7.1.1:
Experimental verification / 5.7.2.1:
Description of experimental program / 5.8.1:
Small-scale models / 5.8.2:
Medium-scale models / 5.8.3:
Hub design / 5.8.4:
Full-size model / 5.8.5:
Testing / 5.8.6:
Suggestions for future experimental work / 5.8.7:
Concluding remarks on geometric design / 5.9:
Structural Analysis / Chapter 6:
Analysis in the deployed configuration / 6.1:
The finite element approach / 6.2.1:
Modeling of deployable flat slabs via equivalent continua / 6.2.2:
Substitution of SLEs by uniform beams / 6.2.2.1:
Substitution of equivalent grid by equivalent slab / 6.2.2.2:
Model verification and limitations / 6.2.2.3:
Analysis during deployment / 6.3:
Basic considerations for single units / 6.3.1:
Friction: main mechanism and proposed model / 6.3.2:
The proposed friction model / 6.3.2.1:
Exact model for pivotal connection between two bars / 6.3.2.2:
Exact model for hinged connections between bars and hubs / 6.3.2.3:
Approximate model for pivotal connection / 6.3.2.4:
Approximate model for hinged connection / 6.3.2.5:
Implementation of the proposed model / 6.3.2.6:
Verification of the proposed numerical model / 6.3.2.7:
Conclusions on finite element modeling for single deployable units / 6.3.3:
Deployment results for multi-unit structures / 6.3.4:
Proposed approximate model for multi-unit structures / 6.3.4.1:
Analytical prediction of snap-through intensity / 6.3.5:
Derivation of approximate models for flat units / 6.3.5.1:
Verification of approximate models for flat units / 6.3.5.2:
Derivation of approximate model for curved units / 6.3.5.3:
Verification of approximate models for curved units / 6.3.5.4:
Concluding remarks / 6.3.5.5:
Design Methodology / Chapter 7:
Introductory remarks / 7.1:
A general design methodology / 7.2:
A design methodology for flat structures / 7.3:
Optimization of material and cross-section properties / 7.4:
Design Examples / Chapter 8:
Presentation of case studies / 8.1:
Deployable flat slab / 8.2:
Deployable semi-circular arch / 8.3:
Airship cover / 8.4:
Temporary shelter / 8.5:
Deployable scaffolding / 8.6:
References
World Wide Web Sites of Related Interest
List of Figures and Figure Credits
Index
Preface
Overview / Part I:
Introduction / Chapter 1:
26.
図書
Annual California Regional Meeting, 56, Oakland, California,86.4.2-4
出版情報:
Society of Petroleum Engineers, 1986
シリーズ名:
SPE Technical Meeting Proceedings ;
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27.
図書
Computer Measurement Group
出版情報:
Turnersville, N.J. : Computer Measurement Group, c2001 2 v. (xx, 968 p.) ; 28 cm
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28.
図書
Workshop on ns-2: the IP Network Simulator ; VALUETOOLS
29.
図書
Association for Computing Machinery
30.
図書
edité par Institut International du Froid
31.
図書
International Institute of Refrigeration. Commission C2
32.
図書
32. Hygiene, quality & safety, in the cold chain and air conditioning : proceedings of the conference of Commissions C2 & E1, with D2/3, (September 16-18, 1998), Nantes, France = Hygiene, qualite & securite, dans la chaîne du froid et le conditionnement d'air : compte rendu de le conférence des Commissions C2 & E1, with D2/3
issued by International Institute of Refrigeration = edité par Institut International du Froid
33.
図書
edited by M. Ould-Khaoua & B. Caminero ; sponsored by ACM SIGSIM & IEEE Computer Society
出版情報:
New York : Association for Computing Machinery, c2006 105 p. ; 28 cm
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34.
図書
Offshore Technology Conference
出版情報:
Richardson, Tex. : Offshore Technology Conference , Red Hook, NY : Printed by Curran Associates, 2022 p. 714-1429 ; 28 cm
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35.
図書
International Conference on Microbiome Engineering ; American Institute of Chemical Engineers
出版情報:
New York : AIChE , Red Hook, NY : Printed from e-media with permission by Curran Associates, 2020. c2019 [3], 40, [2] p. ; 28 cm
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36.
図書
National Conference on Artificial Intelligence ; Association for the Advancement of Artificial Intelligence
37.
図書
David L. Waltz, general chairman ; sponsored by the Association for Computational Linguistics, the Association for Computing Machinery, SIGART (ACM Special Interest Group in Artificial Intelligence)
出版情報:
New York : ACM, c1978 iii, 253 p. ; 28 cm
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38.
図書
edited by Jan-Olof Eklundh ; sponsored by International Association for Pattern Recognition
出版情報:
unknown 2 v. ; 25 cm
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39.
図書
American Helicopter Society. Annual Forum
出版情報:
Alexandria, VA. : American Helicopter Society, c1986 2 v. ; 28 cm
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40.
図書
guest editors, André van Amstel, Peter van Velthoven and Arjan Hensen
41.
図書
European Space Agency
出版情報:
Noordwijk, Netherlands : European Space Agency, [2002] xii, 130 p. ; 30 cm
シリーズ名:
ESA SP ; 504
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42.
図書
National Electronic Packaging and Production Conference
出版情報:
Norwalk, CT : Reed Exhibition Companies, c1995 3 v. ; 28 cm
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43.
図書
edited by Anil B. Mukherjee
44.
図書
edited by Tosiyasu L. Kunii
出版情報:
Amsterdam ; Tokyo : North-Holland, 1989 xiii, 546 p. ; 23 cm
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45.
図書
National Electronic Packaging and Production Conference
出版情報:
Norwark, CT : Reed Exhibition Companies, c2000 2 v. ; 28 cm
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46.
図書
International Workshop on Use of P2P, Grid and Agents for the Development of Content Networks ; SIGARCH ; IEEE Computer Society ; University of Arizona ; Association for Computing Machinery
出版情報:
New York : Association for Computing Machinery, c2007 81 p. ; 28 cm
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47.
図書
47. Applications for natural refrigerants : proceedings of meeting of, commissions B1, B2, E1, E2, 3-6 September 1996 = Applications pour les frigorigènes naturels : compte rendu de la réunion de la, commissions B1, B2, E1, E2, 3-6 September 1996
International Institute of Refrigeration. Commission B1 ; International Institute of Refrigeration. Commission B2 ; International Institute of Refrigeration. Commission E1 ; International Institute of Refrigeration. Commission E2
48.
図書
Internatoinal Institute of Refrigeration = Institut International du Froid
49.
図書
ANTEC ; Society of Plastics Engineers
50.
図書
David L. Nelson, editor, M. Stanley Whittingham, editor, Thomas F. George, editor
目次情報:
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Overview of High-Temperature Superconductivity: Theory, Surfaces, Interfaces, and Bulk Systems
Analysis of Thermodynamic and Transport Properties of La2-xMx CuO4 and YBa2Cu3O7- Gd
Superconductors Electronic Structure and High Critical Temperature in Oxide
Superconductors High-Temperature Superconductivity from Charged Boson Pairing
Topological Aspects of Chemical Bonding in Superconductors Bonds, Bands, Charge-Transfer
Excitations, and High-Temperature Superconductivity
Electron Spectroscopic Data for High-Temperature Superconductors
Theory of High-Temperature Superconductivity: Overlap of Wannier Functions and the Role of Dielectric Screening
Dynamic Polarization Theory of Superconductivity Polarization-Induced Pairing
An Excitonic Mechanism for High-Temperature Superconductivity
Determination of the Homogeneity Range of La2CuO4
Physical Properties and Phase Identification in Yttrium-Alkaline
Earth-Bismuth-Cooper Oxide Systems Valence, Charge Transfer, and Carrier
Type for Bi2Sr2Can-1Cun O2n+4+ Gd and Related High-Temperature
Ceramic Superconductors Preparation of the High-Temperature Superconductor YBa2Cu307-x High-Temperature
Processing of Oxide Superconductors and Superconducting Oxide-Silver
Oxide Composite Photogeneration of Self-Localized Polarons in YBa2Cu3O7-xd and La2CuO4
Electron-Transfer Studies at YBa2Cu3O7, Bi2Sr2.2Ca0.8 Cu2O8 and Tl2Ba2Ca2Cu3O10
Microwave Absorption at Various Preparation Stages of YBa2Cu3 O7-6
Superconductor Advances in Processing High-Temperature
Superconducting Thin Films with Lasers
Preparation of Superconducting Oxide Films from Metal
Trifluoroacetate Solution Precursors Surface and Interface
Properties of High-Temperature Superconductors
Chemical Compatibility of High-Temperature
Superconductors with Other Materials
A New Layered Copper Oxide:LaSrCuAlO5 Structure-Property
Correlations in Superconducting Copper Oxides
Overview of High-Temperature Superconductivity: Theory, Surfaces, Interfaces, and Bulk Systems
Analysis of Thermodynamic and Transport Properties of La2-xMx CuO4 and YBa2Cu3O7- Gd
Superconductors Electronic Structure and High Critical Temperature in Oxide