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1.

図書
図書
1. Vision science : photons to phenomenology
Stephen E. Palmer
出版情報: Cambridge, MA : MIT Press, c1999  xxii, 810 p., [8] p. of plates ; 26 cm
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Brief Contents
Contents
Preface
Organization of the Book
Foundations
Spatial Vision
Visual Dynamics
Tailoring the Book to Different Needs
Acknowledgments
An Introduction to Vision Science / Part I：
Visual Perception / 1.1：
Defining Visual Perception / 1.1.1：
The Evolutionary Utility of Vision / 1.1.2：
Perception as a Constructive Act / 1.1.3：
Perception as Modeling the Environment / 1.1.4：
Perception as Apprehension of Meaning / 1.1.5：
Optical Information / 1.2：
The Behavior of Light / 1.2.1：
The Formation of Images / 1.2.2：
Vision as an "Inverse" Problem / 1.2.3：
Visual Systems / 1.3：
The Human Eye / 1.3.1：
The Retina / 1.3.2：
Visual Cortex / 1.3.3：
Theoretical Approaches / 2：
Classical Theories of Vision / 2.1：
Structuralism / 2.1.1：
Gestaltism / 2.1.2：
Ecological Optics / 2.1.3：
Constructivism / 2.1.4：
A Brief History of Information Processing / 2.2：
Computer Vision / 2.2.1：
Information Processing Psychology / 2.2.2：
Biological Information Processing / 2.2.3：
Information Processing Theory / 2.3：
The Computer Metaphor / 2.3.1：
Three Levels of Information Processing / 2.3.2：
Three Assumptions of Information Processing / 2.3.3：
Representation / 2.3.4：
Processes / 2.3.5：
Four Stages of Visual Perception / 2.4：
The Retinal Image / 2.4.1：
The Image-Based Stage / 2.4.2：
The Surface-Based Stage / 2.4.3：
The Object-Based Stage / 2.4.4：
The Category-Based Stage / 2.4.5：
Color Vision: A Microcosm of Vision Science / 3：
The Computational Description of Color Perception / 3.1：
The Physical Description of Light / 3.1.1：
The Psychological Description of Color / 3.1.2：
The Psychophysical Correspondence / 3.1.3：
Image-Based Color Processing / 3.2：
Basic Phenomena / 3.2.1：
Theories of Color Vision / 3.2.2：
Physiological Mechanisms / 3.2.3：
Development of Color Vision / 3.2.4：
Surface-Based Color Processing / 3.3：
Lightness Constancy / 3.3.1：
Chromatic Color Constancy / 3.3.2：
Color Naming / 3.4：
Focal Colors and Prototypes / 3.4.2：
A Fuzzy-Logical Model of Color Naming / 3.4.3：
Processing Image Structure / Part II：
Retinal and Geniculate Cells / 4.1：
Striate Cortex / 4.1.2：
Striate Architecture / 4.1.3：
Development of Receptive Fields / 4.1.4：
Psychophysical Channels / 4.2：
Spatial Frequency Theory / 4.2.1：
Physiology of Spatial Frequency Channels / 4.2.2：
Computational Approaches / 4.3：
Marr's Primal Sketches / 4.3.1：
Edge Detection / 4.3.2：
Alternative Computational Theories / 4.3.3：
A Theoretical Synthesis / 4.3.4：
Visual Pathways / 4.4：
Physiologlcal Evidence / 4.4.1：
Perceptual Evidence / 4.4.2：
Perceiving Surfaces Oriented in Depth / 5：
The Problem of Depth Perception / 5.1：
Heuristic Assumptions / 5.1.1：
Marr's 2.5-D Sketch / 5.1.2：
Ocular Information / 5.2：
Accormmodation / 5.2.1：
Convergence / 5.2.2：
Stereoscopic Information / 5.3：
Binocular Disparity / 5.3.1：
The Correspondence Problem / 5.3.2：
Computational Theories / 5.3.3：
Vertical Disparity / 5.3.4：
Da Vinci Stereopsis / 5.3.6：
Dynamic Information / 5.4：
Motion Parallax / 5.4.1：
Optic Flow Caused by a Moving Observer / 5.4.2：
Optic Flow Caused by Moving Objects / 5.4.3：
Accretion/Deletion of Texture / 5.4.4：
Pictorial Information / 5.5：
Perspective Projection / 5.5.1：
Convergence of Parallel Lines / 5.5.2：
Position Relative to the Horizon of a Surface / 5.5.3：
Relative Size / 5.5.4：
Familiar Size / 5.5.5：
Texture Gradients / 5.5.6：
Edge Interpretation / 5.5.7：
Shading Information / 5.5.8：
Aerial Perspective / 5.5.9：
Integrating Information Sources / 5.5.10：
Development of Depth Perception / 5.6：
Organizing Objects and Scenes / 5.6.1：
Perceptual Grouping / 6.1：
The Classical Principles of Grouping / 6.1.1：
New Principles of Grouping / 6.1.2：
Measuring Grouping Effects Quantitatively / 6.1.3：
Is Grouping an Early or Late Process? / 6.1.4：
Past Experience / 6.1.5：
Region Analysis / 6.2：
Uniform Connectedness / 6.2.1：
Region Segmentation / 6.2.2：
Texture Segregation / 6.2.3：
Figure/Ground Organization / 6.3：
Principles of Figure/Ground Organization / 6.3.1：
Ecological Considerations / 6.3.2：
Effects of Meaningfulness / 6.3.3：
The Problem of Holes / 6.3.4：
Visual Interpolation / 6.4：
Visual Completion / 6.4.1：
Illusory Contours / 6.4.2：
Perceived Transparency / 6.4.3：
Figural Scission / 6.4.4：
The Principle of Nonaccidentalness / 6.4.5：
Multistability / 6.5：
Connectionist Network Models / 6.5.1：
Neural Fatigue / 6.5.2：
Eye Fixations / 6.5.3：
The Role of Instructions / 6.5.4：
Development of Perceptual Organization / 6.6：
The Habituation Paradigm / 6.6.1：
The Development of Grouping / 6.6.2：
Perceiving Object Properties and Parts / 7：
Size / 7.1：
Size Constancy / 7.1.1：
Size Illusions / 7.1.2：
Shape / 7.2：
Shape Constancy / 7.2.1：
Shape Illusions / 7.2.2：
Orientation / 7.3：
Orientation Constancy / 7.3.1：
Orientation Illusions / 7.3.2：
Position / 7.4：
Perception of Direction / 7.4.1：
Position Constancy / 7.4.2：
Position Illusions / 7.4.3：
Perceptual Adaptation / 7.5：
Parts / 7.6：
Evidence for Perception of Parts / 7.6.1：
Part Segmentation / 7.6.2：
Global and Local Processing / 7.6.3：
Representing Shape and Structure / 8：
Shape Equivalence / 8.1：
Defining Objective Shape / 8.1.1：
Invariant Features / 8.1.2：
Transformational Alignment / 8.1.3：
Object-Centered Reference Frames / 8.1.4：
Theories of Shape Representation / 8.2：
Templates / 8.2.1：
Fourier Spectra / 8.2.2：
Features and Dimensions / 8.2.3：
Structural Descriptions / 8.2.4：
Figural Goodness and Pragnanz / 8.3：
Theories of Figural Goodness / 8.3.1：
Structural Information Theory / 8.3.2：
Perceiving Function and Category / 9：
The Perception of Function / 9.1：
Direct Perception of Affordances / 9.1.1：
Indirect Perception of Function by Categorization / 9.1.2：
Phenomena of Perceptual Categorization / 9.2：
Categorical Hierarchies / 9.2.1：
Perspective Viewing Conditions / 9.2.2：
Part Structure / 9.2.3：
Contextual Effects / 9.2.4：
Visual Agnosia / 9.2.5：
Theories of Object Categorization / 9.3：
Recognition by Components Theory / 9.3.1：
Accounting for Empirical Phenomena / 9.3.2：
Viewpoint-Specific Theories / 9.3.3：
Identifying Letters and Words / 9.4：
Identifying Letters / 9.4.1：
Identifying Words and Letters Within Words / 9.4.2：
The Interactive Activation Model / 9.4.3：
Perceiving Motion and Events / Part III：
Image Motion / 10.1：
The Computational Problem of Motion / 10.1.1：
Continuous Motion / 10.1.2：
Apparent Motion / 10.1.3：
Object Motion / 10.1.4：
Perceiving Object Velocity / 10.2.1：
Depth and Motion / 10.2.2：
Long-Range Apparent Motion / 10.2.3：
Dynamic Perceptual Organization / 10.2.4：
Self-Motion and Optic Flow / 10.3：
Induced Motion of the Self / 10.3.1：
Perceiving Self-Motion / 10.3.2：
Understanding Events / 10.4：
Biological Motion / 10.4.1：
Perceiving Causation / 10.4.2：
Intuitive Physics / 10.4.3：
Visual Selection: Eye Movements And Attention / 11：
Eye Movements / 11.1：
Types Of Eye Movements / 11.1.1：
The Physiology Of The Oculomotor System / 11.1.2：
Saccaadic Exploration Of The Visual Environment / 11.1.3：
Visual Attention / 11.2：
Early Versus Late Selection / 11.2.1：
Costs and Benefits of Attention / 11.2.2：
Theories of Spatial Attention / 11.2.3：
Selective Attention to Properties / 11.2.4：
Distributed versus Focused Attention / 11.2.5：
Feature Integration Theory / 11.2.6：
The Physiology of Attention / 11.2.7：
Attention and Eye Movements / 11.2.8：
Visual Memory and Imagery / 12：
Visual Memory / 12.1：
Three Memory Systems / 12.1.1：
Iconic Memory / 12.1.2：
Visual Short-Term Memory / 12.1.3：
Visual Long-Term Memory / 12.1.4：
Memory Dynamics / 12.1.5：
Visual Imagery / 12.2：
The Analog/Propositional Debate / 12.2.1：
Mental Transformtions / 12.2.2：
Image Inspection / 12.2.3：
Kosslyn's Model of Imagery / 12.2.4：
The Relation of Imagery to Perception / 12.2.5：
Visual Awareness / 13：
Philosophical Foundations / 13.1：
The Mind-Body Problem / 13.1.1：
The Problem of Other Minds / 13.1.2：
Neuropsychology of Visual Awareness / 13.2：
Split-Brain Patients / 13.2.1：
Blindsight / 13.2.2：
Unconscious Processing in Neglect and Balint's Syndrome / 13.2.3：
Unconscious Face Recognition in Prosopagnosia / 13.2.4：
Visual Awareness in Normal Observers / 13.3：
Perceptual Defense / 13.3.1：
Subliminal Perception / 13.3.2：
Inattentional Blindsight / 13.3.3：
Theories of Consciousness / 13.4：
Functional Architecture Theories / 13.4.1：
Biological Theories / 13.4.2：
Consciousness and the Limits of Science / 13.4.3：
Psychophysical Methods / Appendix A：
Measuring Thresholds / A.1：
Method of Adjustment / A.1.1：
Method of Limits / A.1.2：
Method of Constant Stimuli / A.1.3：
The Theoretical Status of Thresholds / A.1.4：
Signal Detection Theory / A.2：
Response Bias / A.2.1：
The Signal Detection Paradigm / A.2.2：
The Theory of Signal Detectability / A.2.3：
Difference Thresholds / A.3：
Just Noticeable Differences / A.3.1：
Weber's Law / A.3.2：
Psychophysical Scaling / A.4：
Fechner's Law / A.4.1：
Stevens's Law / A.4.2：
Suggestions for Futher Reading
Connectionist Modeling / Appendix B：
Network Behavior / B.1：
Unit Behavior / B.1.1：
System Architecture / B.1.2：
Systemic Behavior / B.1.3：
Connectionist Learning Algorithms / B.2：
Back Propagation / B.2.1：
Gradient Descent / B.2.2：
Color Technology / Appendix C：
Additive versus Subtractive Color Mixture / C.1：
Adding versus Multiplying Spectra / C.1.1：
Maxwell's Color Triangle / C.1.2：
C.I.E. Color Space / C.1.3：
Subtractive Color Mixture Space? / C.1.4：
Color Television / C.2：
Paints and Dyes / C.3：
Subtractive Combination of Paints / C.3.1：
Additive Combination of Paints / C.3.2：
Color Photography / C.4：
Color Printing / C.5：
Suggestions for Further Reading
Glossary
References
Name Index
Subject Index
Brief Contents
Contents
Preface
2.

図書
図書
2. Mechanical microsensors (: gw)
M. Elwenspoek, R. Wiegerink
出版情報: Berlin : Springer-Verlag, c2001  x, 295 p. ; 25 cm
シリーズ名: Microtechnology and MEMS
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Introduction / 1：
MEMS / 2：
Miniaturisation and Systems / 2.1：
Examples for MEMS / 2.2：
Bubble Jet / 2.2.1：
Actuators / 2.2.2：
Micropumps / 2.2.3：
Small and Large: Scaling / 2.3：
Electromagnetic Forces / 2.3.1：
Coulomb Friction / 2.3.2：
Mechanical Strength / 2.3.3：
Dynamic Properties / 2.3.4：
Available Fabrication Technology / 2.4：
Technologies Based on Lithography / 2.4.1：
Silicon Micromachining / 2.4.1.1：
LIGA / 2.4.1.2：
Miniaturisation of Conventional Technologies / 2.4.2：
Introduction into Silicon Micromachining / 3：
Photolithography / 3.1：
Thin Film Deposition and Doping / 3.2：
Silicon Dioxide / 3.2.1：
Chemical Vapour Deposition / 3.2.2：
Evaporation / 3.2.3：
Sputterdeposition / 3.2.4：
Doping / 3.2.5：
Wet Chemical Etching / 3.3：
Isotropic Etching / 3.3.1：
Anisotropic Etching / 3.3.2：
Etch Stop / 3.3.3：
Waferbonding / 3.4：
Anodic Bonding / 3.4.1：
Silicon Fusion Bonding / 3.4.2：
Plasma Etching / 3.5：
Plasma / 3.5.1：
Anisotropic Plasma Etching Modes / 3.5.2：
Configurations / 3.5.3：
Black Silicon Method / 3.5.4：
Surface Micromachining / 3.6：
Thin Film Stress / 3.6.1：
Sticking / 3.6.2：
Mechanics of Membranes and Beams / 4：
Dynamics of the Mass Spring System / 4.1：
Strings / 4.2：
Beams / 4.3：
Stress and Strain / 4.3.1：
Bending Energy / 4.3.2：
Radius of Curvature / 4.3.3：
Lagrange Function of a Flexible Beam / 4.3.4：
Differential Equation for Beams / 4.3.5：
Boundary Conditions for Beams / 4.3.6：
Examples / 4.3.7：
Mechanical Stability / 4.3.8：
Transversal Vibration of Beams / 4.3.9：
Diaphragms and Membranes / 4.4：
Circular Diaphragms / 4.4.1：
Square Membranes / 4.4.2：
Buckling of Bridges / Appendix 4.1：
Principles of Measuring Mechanical Quantities: Transduction of Deformation / 5：
Metal Strain Gauges / 5.1：
Semiconductor Strain Gauges / 5.2：
Piezoresistive Effect in Single Crystalline Silicon / 5.2.1：
Piezoresistive Effect in Polysilicon Thin Films / 5.2.2：
Transduction from Deformation to Resistance / 5.2.3：
Capacitive Transducers / 5.3：
Electromechanics / 5.3.1：
Diaphragm Pressure Sensors / 5.3.2：
Force and Pressure Sensors / 6：
Force Sensors / 6.1：
Load Cells / 6.1.1：
Pressure Sensors / 6.2：
Piezoresistive Pressure Sensors / 6.2.1：
Capacitive Pressure Sensors / 6.2.2：
Force Compensation Pressure Sensors / 6.2.3：
Resonant Pressure Sensors / 6.2.4：
Miniature Microphones / 6.2.5：
Tactile Imaging Arrays / 6.2.6：
Acceleration and Angular Rate Sensors / 7：
Acceleration Sensors / 7.1：
Bulk Micromachined Accelerometers / 7.1.1：
Surface Micromachined Accelerometers / 7.1.3：
Force Feedback / 7.1.4：
Angular Rate Sensors / 7.2：
Flow sensors / 8：
The Laminar Boundary Layer / 8.1：
The Navier-Stokes Equations / 8.1.1：
Heat Transport / 8.1.2：
Hydrodynamic Boundary Layer / 8.1.3：
Thermal Boundary Layer / 8.1.4：
Skin Friction and Heat Transfer / 8.1.5：
Heat Transport in the Limit of Very Small Reynolds Numbers / 8.2：
Thermal Flow Sensors / 8.3：
Anemometer Type Flow Sensors / 8.3.1：
Two-Wire Anemometers / 8.3.2：
Calorimetric Type Flow Sensors / 8.3.3：
Sound Intensity Sensors - The Microflown / 8.3.4：
Time of Flight Sensors / 8.3.5：
Skin Friction Sensors / 8.4：
"Dry Fluid Flow" Sensors / 8.5：
"Wet Fluid Flow" Sensors / 8.6：
Resonant Sensors / 9：
Basic Principles and Physics / 9.1：
The Differential Equation of a Prismatic Microbridge / 9.1.1：
Solving the Homogeneous, Undamped Problem using Laplace Transforms / 9.1.3：
Solving the Inhomogeneous Problem by Modal Analysis / 9.1.4：
Response to Axial Loads / 9.1.5：
Quality Factor / 9.1.6：
Nonlinear Large-Amplitude Effects / 9.1.7：
Excitation and Detection Mechanisms / 9.2：
Electrostatic Excitation and Capacitive Detection / 9.2.1：
Magnetic Excitation and Detection / 9.2.2：
Piezoelectric Excitation and Detection / 9.2.3：
Electrothermal Excitation and Piezoresistive Detection / 9.2.4：
Optothermal Excitation and Optical Detection / 9.2.5：
Dielectric Excitation and Detection / 9.2.6：
Examples and Applications / 9.3：
Electronic Interfacing / 10：
Piezoresistive Sensors / 10.1：
Wheatstone Bridge Configurations / 10.1.1：
Amplification of the Bridge Output Voltage / 10.1.2：
Noise and Offset / 10.1.3：
Feedback Control Loops / 10.1.4：
Interfacing with Digital Systems / 10.1.5：
Analog-to-Digital Conversion / 10.1.5.1：
Voltage to Frequency Converters / 10.1.5.2：
Capacitive Sensors / 10.2：
Impedance Bridges / 10.2.1：
Capacitance Controlled Oscillators / 10.2.2：
Frequency Dependent Behavior of Resonant Sensors / 10.3：
Realizing an Oscillator / 10.3.2：
One-Port Versus Two-Port Resonators / 10.3.3：
Oscillator Based on One-Port Electrostatically Driven Beam Resonator / 10.3.4：
Oscillator Based on Two-Port Electrodynamically Driven H-shaped Resonator / 10.3.5：
Packaging / 11：
Packaging Techniques / 11.1：
Standard Packages / 11.1.1：
Chip Mounting Methods / 11.1.2：
Wafer Level Packaging
Interconnection Techniques / 11.1.3：
Multichip Modules / 11.1.4：
Encapsulation Processes / 11.1.5：
Stress Reduction / 11.2：
Inertial Sensors / 11.3：
References / 11.5：
Index
Introduction / 1：
MEMS / 2：
Miniaturisation and Systems / 2.1：
3.

図書
図書
3. Multiple bonds between metal atoms. 2nd ed
F. Albert Cotton and Richard A. Walton
出版情報: Oxford : Clarendon Press , New York : Oxford University Press, 1993  xxii, 787 p. ; 25 cm
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Introduction and Survey
Prolog / 1.1：
From Werner to the new transition metal chemistry / 1.1.1：
Prior to about 1963 / 1.1.2：
How It All Began / 1.2：
Rhenium chemistry from 1963 to 1965 / 1.2.1：
The recognition of the quadruple bond / 1.2.2：
Initial work on other elements / 1.2.3：
An Overview of the Multiple Bonds / 1.3：
A qualitative picture of the quadruple bond / 1.3.1：
Bond orders less than four / 1.3.2：
Oxidation states / 1.3.3：
Growth of the Field / 1.4：
Going Beyond Two / 1.5：
Complexes of the Group 5 Elements
General Remarks / 2.1：
Divanadium Compounds / 2.2：
Triply-bonded divanadium compounds / 2.2.1：
Metal-metal vs metal-ligand bonding / 2.2.2：
Divanadium compounds with the highly reduced V23+ core / 2.2.3：
Diniobium Compounds / 2.3：
Diniobium paddlewheel complexes / 2.3.1：
Diniobium compounds with calix[4]arene ligands and related species / 2.3.2：
Tantalum / 2.4：
Chromium Compounds
Dichromium Tetracarboxylates / 3.1：
History and preparation / 3.1.1：
Properties of carboxylate compounds / 3.1.2：
Unsolvated Cr2(O2CR)4 compounds / 3.1.3：
Other Paddlewheel Compounds / 3.2：
The first 'supershort' bonds / 3.2.1：
2-Oxopyridinate and related compounds / 3.2.2：
Carboxamidate compounds / 3.2.3：
Amidinate compounds / 3.2.4：
Guanidinate compounds / 3.2.5：
Miscellaneous Dichromium Compounds / 3.3：
Compounds with intramolecular axial interactions / 3.3.1：
Compounds with Cr-C bonds / 3.3.2：
Other pertinent results / 3.3.3：
Concluding Remarks / 3.4：
Molybdenum Compounds
Dimolybdenum Bridged by Carboxylates or Other O,O Ligands / 4.1：
General remarks / 4.1.1：
Mo2(O2CR)4 compounds / 4.1.2：
Other compounds with bridging carboxyl groups / 4.1.3：
Paddlewheels with other O,O anion bridges / 4.1.4：
Paddlewheel Compounds with O,N, N,N and Other Bridging Ligands / 4.2：
Compounds with anionic O,N bridging ligands / 4.2.1：
Compounds with anionic N,N bridging ligands / 4.2.2：
Compounds with miscellaneous other anionic bridging ligands / 4.2.3：
Non-Paddlewheel Mo24+ Compounds / 4.3：
Mo2X84- and Mo2X6(H2O)22- compounds / 4.3.1：
[Mo2X8H]3- compounds / 4.3.2：
Other aspects of dimolybdenum halogen compounds / 4.3.3：
M2X4L4 and Mo2X4(LL)2 compounds / 4.3.4：
Cationic complexes of Mo24+ / 4.3.5：
Complexes of Mo24+ with macrocyclic, polydentate and chelate ligands / 4.3.6：
Alkoxide compounds of the types Mo2(OR)4L4 and Mo2(OR)4(LL)2 / 4.3.7：
Other Aspects of Mo24+ Chemistry / 4.4：
Cleavage of Mo24+ compounds / 4.4.1：
Redox behavior of Mo24+ compounds / 4.4.2：
Hydrides and organometallics / 4.4.3：
Heteronuclear Mo-M compounds / 4.4.4：
An overview of Mo-Mo bond lengths in Mo24+ compounds / 4.4.5：
Higher-order Arrays of Dimolybdenum Units / 4.5：
General concepts / 4.5.1：
Two linked pairs with carboxylate spectator ligands / 4.5.2：
Two linked pairs with nonlabile spectator ligands / 4.5.3：
Squares: four linked pairs / 4.5.4：
Loops: two pairs doubly linked / 4.5.5：
Rectangular cyclic quartets / 4.5.6：
Other structural types / 4.5.7：
Tungsten Compounds
Multiple Bonds in Ditungsten Compounds / 5.1：
The W24+ Tetracarboxylates / 5.2：
W24+ Complexes Containing Anionic Bridging Ligands Other Than Carboxylate / 5.3：
W24+ Complexes without Bridging Ligands / 5.4：
Compounds coordinated by only anionic ligands / 5.4.1：
Compounds coordinated by four anionic ligands and four neutral ligands / 5.4.2：
Multiple Bonds in Heteronuclear Dimetal Compounds of Molybdenum and Tungsten / 5.5：
Paddlewheel Compounds with W25+ or W26+ Cores / 5.6：
X3 M ≡ MX3 Compounds of Molybdenum and Tungsten
Introduction / 6.1：
Homoleptic X3M ≡ MX3 Compounds / 6.2：
Synthesis and characterization of homoleptic M2X6 compounds / 6.2.1：
Bonding in M2X6 compounds / 6.2.2：
X3M ≡ MX3 Compounds as Molecular Precursors to Extended Solids / 6.2.3：
M2X2(NMe2)4 and M2X4(NMe2)2 Compounds / 6.3：
Other M2X2Y4, M2X6-n Yn and Related Compounds / 6.4：
Mo2X2(CH2SiMe3)4 compounds / 6.4.1：
1,2-M2R2(NMe2)4 compounds and their derivatives / 6.4.2：
M4 Complexes: Clusters or Dimers? / 6.5：
Molybdenum and tungsten twelve-electron clusters M4(OR)12 / 6.5.1：
M4X4(OPri)8 (X = Cl, Br) and Mo4Br3(OPri)9 / 6.5.2：
W4 (p-tolyl)2 (OPri)10 / 6.5.3：
W4O(X)(OPri)9, (X = Cl or OPri) / 6.5.4：
K(18-crown-6)2Mo4(μ4-H)(OCH2But)12 / 6.5.5：
Linked M4 units containing localized MM triple bonds / 6.5.6：
M2X6L, M2X6L2 and Related Compounds / 6.6：
Mo2(CH2Ph)2(OPri)4(PMe3) and [Mo2(OR)7]- / 6.6.1：
M2(OR)6L2 compounds and their congeners / 6.6.2：
Amido-containing compounds / 6.6.3：
Mo2Br2(CHSiMe3)2(PMe3)4 / 6.6.4：
Calix[4]arene complexes / 6.6.5：
Triple Bonds Uniting Five- and Six-Coordinate Metal Atoms / 6.7：
Redox Reactions at the M26+ Unit / 6.8：
Organometallic Chemistry of M2(OR)6 and Related Compounds / 6.9：
Carbonyl adducts and their products / 6.9.1：
Isocyanide complexes / 6.9.2：
Reactions with alkynes / 6.9.3：
Reactions with C≡N bonds / 6.9.4：
Reactions with C=C bonds / 6.9.5：
Reactions with H2 / 6.9.6：
Reactions with organometallic compounds / 6.9.7：
(η-C5H4R)2W2X4 compounds where R = Me, Pri and X = Cl, Br / 6.9.8：
Conclusion / 6.10：
Technetium Compounds
Synthesis and Properties of Technetium / 7.1：
Preparation of Dinuclear and Polynuclear Technetium Compounds / 7.2：
Bonds of Order 4 and 3.5 / 7.3：
Tc26+ and Tc25+ Carboxylates and Related Species with Bridging Ligands / 7.4：
Bonds of Order 3 / 7.5：
Hexanuclear and Octanuclear Technetium Clusters / 7.6：
Rhenium Compounds
The Last Naturally Occurring Element to Be Discovered / 8.1：
Synthesis and Structure of the Octachlorodirhenate(III) Anion / 8.2：
Synthesis and Structure of the Other Octahalodirhenate(III) Anions / 8.3：
Substitution Reactions of the Octahalodirhenate(III) Anions that Proceed with Retention of the Re26+ Core / 8.4：
Monodentate anionic ligands / 8.4.1：
The dirhenium(III) carboxylates / 8.4.2：
Other anionic ligands / 8.4.3：
Neutral ligands / 8.4.4：
Dirhenium Compounds with Bonds of Order 3.5 and 3 / 8.5：
The first metal-metal triple bond: Re2Cl5(CH3SCH2CH2SCH3)2 and related species / 8.5.1：
Simple electron-transfer chemistry involving the octahalodirhenate(III) anions and related species that contain quadruple bonds / 8.5.2：
Oxidation of [Re2X8]2- to the nonahalodirhenate anions [Re2X9]n- (n = 1 or 2) / 8.5.3：
Re25+ and Re24+ halide complexes that contain phosphine ligands / 8.5.4：
Other Re25+ and Re24+ complexes / 8.5.5：
Other dirhenium compounds with triple bonds / 8.5.6：
Dirhenium Compounds with Bonds of Order Less than 3 / 8.6：
Cleavage of Re-Re Multiple Bonds by o-donor and π-acceptor Ligands / 8.7：
σ-Donor ligands / 8.7.1：
Jπ-Acceptor ligands / 8.7.2：
Other Types of Multiply Bonded Dirhenium Compounds / 8.8：
Postscript on Recent Developments / 8.9：
Ruthenium Compounds
Ru25+ Compounds / 9.1：
Ru25+ compounds with O,O′-donor bridging ligands / 9.2.1：
Ru25+ compounds with N,O-donor bridging ligands / 9.2.2：
Ru25+ compounds with N,N′-donor bridging ligands / 9.2.3：
Ru24+ Compounds / 9.3：
Ru24+ compounds with O,O′-donor bridging ligands / 9.3.1：
Ru24+ compounds with N,O-donor bridging ligands / 9.3.2：
Ru24+ compounds with N,N′-donor bridging ligands / 9.3.3：
Ru26+ Compounds / 9.4：
Ru26+ compounds with O,O′-donor bridging ligands / 9.4.1：
Ru26+ compounds with N,N′-donor bridging ligands / 9.4.2：
Compounds with Macrocyclic Ligands / 9.5：
Applications / 9.6：
Catalytic activity / 9.6.1：
Biological importance / 9.6.2：
Osmium Compounds
Syntheses, Structures and Reactivity of Os26+ Compounds / 10.1：
Syntheses and Structures of Os25+ Compounds / 10.2：
Syntheses and Structures of Other Os2 Compounds / 10.3：
Magnetism, Electronic Structures, and Spectroscopy / 10.4：
Iron, Cobalt and Iridium Compounds / 10.5：
Di-iron Compounds / 11.1：
Dicobalt Compounds / 11.3：
Tetragonal paddlewheel compounds / 11.3.1：
Trigonal paddlewheel compounds / 11.3.2：
Dicobalt compounds with unsupported bonds / 11.3.3：
Compounds with chains of cobalt atoms / 11.3.4：
Di-iridium Compounds / 11.4：
Paddlewheel compounds and related species / 11.4.1：
Unsupported Ir-Ir bonds / 11.4.2：
Other species with Ir-Ir bonds / 11.4.3：
Iridium blues / 11.4.4：
Rhodium Compounds
Dirhodium Tetracarboxylato Compounds / 12.1：
Preparative methods and classification / 12.2.1：
Structural studies / 12.2.2：
Other Dirhodium Compounds Containing Bridging Ligands / 12.3：
Complexes with fewer than four carboxylate bridging groups / 12.3.1：
Complexes supported by hydroxypyridinato, carboxamidato and other (N, O) donor monoanionic bridging groups / 12.3.2：
Complexes supported by amidinato and other (N, N) donor bridging groups / 12.3.3：
Complexes supported by sulfur donor bridging ligands / 12.3.4：
Complexes supported by phosphine and (P, N) donor bridging ligands / 12.3.5：
Complexes supported by carbonate, sulfate and phosphate bridging groups / 12.3.6：
Dirhodium Compounds with Unsupported Rh-Rh Bonds / 12.4：
The dirhodium(II) aquo ion / 12.4.1：
The [Rh2(NCR)10]4+ cations / 12.4.2：
Complexes with chelating and macrocyclic nitrogen ligands / 12.4.3：
Other Dirhodium Compounds / 12.5：
Complexes with isocyanide ligands / 12.5.1：
Rhodium blues / 12.5.2：
Reactions of Rh24+ Compounds / 12.6：
Oxidation to Rh25+ and Rh26+ species / 12.6.1：
Cleavage of the Rh-Rh bond / 12.6.2：
Applications of Dirhodium Compounds / 12.7：
Catalysis / 12.7.1：
Supramolecular arrays based on dirhodium building blocks / 12.7.2：
Biological applications of dirhodium compounds / 12.7.3：
Photocatalytic reactions / 12.7.4：
Other applications / 12.7.5：
Chiral Dirhodium(II) Catalysts and Their Applications
Synthetic and Structural Aspects of Chiral Dirhodium(II) Carboxamidates / 13.1：
Synthetic and Structural Aspects of Dirhodium(II) Complexes Bearing Orthometalated Phosphines / 13.3：
Dirhodium(II) Compounds as Catalysts / 13.4：
Catalysis of Diazo Decomposition / 13.5：
Chiral Dirhodium(II) Carboxylates / 13.6：
Chiral Dirhodium(II) Carboxamidates / 13.7：
Catalytic Asymmetric Cyclopropanation and Cyclopropenation / 13.8：
Intramolecular reactions / 13.8.1：
Intermolecular reactions / 13.8.2：
Cyclopropenation / 13.8.3：
Macrocyclization / 13.8.4：
Metal Carbene Carbon-Hydrogen Insertion / 13.9：
Catalytic Ylide Formation and Reactions / 13.9.1：
Additional Transformations of Diazo Compounds Catalyzed by Dirhodium(II) / 13.11：
Silicon-Hydrogen Insertion / 13.12：
Nickel, Palladium and Platinum Compounds
Dinickel Compounds / 14.1：
Dipalladium Compounds / 14.3：
A singly bonded Pd26+ species / 14.3.1：
Chemistry of Pd25+ and similar species / 14.3.2：
Other compounds with Pd-Pd interactions / 14.3.3：
Diplatinum Compounds / 14.4：
Complexes with sulfate and phosphate bridges / 14.4.1：
Complexes with pyrophosphite and related ligands / 14.4.2：
Complexes with carboxylate, formamidinate and related ligands / 14.4.3：
Complexes containing monoanionic bridging ligands with N,O and N,S donor sets / 14.4.4：
Unsupported Pt-Pt bonds / 14.4.5：
Dinuclear Pt25+ species / 14.4.6：
The platinum blues / 14.4.7：
Other compounds
Extended Metal Atom Chains
Overview / 15.1：
EMACs of Chromium / 15.2：
EMACs of Cobalt / 15.3：
EMACs of Nickel and Copper / 15.4：
EMACs of Ruthenium and Rhodium / 15.5：
Other Metal Atom Chains / 15.6：
Physical, Spectroscopic and Theoretical Results
Structural Correlations / 16.1：
Bond orders and bond lengths / 16.1.1：
Internal rotation / 16.1.2：
Axial ligands / 16.1.3：
Comparison of second and third transition series homologs / 16.1.4：
Disorder in crystals / 16.1.5：
Rearrangements of M2X8 type molecules / 16.1.6：
Diamagnetic anisotropy of M-M multiple bonds / 16.1.7：
Thermodynamics / 16.2：
Thermochemical data / 16.2.1：
Bond energies / 16.2.2：
Electronic Structure Calculations / 16.3：
Background / 16.3.1：
[M2X8]n- and M2X4(PR3)4 species / 16.3.2：
The M2(O2CR)4 (M = Cr, Mo, W) molecules / 16.3.3：
M2(O2CR)4R′2 (M = Mo, W) compounds / 16.3.4：
Dirhodium species / 16.3.5：
Diruthenium compounds / 16.3.6：
M2X6 molecules (M = Mo, W) / 16.3.7：
Other calculations / 16.3.8：
Electronic Spectra / 16.4：
Details of the δ manifold of states / 16.4.1：
Observed δ → δ* transitions / 16.4.2：
Other electronic absorption bands of Mo2, W2, Tc2 and Re2 species / 16.4.3：
Spectra of Rh2, Pt2, Ru2 and Os2 compounds / 16.4.4：
CD and ORD spectra / 16.4.5：
Excited state distortions inferred from vibronic structure / 16.4.6：
Emission spectra and photochemistry / 16.4.7：
Photoelectron Spectra / 16.5：
Paddlewheel molecules / 16.5.1：
Other tetragonal molecules / 16.5.2：
M2X6 molecules / 16.5.3：
Miscellaneous other PES results / 16.5.4：
Vibrational Spectra / 16.6：
M-M stretching vibrations / 16.6.1：
M-L stretching vibrations / 16.6.2：
Other types of Spectra / 16.7：
Electron Paramagnetic Resonance / 16.7.1：
X-Ray spectra, EXAFS, and XPS / 16.7.2：
Abbreviations
Index
Introduction and Survey
Prolog / 1.1：
From Werner to the new transition metal chemistry / 1.1.1：
4.

図書
図書
4. Mesoscopic electronics in solid state nanostructures
Thomas Heinzel
出版情報: Weinheim : Wiley-VCH, c2003  337 p. ; 25 cm
所蔵情報: loading…
目次情報: 続きを見る
Introduction / 1：
Preliminary remarks / 1.1：
Mesoscopic transport / 1.2：
Ballistic transport / 1.2.1：
The quantum Hall effect and Shubnikov - de Haas oscillations / 1.2.2：
Size quantization / 1.2.3：
Phase coherence / 1.2.4：
Single electron tunnelling and quantum dots / 1.2.5：
Superlattices / 1.2.6：
Samples and experimental techniques / 1.2.7：
An Update of Solid State Physics / 2：
Crystal structures / 2.1：
Electronic energy bands / 2.2：
Occupation of energy bands / 2.3：
The electronic density of states / 2.3.1：
Occupation probability and chemical potential / 2.3.2：
Intrinsic carrier concentration / 2.3.3：
Envelope wave functions / 2.4：
Doping / 2.5：
Diffusive transport and the Boltzmann equation / 2.6：
The Boltzmann equation / 2.6.1：
The conductance predicted by the simplified Boltzmann equation / 2.6.2：
The magneto-resistivity tensor / 2.6.3：
Scattering mechanisms / 2.7：
Screening / 2.8：
Surfaces, Interfaces, and Layered Devices / 3：
Electronic surface states / 3.1：
Surface states in one dimension / 3.1.1：
Surfaces of 3-dimensional crystals / 3.1.2：
Band bending and Fermi level pinning / 3.1.3：
Semiconductor-metal interfaces / 3.2：
Band alignment and Schottky barriers / 3.2.1：
Ohmic contacts / 3.2.2：
Semiconductor heterointerfaces / 3.3：
Field effect transistors and quantum wells / 3.4：
The silicon metal-oxide-semiconductor FET (Si-MOSFET) / 3.4.1：
The Ga[Al]As high electron mobility transistor (GaAs-HEMT) / 3.4.2：
Other types of layered devices / 3.4.3：
Quantum confined carriers in comparison to bulk carriers / 3.4.4：
Experimental Techniques / 4：
Sample fabrication / 4.1：
Single crystal growth / 4.1.1：
Growth of layered structures / 4.1.2：
Lateral patterning / 4.1.3：
Metallization / 4.1.4：
Bonding / 4.1.5：
Elements of cryogenics / 4.2：
Properties of liquid helium / 4.2.1：
Helium cryostats / 4.2.2：
Electronic measurements on nanostructures / 4.3：
Sample holders / 4.3.1：
Application and detection of electronic signals / 4.3.2：
Important Quantities in Mesoscopic Transport / 5：
Magnetotransport Properties of Quantum Films / 6：
Landau quantization / 6.1：
2DEGs in perpendicular magnetic fields / 6.1.1：
The chemical potential in strong magnetic fields / 6.1.2：
The quantum Hall effect / 6.2：
Phenomenology / 6.2.1：
Origin of the integer quantum Hall effect / 6.2.2：
The quantum Hall effect and three dimensions / 6.2.3：
Elementary analysis of Shubnikov-de Haas oscillations / 6.3：
Some examples of magnetotransport experiments / 6.4：
Quasi-two-dimensional electron gases / 6.4.1：
Mapping of the probability density / 6.4.2：
Displacement of the quantum Hall plateaux / 6.4.3：
Parallel magnetic fields / 6.5：
Quantum Wires and Quantum Point Contacts / 7：
Diffusive quantum wires / 7.1：
Basic properties / 7.1.1：
Boundary scattering / 7.1.2：
Ballistic quantum wires / 7.2：
Conductance quantization in QPCs / 7.2.1：
Magnetic field effects / 7.2.3：
The "0.7 structure" / 7.2.4：
Four-probe measurements on ballistic quantum wires / 7.2.5：
The Landauer-Buttiker formalism / 7.3：
Edge states / 7.3.1：
Edge channels / 7.3.2：
Further examples of quantum wires / 7.4：
Conductance quantization in conventional metals / 7.4.1：
Carbon nanotubes / 7.4.2：
Quantum point contact circuits / 7.5：
Non-ohmic behavior of collinear QPCs / 7.5.1：
QPCs in parallel / 7.5.2：
Concluding remarks / 7.6：
Electronic Phase Coherence / 8：
The Aharonov-Bohm effect in mesoscopic conductors / 8.1：
Weak localization / 8.2：
Universal conductance fluctuations / 8.3：
Phase coherence in ballistic 2DEGs / 8.4：
Resonant tunnelling and S - matrices / 8.5：
Singe Electron Tunnelling / 9：
The principle of Coulomb blockade / 9.1：
Basic single electron tunnelling circuits / 9.2：
Coulomb blockade at the double barrier / 9.2.1：
Current-voltage characteristics: the Coulomb staircase / 9.2.2：
The SET transistor / 9.2.3：
SET circuits with many islands; the single electron pump / 9.3：
Quantum Dots / 10：
Phenomenology of quantum dots / 10.1：
The constant interaction model / 10.2：
Beyond the constant interaction model / 10.3：
Shape of conductance resonances and current-voltage characteristics / 10.4：
Other types of quantum dots / 10.5：
Mesoscopic Superlattices / 11：
One-dimensional superlattices / 11.1：
Two-dimensional superlattices / 11.2：
SI and cgs Units / A：
Appendices
Correlation and Convolution / B：
Fourier transofrmation / B.1：
Convolutions / B.2：
Correlation functions / B.3：
Capacitance Matrix and Electrostatic Energy / C：
The Transfer Hamiltonian / D：
Solutions to Selected Exercises / E：
References
Index
Introduction / 1：
Preliminary remarks / 1.1：
Mesoscopic transport / 1.2：
5.

図書
図書
5. Basic principles (: pbk)
Alfredo H-S. Ang, Wilson H. Tang
出版情報: New York : Wiley, 1975  xiii, 409 p. ; 24 cm
シリーズ名: Probability concepts in engineering planning and design ; v. 1
所蔵情報: loading…
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Role of Probability in Engineering / 1：
Introduction / 1.1：
Uncertainty in Real-World Information / 1.2：
Uncertainty Associated with Randomness / 1.2.1：
Uncertainty Associated with Imperfect Modeling and Estimation / 1.2.2：
Design and Decision-Making Under Uncertainty / 1.3：
Planning and Design of Airport Pavement / 1.3.1：
Hydrologic Design / 1.3.2：
Design of Structures and Machines / 1.3.3：
Geotechnical Design / 1.3.4：
Construction Planning and Management / 1.3.5：
Photogrammetric, Geodetic, and Surveying Measurements / 1.3.6：
Control and Standards / 1.4：
Concluding Remarks / 1.5：
Basic Probability Concepts / 2：
Events and Probability / 2.1：
Characteristics of Probability Problems / 2.1.1：
Calculation of Probability / 2.1.2：
Elements of Set Theory / 2.2：
Definitions / 2.2.1：
Combination of Events / 2.2.2：
Operational Rules / 2.2.3：
Mathematics of Probability / 2.3：
Basic Axioms of Probability Addition Rule / 2.3.1：
Conditional Probability Multiplication Rule / 2.3.2：
Theorem of Total Probability / 2.3.3：
Bayes' Theorem / 2.3.4：
Concluding Remarks Problems / 2.4：
Analytical Models of Random Phenomena / 3：
Random Variables / 3.1：
Probability Distribution of a Random Variable / 3.1.1：
Main Descriptors of a Random Variable / 3.1.2：
Useful Probability Distributions / 3.2：
The Normal Distribution / 3.2.1：
The Logarithmic Normal Distribution / 3.2.2：
Bernoulli Sequence and the Binomial Distribution / 3.2.3：
The Geometric Distribution / 3.2.4：
The Negative Binomial Distribution / 3.2.5：
The Poisson Process and Poisson Distribution / 3.2.6：
The Exponential Distribution / 3.2.7：
The Gamma Distribution / 3.2.8：
The Hypergeometric Distribution / 3.2.9：
The Beta Distribution / 3.2.10：
Other Distributions / 3.2.11：
Multiple Random Variables / 3.3：
Joint and Conditional Probability Distributions / 3.3.1：
Covariance and Correlation / 3.3.2：
Conditional Mean and Variance / 3.3.3：
Functions of Random Variables / 3.4：
Derived Probability Distributions / 4.1：
Function of Single Random Variable / 4.2.1：
Function of Multiple Random Variables / 4.2.2：
Moments of Functions of Random Variables / 4.3：
Mean and Variance of a Linear Function / 4.3.1：
Product of Independent Variates / 4.3.3：
Mean and Variance of a General Function / 4.3.4：
Estimating Parameters from Observational Data / 4.4：
The Role of Statistical Inference in Engineering / 5.1：
Inherent Variability and Estimation Error / 5.1.1：
Classical Approach to Estimation of Parameters / 5.2：
Random Sampling and Point Estimation / 5.2.1：
Interval Estimation of the Mean / 5.2.2：
Problems of Measurement Theory / 5.2.3：
Interval Estimation of the Variance / 5.2.4：
Estimation of Proportion / 5.2.5：
Empirical Determination of Distribution Models / 5.3：
Probability Paper / 6.1：
The Normal Probability Paper / 6.2.1：
The Log-Normal Probability Paper / 6.2.2：
Construction of General Probability Paper / 6.2.3：
Testing Validity of Assumed Distribution / 6.3：
Chi-Square Test for Distribution / 6.3.1：
Kolmogorov-Smirnov Test for Distribution / 6.3.2：
Regression and Correlation Analyses / 6.4：
Basic Formulation of Linear Regression / 7.1：
Regression with Constant Variance / 7.1.1：
Regression with Nonconstant Variance / 7.1.2：
Multiple Linear Regression / 7.2：
Nonlinear Regression / 7.3：
Applications of Regression Analysis in Engineering / 7.4：
Correlation Analysis / 7.5：
Estimation of Correlation Coefficient / 7.5.1：
The Bayesian Approach / 7.6：
Basic Concepts-The Discrete Case / 8.1：
The Continuous Case / 8.3：
General Formulation / 8.3.1：
A Special Application of Bayesian Up-dating Process / 8.3.2：
Bayesian Concepts in Sampling Theory / 8.4：
Sampling from Normal Population / 8.4.1：
Error in Estimation / 8.4.3：
Use of Conjugate Distributions / 8.4.4：
Elements of Quality Assurance and Acceptance Sampling / 8.5：
Acceptance Sampling by Attributes / 9.1：
The Operating Characteristic (OC) Curve / 9.1.1：
The Success Run / 9.1.2：
The Average Outgoing Quality Curve / 9.1.3：
Acceptance Sampling by Variables / 9.2：
Average Quality Criterion, sigma Known / 9.2.1：
Average Quality Criterion, sigma Unknown / 9.2.2：
Fraction Defective Criterion / 9.2.3：
Multiple-Stage Sampling / 9.3：
Probability Tables / 9.4：
Table of Standard Normal Probability / Table A.1：
p-Percentile Values of the t-Distribution / Table A.2：
p-Percentile Values of the x 2 -Distribution / Table A.3：
Critical Values of D alpha; in the Kolmogorov-Smirnov Test / Table A.4：
Combinatorial Formulas / Appendix B：
Derivation of the Poisson Distribution / Appendix C：
References
Index
Role of Probability in Engineering / 1：
Introduction / 1.1：
Uncertainty in Real-World Information / 1.2：
6.

図書
図書
6. Nonlinear fiber optics
Govind P. Agrawal
出版情報: Boston ; Tokyo : Academic Press, c1989  xii, 342 p. ; 24 cm
シリーズ名: Quantum electronics : principles and applications
所蔵情報: loading…
目次情報: 続きを見る
Preface
Introduction / 1：
Historical Perspective / 1.1：
Fiber Characteristics / 1.2：
Material and Fabrication / 1.2.1：
Fiber Losses / 1.2.2：
Chromatic Dispersion / 1.2.3：
Polarization-Mode Dispersion / 1.2.4：
Fiber Nonlinearities / 1.3：
Nonlinear Refraction / 1.3.1：
Stimulated Inelastic Scattering / 1.3.2：
Importance of Nonlinear Effects / 1.3.3：
Overview / 1.4：
Problems
References
Pulse Propagation in Fibers / 2：
Maxwell's Equations / 2.1：
Fiber Modes / 2.2：
Eigenvalue Equation / 2.2.1：
Single-Mode Condition / 2.2.2：
Characteristics of the Fundamental Mode / 2.2.3：
Pulse-Propagation Equation / 2.3：
Nonlinear Pulse Propagation / 2.3.1：
Higher-Order Nonlinear Effects / 2.3.2：
Numerical Methods / 2.4：
Split-Step Fourier Method / 2.4.1：
Finite-Difference Methods / 2.4.2：
Group-Velocity Dispersion / 3：
Different Propagation Regimes / 3.1：
Dispersion-Induced Pulse Broadening / 3.2：
Gaussian Pulses / 3.2.1：
Chirped Gaussian Pulses / 3.2.2：
Hyperbolic-Secant Pulses / 3.2.3：
Super-Gaussian Pulses / 3.2.4：
Experimental Results / 3.2.5：
Third-Order Dispersion / 3.3：
Changes in Pulse Shape / 3.3.1：
Broadening Factor / 3.3.2：
Arbitrary-Shape Pulses / 3.3.3：
Ultrashort-Pulse Measurements / 3.3.4：
Dispersion Management / 3.4：
GVD-Induced Limitations / 3.4.1：
Dispersion Compensation / 3.4.2：
Compensation of Third-Order Dispersion / 3.4.3：
Self-Phase Modulation / 4：
SPM-Induced Spectral Broadening / 4.1：
Nonlinear Phase Shift / 4.1.1：
Changes in Pulse Spectra / 4.1.2：
Effect of Pulse Shape and Initial Chirp / 4.1.3：
Effect of Partial Coherence / 4.1.4：
Effect of Group-Velocity Dispersion / 4.2：
Pulse Evolution / 4.2.1：
Optical Wave Breaking / 4.2.2：
Effect of Third-Order Dispersion / 4.2.4：
Self-Steepening / 4.3：
Effect of GVD on Optical Shocks / 4.3.2：
Intrapulse Raman Scattering / 4.3.3：
Optical Solitons / 5：
Modulation Instability / 5.1：
Linear Stability Analysis / 5.1.1：
Gain Spectrum / 5.1.2：
Experimental Observation / 5.1.3：
Ultrashort Pulse Generation / 5.1.4：
Impact on Lightwave Systems / 5.1.5：
Fiber Solitons / 5.2：
Inverse Scattering Method / 5.2.1：
Fundamental Soliton / 5.2.2：
Higher-Order Solitons / 5.2.3：
Experimental Confirmation / 5.2.4：
Soliton Stability / 5.2.5：
Other Types of Solitons / 5.3：
Dark Solitons / 5.3.1：
Dispersion-Managed Solitons / 5.3.2：
Bistable Solitons / 5.3.3：
Perturbation of Solitons / 5.4：
Perturbation Methods / 5.4.1：
Soliton Amplification / 5.4.2：
Soliton Interaction / 5.4.4：
Higher-Order Effects / 5.5：
Propagation of Femtosecond Pulses / 5.5.1：
Polarization Effects / 6：
Nonlinear Birefringence / 6.1：
Origin of Nonlinear Birefringence / 6.1.1：
Coupled-Mode Equations / 6.1.2：
Elliptically Birefringent Fibers / 6.1.3：
Nondispersive XPM / 6.2：
Optical Kerr Effect / 6.2.2：
Pulse Shaping / 6.2.3：
Evolution of Polarization State / 6.3：
Analytic Solution / 6.3.1：
Poincare-Sphere Representation / 6.3.2：
Polarization Instability / 6.3.3：
Polarization Chaos / 6.3.4：
Vector Modulation Instability / 6.4：
Low-Birefringence Fibers / 6.4.1：
High-Birefringence Fibers / 6.4.2：
Isotropic Fibers / 6.4.3：
Birefringence and Solitons / 6.4.4：
Soliton-Dragging Logic Gates / 6.5.1：
Vector Solitons / 6.5.4：
Random Birefringence / 6.6：
Polarization State of Solitons / 6.6.1：
Cross-Phase Modulation / 7：
XPM-Induced Nonlinear Coupling / 7.1：
Nonlinear Refractive Index / 7.1.1：
Coupled NLS Equations / 7.1.2：
Propagation in Birefringent Fibers / 7.1.3：
XPM-Induced Modulation Instability / 7.2：
XPM-Paired Solitons / 7.2.1：
Bright-Dark Soliton Pair / 7.3.1：
Bright-Gray Soliton Pair / 7.3.2：
Other Soliton Pairs / 7.3.3：
Spectral and Temporal Effects / 7.4：
Asymmetric Spectral Broadening / 7.4.1：
Asymmetric Temporal Changes / 7.4.2：
Applications of XPM / 7.4.3：
XPM-Induced Pulse Compression / 7.5.1：
XPM-Induced Optical Switching / 7.5.2：
XPM-Induced Nonreciprocity / 7.5.3：
Stimulated Raman Scattering / 8：
Basic Concepts / 8.1：
Raman-Gain Spectrum / 8.1.1：
Raman Threshold / 8.1.2：
Coupled Amplitude Equations / 8.1.3：
Quasi-Continuous SRS / 8.2：
Single-Pass Raman Generation / 8.2.1：
Raman Fiber Lasers / 8.2.2：
Raman Fiber Amplifiers / 8.2.3：
Raman-Induced Crosstalk / 8.2.4：
SRS with Short Pump Pulses / 8.3：
Pulse-Propagation Equations / 8.3.1：
Nondispersive Case / 8.3.2：
Effects of GVD / 8.3.3：
Synchronously Pumped Raman Lasers / 8.3.4：
Soliton Effects / 8.4：
Raman Solitons / 8.4.1：
Raman Soliton Lasers / 8.4.2：
Soliton-Effect Pulse Compression / 8.4.3：
Effect of Four-Wave Mixing / 8.5：
Stimulated Brillouin Scattering / 9：
Physical Process / 9.1：
Brillouin-Gain Spectrum / 9.1.2：
Quasi-CW SBS / 9.2：
Coupled Intensity Equations / 9.2.1：
Brillouin Threshold / 9.2.2：
Gain Saturation / 9.2.3：
Dynamic Aspects / 9.2.4：
Relaxation Oscillations / 9.3.1：
Modulation Instability and Chaos / 9.3.3：
Transient Regime / 9.3.4：
Brillouin Fiber Lasers / 9.4：
CW Operation / 9.4.1：
Pulsed Operation / 9.4.2：
SBS Applications / 9.5：
Brillouin Fiber Amplifiers / 9.5.1：
Fiber Sensors / 9.5.2：
Parametric Processes / 10：
Origin of Four-Wave Mixing / 10.1：
Theory of Four-Wave Mixing / 10.2：
Approximate Solution / 10.2.1：
Effect of Phase Matching / 10.2.3：
Ultrafast FWM / 10.2.4：
Phase-Matching Techniques / 10.3：
Physical Mechanisms / 10.3.1：
Phase Matching in Multimode Fibers / 10.3.2：
Phase Matching in Single-Mode Fibers / 10.3.3：
Phase Matching in Birefringent Fibers / 10.3.4：
Parametric Amplification / 10.4：
Gain and Bandwidth / 10.4.1：
Pump Depletion / 10.4.2：
Parametric Amplifiers / 10.4.3：
Parametric Oscillators / 10.4.4：
FWM Applications / 10.5：
Wavelength Conversion / 10.5.1：
Phase Conjugation / 10.5.2：
Squeezing / 10.5.3：
Supercontinuum Generation / 10.5.4：
Second-Harmonic Generation / 10.6：
Physical Mechanism / 10.6.1：
Simple Theory / 10.6.3：
Quasi-Phase-Matching Technique / 10.6.4：
Decibel Units / Appendix A：
Acronyms / Appendix B：
Index
Preface
Introduction / 1：
Historical Perspective / 1.1：
7.

図書
図書
7. Thermal deformation in machine tools
edited by Yoshimi Ito
出版情報: New York : McGraw-Hill, c2010  xx, 214 p. ; 24 cm
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目次情報: 続きを見る
Preface
Abbreviations
Nomenclature
Table for Conversation
Fundamentals in Design of Structural Body Components / 1：
Necessities and Importance of Lightweighted Structure in Reduction of Thermal Deformation-Discussion Using Mathematical Models / 1.1：
First-hand View for Lightweighted Structures with High Stiffness and Damping in Practice / 1.2：
Axi-symmetrical Configuration-Portal Column (Column of Twin-Pillar Type) / 1.2.1：
Placement and Allocation of Structural Configuration Entities / 1.2.2：
References
What Is Thermal Deformation? / 2：
General Behavior of Thermal Deformation / 2.1：
Estimation of Heat Sources and Their Magnitudes / 2.2：
Estimation of Heat Source Position / 2.2.1：
Estimation of Magnitude of Heat Generation / 2.2.2：
Estimation of Thermal Deformation of Machine Tools / 2.3：
Estimation of Thermal Deformation in General / 2.3.1：
Thermal Deformation Caused by Inner Heat Sources / 2.3.2：
Thermal Deformation Caused by Both Inner and Outer Heat Sources / 2.3.3：
Heat Sources Generated by Chips and Their Dissipation / 2.4：
Mathematical Model of Chips / 2.4.1：
Thermal Properties of Chips-Equivalent Thermal Conductivity and Contact Resistance / 2.4.2：
An Example of Heat Transfer from Piled Chips to Machine Tool Structure / 2.4.3：
Dissipation of Chips / 2.4.4：
Future Perspectives in Research and Development for Heat Sources and Dissipation / 2.5：
Structural Materials and Design for Preferable Thermal Stability / 3：
Remedies Concerning Raw Materials for Structural Body Components / 3.1：
Concrete / 3.1.1：
Painting and Coating Materials / 3.1.2：
New Materials / 3.1.3：
Remedies Concerning Structural Configurations and Plural-Spindle Systems / 3.2：
Non-Sensitive Structure / 3.2.1：
Non-Constraint Structure / 3.2.2：
Deformation Minimization Structure / 3.2.3：
Plural-Spindle Systems-Twin-Spindle Configuration Including Spindle-over-Spindle Type / 3.2.4：
Future Perspectives in Research and Development for Structural Configuration to Minimize Thermal Deformation / 3.3：
Two-Layered Spindle with Independent Rotating Function / 3.3.1：
Selective Modular Design for Advanced Quinaxial-Controlled MC with Turning Function / 3.3.2：
Various Remedies for Reduction of Thermal Deformation / 4：
Thermal Deformations and Effective Remedies / 4.1：
Classification of Remedies for Reduction of Thermal Deformation / 4.2：
Separation of Heat Sources / 4.2.1：
Reduction of Generated Heat / 4.2.2：
Equalization of Temperature Distribution / 4.2.3：
Compensation of Thermal Deformations / 4.2.4：
Innovative Remedies for Minimizing Thermal Deformation in the Near Future / 4.3：
Appendix
Optimization of Structural Design / A.1：
Finite Element Analysis for Thermal Behavior / 5：
Numerical Computation for Thermal Problems in General / 5.1：
Introduction / 5.1.1：
Finite Element Method / 5.1.2：
Finite Differences Method / 5.1.3：
Decision Making for the Selection of Methods / 5.1.4：
Procedure for Thermal Finite Element Analysis / 5.2：
Discretisation / 5.2.1：
Materials / 5.2.3：
Assembling Components to an Entire Machine Tool Model / 5.2.4：
Boundary Conditions / 5.2.5：
Loadcases / 5.2.6：
Linear and Non-Linear Thermal Computation / 5.2.7：
Determination of Boundary Conditions / 5.3：
Convection Heat Transfer Coefficients / 5.3.1：
Emission Coefficients and View Factors / 5.3.3：
Heat Sources and Sinks / 5.3.4：
Thermomechanical Simulation Process / 5.4：
Serial Processing / 5.4.1：
Coupled Processing / 5.4.3：
Future Perspectives in Research and Development for Thermal FEA / 5.5：
Engineering Computation for Thermal Behavior and Thermal Performance Test / 6：
Tank Model / 6.1：
Bond Graph Simulation to Estimate Thermal Behavior within High-Voltage and NC Controllers / 6.2：
Thermal Performance Testing / 6.3：
Index
Preface
Abbreviations
Nomenclature
8.

図書
図書
8. Handbook of geochemistry (Vol. 1 - Vol. 2, pt. 5)
executive editor: K. H. Wedepohl ; editorial board: C. W. Correns...[et al.]
出版情報: Berlin : Springer, 1969-  v. ; 26 cm
所蔵情報: loading…
9.

図書
図書
9. Lipids, carbohydrates, steroids. 3rd ed
editor, Gerald D. Fasman
出版情報: Cleveland, Ohio ; Boca Raton, Fla. : CRC Press, c1975  570 p. ; 26 cm
シリーズ名: CRC handbook of biochemistry and molecular biology / editor, Gerald D. Fasman ; [C]
所蔵情報: loading…
目次情報: 続きを見る
Technical and commercial considerations / D. R. Bain ; G. A. Giles1：
Introduction / 1.1：
General considerations / 1.1.1：
Rigid containers / 1.1.2：
Caps, lids, closures and devices / 1.1.3：
Blow-moulded containers / 1.1.4：
Flexible packaging / 1.1.5：
Technologies to complement material developments / 1.2：
Machinery / 1.2.1：
Robotics / 1.2.2：
Amalgamation and integration in the machinery industry / 1.2.3：
Co-extrusion, co-injection and multi-centre moulding / 1.3：
Handling plastics containers / 1.4：
Lightweighting / 1.5：
Closing plastics packaging / 1.6：
Cost and complexity reduction issues / 1.7：
Conclusions / 1.8：
Injection moulding / G. Staines2：
Machines / 2.1：
The moulding process / 2.3：
Materials / 2.4：
Polypropylene / 2.4.1：
PET / 2.4.2：
Multicavity moulding / 2.5：
Multilayer moulding / 2.6：
Packaging products / 2.7：
Inspection methods / 2.8：
Design / 2.9：
Foaming technology / 2.10：
In-mould labeling (IML) / 2.11：
Decoration and finishing techniques / 2.12：
The future / 2.13：
Appendix: trouble-shooting / 2.14：
Acknowledgements
Extrusion blow-moulding / V. Hind3：
Variations on a theme / 3.1：
Continuous extrusion blow-moulding / 3.2.1：
Continuous extrusion accumulator blow-moulding / 3.2.2：
Co-extrusion blow-moulding / 3.2.3：
Extrusion stretch blow-moulding / 3.2.4：
Injection blow-moulding / 3.2.5：
Injection stretch blow-moulding / 3.2.6：
Plastic materials used in blow-moulding / 3.3：
Plastics consumption in blow-moulding / 3.3.2：
Blow-moulding plastics properties / 3.3.3：
Extrusion blow-moulding technology / 3.4：
Extruder screws and barrels / 3.4.1：
Extrusion heads / 3.4.2：
Parison cutting / 3.4.3：
Parison control / 3.4.4：
Machine movements and construction / 3.4.5：
Machine control systems / 3.4.6：
Calibration and component inflation blowing / 3.4.7：
Blow-moulds / 3.4.8：
Automation / 3.4.9：
Materials and products / 3.5：
The injection blow-moulding process / 3.5.2：
Comparison of injection blow-moulding and extrusion blow-moulding / 3.5.3：
Co-extrusion / 3.6：
Scrap encapsulation / 3.6.1：
High-technology co-extrusion / 3.6.2：
Co-extrusion end uses / 3.6.3：
Conclusion / 3.7：
Process identification / M. Wortley4：
Basic principles / 4.2：
History / 4.3：
Commercial processes / 4.4：
Rotary table machines / 4.4.1：
Tooling / 4.5：
Procrea / 4.6：
Materials processed on IB / 4.7：
Typical products on IB / 4.8：
Machine and process capabilities / 4.9：
One-stage injection stretch blow-moulding / R. Blakeborough5：
PET Materials / 5.1：
Key properties / 5.2.1：
Drying / 5.2.2：
Requirements for a reliable drying system / 5.2.3：
Process monitoring / 5.2.4：
PET bottle and preform design / 5.3：
Design and material properties / 5.3.1：
Container design considerations / 5.3.2：
Preform design / 5.3.3：
Integrated two-stage machines / 5.4：
One-stage machine construction / 5.5：
Mould components and major processing factors on a classic four-station one-stage machine / 5.5.1：
Hot-fill PET bottles / 5.6：
Quality control procedures / 5.7：
Preform / 5.7.1：
Container / 5.7.2：
Additional tests for pressurised containers / 5.7.3：
Additional tests for hot-fill containers / 5.7.4：
Additional tests for returnable/refillable PET bottles / 5.7.5：
Two-stage injection stretch blow-moulding / M. Koch6：
The principles of the two-stage process / 6.1：
Technological PET material characteristics / 6.1.2：
Other plastic materials / 6.1.3：
Preform manufacturing / 6.2：
The process and its parameters / 6.2.1：
Injection moulding machine / 6.2.2：
Resin drying / 6.2.3：
Plasticising / 6.2.4：
Mould / 6.2.5：
Injection gates / 6.2.6：
Cavities / 6.2.7：
Injection / 6.2.8：
Melt distribution / 6.2.9：
Post cooling / 6.2.10：
Auxiliary equipment / 6.2.11：
Preform and production quality / 6.2.12：
Bottle Manufacturing / 6.3：
Preform re-heating / 6.3.1：
Stretch blow-moulding equipment / 6.3.3：
Mould technology / 6.3.4：
Line equipment / 6.3.5：
Two-stage vs single-stage process/equipment / 6.3.7：
Container quality / 6.4：
Dimensional stability / 6.4.1：
Functional quality / 6.4.2：
Container and preform design principles / 6.5：
Container design / 6.5.1：
Suppliers / 6.5.2：
References
Abbreviations
Thermoforming technologies for the manufacture of rigid plastics packaging / D.R. Bain7：
Sheet extrusion / 7.1：
Heating the sheet / 7.3：
Equipment and the moulding process / 7.4：
Polystyrene (PS) / 7.5：
Polyvinyl chloride (PVC) / 7.5.3：
High-density polyethylene (HDPE) / 7.5.4：
Polypropylene (PP) / 7.5.5：
Amorphous polyethylene terephthalate (APET) / 7.5.6：
Crystalline polyethylene terephthalate (CPET) / 7.5.7：
Applications / 7.6：
Blown film / M. C. Andrews ; K. J. Williams7.7：
A brief history / 8.1：
Why blown film? / 8.1.2：
Blow film extrusion technology / 8.2：
Blending / 8.2.1：
Extrusion / 8.2.2：
Blown film die design / 8.2.3：
Blown film cooling / 8.2.4：
Automatic thickness control / 8.2.5：
Bubble stabilisation / 8.2.6：
Bubble collapsing / 8.2.7：
Primary haul-off systems / 8.2.8：
Web handling / 8.2.9：
Slitting and winding / 8.2.10：
Control systems / 8.2.11：
Filling, labelling and handleability of plastic containers / D. Kaye9：
The source of the container supply / 9.1：
Supplying containers to the packing line / 9.3：
Remote container manufacturing / 9.3.1：
In-house container manufacture / 9.3.2：
The filling/packing line / 9.4：
The first machine in the line / 9.5：
Container cleaning / 9.5.1：
Container pre-labelling / 9.5.2：
Container orientation / 9.5.3：
Product filling / 9.6：
Level filling / 9.6.1：
Filling by volume / 9.6.2：
Filling by weight / 9.6.3：
Handling of plastic containers through the filling machine / 9.6.4：
Container capping/closing / 9.7：
Cap/closure types / 9.7.1：
Closure application / 9.7.2：
Method of cap transfer / 9.7.3：
Handling of containers through the capping machine / 9.7.4：
Closure torque control / 9.7.5：
Container decoration / 9.8：
Labelling machines / 9.8.1：
Handling of containers through the labelling machine / 9.8.2：
The importance of label adhesion / 9.8.3：
Sleeving / 9.8.4：
End of line packaging / 9.9：
Main types of packaging formats / 9.9.1：
Container laning / 9.9.2：
Palletising / 9.10：
Container conveying and layout considerations / 9.11：
Conveying of empty containers / 9.11.1：
Bloc and Superbloc units / 9.11.2：
Conveying of filled containers / 9.11.3：
Pack conveying / 9.11.4：
Plastic closures used in the consumer packaging market / B. Guglielmini10：
Closure systems / 10.1：
Different types of containers / 10.2.1：
Key features and functions of a closure / 10.2.2：
Typical plastics materials used for closures / 10.3：
Polyethylene (PE) / 10.3.1：
Technical polymers / 10.3.2：
Barrier polymers / 10.3.5：
Different technologies for the production of plastic closures / 10.4：
Compression moulding / 10.4.1：
Thermoforming / 10.4.3：
New trends in the closure industry / 10.5：
Co-injection and multi-centre moulding for bi-colour or multi-material products / 10.5.1：
Barrier technologies used for plastic closures / 10.5.2：
List of Polymers
Index
Technical and commercial considerations / D. R. Bain ; G. A. Giles1：
Introduction / 1.1：
General considerations / 1.1.1：
10.

図書
図書
10. Physical and chemical data. 3rd ed (v. 1 ; v. 2)
editor, Gerald D. Fasman
出版情報: Cleveland, Ohio ; Boca Raton, Fla. : CRC Press, c1976  2 v. ; 26 cm
シリーズ名: CRC handbook of biochemistry and molecular biology / editor, Gerald D. Fasman ; [D]
所蔵情報: loading…
目次情報: 続きを見る
Principles of automation in the dairy industry / W. Kirkland1：
Introduction and historical development / 1.1：
Automation and control of dairy processes / 1.2：
Process equipment / 1.2.1：
Sensors and actuators / 1.2.2：
Electrical cabling, fieldbus technology and smart devices / 1.2.3：
Programmable logic controllers / 1.2.4：
Soft programmable logic controllers and embedded controllers / 1.2.5：
Supervisory control and data acquisition / 1.2.6：
Network communications and systems integration / 1.2.7：
Manufacturing execution systems / 1.2.8：
Enterprise resource planning / 1.2.9：
Designing an automated process line / 1.3：
User requirements specification / 1.3.1：
Functional design specification / 1.3.2：
Design implementation: project management / 1.3.3：
The future / 1.4：
Further reading
Primary milk production / A. L. Kelly2：
Introduction / 2.1：
Global milk production trends / 2.1.1：
Farm production trends / 2.1.2：
Husbandry management and milk quality / 2.2：
Lactation cycle and milk quality / 2.2.1：
Effect of diet on milk composition / 2.2.3：
Influence of genetic factors and breed on milk quality / 2.2.4：
Mastitis, somatic cell counts and milk quality / 2.2.5：
Milking and feeding systems / 2.3：
Milking machines and effects on milk quality / 2.3.1：
Automated concentrate feeding systems / 2.3.2：
Bulk storage, collection and transportation / 2.4：
Milk cooling and storage / 2.4.1：
Milk collection and handling in developing countries / 2.4.2：
Quality payment schmes and quality optimization / 2.5：
Mastitis control strategies / 2.5.1：
Other animal welfare issues / 2.5.2：
Milk payment and acceptance schemes / 2.5.3：
Acknowledgements
References
Liquid milk / D. D. Muir ; A. Y. Tamime3：
Milk composition / 3.1：
Proteins in milk / 3.1.1：
Lactose and minerals / 3.1.2：
Milk fat / 3.1.3：
Heat-treated milk products / 3.2：
Chemical effects / 3.2.1：
Destruction of microorganisms and enzymes / 3.2.2：
Effects on other milk constituents / 3.2.3：
From farm to factory / 3.3：
Milk collection / 3.3.1：
Milk distribution / 3.3.2：
Delivery to the factory / 3.3.3：
Extension of the shelf-life of raw milk / 3.3.4：
At the factory / 3.3.5：
Milk handling in dairies / 3.4：
Reception of milk / 3.4.1：
Milk processing / 3.4.2：
Pasteurisation systems / 3.4.3：
Extended-shelf-life milk / 3.4.4：
High-temperature pasteurisation / 3.4.5：
In-container sterilisation / 3.4.6：
Ultra high temperature (UHT) / 3.4.7：
Recombination technology / 3.5：
Packaging lines and storage / 3.6：
Statistical process control / 3.7：
Acknowledgement
Concentrated and dried dairy products / P. De Jong ; R. E. M. Verdurmen4：
Evaporation / 4.1：
Drying / 4.1.2：
Product and process technology / 4.2：
Evaporated and dried products / 4.2.1：
Process design and operation / 4.2.2：
Quality control / 4.3：
Control of process conditions / 4.3.1：
Control of product properties / 4.3.2：
High fat content dairy products / H. M. P. Ranjith ; K. K. Rajah5：
Properties of milk fat / 5.1：
Melting and crystallisation / 5.1.2：
High fat content emulsions: oil-in-water type / 5.2：
Centrifugal separation / 5.2.1：
Control of fat content in creams / 5.2.2：
Cleaning of milk separators / 5.2.3：
Description of creams / 5.2.4：
Processing of cream / 5.2.5：
Factors affecting cream quality / 5.2.6：
Processing recommendations for high fat content products / 5.3：
Properties required of high fat emulsions for table spreads / 5.3.1：
Butter manufacture / 5.3.2：
Anhydrous milk fat / 5.3.3：
Ghee / 5.3.4：
Butterschmalz / 5.3.5：
Fractionation of milk fat / 5.4：
Yoghurt and other fermented milks / R. K. Robinson ; E. Latrille6：
Background / 6.1：
Classification of fermented milks / 6.2：
Mesophilic microfloras / 6.2.1：
Thermophilic and/or therapeutic microfloras / 6.2.2：
Microfloras including yeasts and lactic acid bacteria / 6.2.3：
Microfloras including moulds and lactic acid bacteria / 6.2.4：
Manufacture of fermented milks / 6.3：
Raw materials / 6.3.1：
Fortification of the milk / 6.3.2：
Heat treatment of the milk / 6.3.3：
Microbiology of the processes / 6.3.4：
Fermentation / 6.3.5：
Final processing / 6.3.6：
Retail products / 6.3.7：
Options for automation and mechanisation / 6.4：
Processing plants / 6.4.1：
Quick chilling, cold storage and retrieval of products / 6.4.4：
Product recovery / 6.4.5：
Automation in handling systems for finished product / 6.4.6：
Recent developments in some fermented-milk products / 6.5：
Long-life yoghurt / 6.5.1：
Strained or concentrated yoghurt / 6.5.2：
Dried fermented milks / 6.5.3：
Frozen yoghurt / 6.5.4：
Drinking yoghurt / 6.5.5：
Process control systems / 6.6：
Controlled variables / 6.6.1：
New reliable sensors for fermentation monitoring / 6.6.3：
Advanced monitoring: prediction of the final process time / 6.6.4：
Statistical process control and future trends / 6.6.5：
Cheddar cheese production / B. A. Law7：
Cheesemaking as process engineering / 7.1：
Coagulation of milk and curd formation / 7.3：
Vat design / 7.3.1：
Cutting and stirring / 7.3.2：
Theoretical aids to the optimisation of the cutting and scalding stage / 7.3.3：
Curd draining, cheddaring, milling and salting / 7.4：
Production of pressed cheese blocks ready for maturation / 7.5：
Storage and maturation of cheese / 7.6：
Semi-hard cheeses / G. Van Den Berg8：
Cheese varieties involved / 8.1：
General technology / 8.1.2：
General historical background / 8.1.3：
Basic technology / 8.2：
Milk handling and processing / 8.3：
Milk fat standardisation / 8.3.1：
Control of sporeformers by bactofugation and microfiltration / 8.3.2：
Pasteurisation / 8.3.3：
Cheese vats and curd production / 8.4：
Horizontal vats / 8.4.1：
Vertical vats / 8.4.2：
Preparation of the curd / 8.4.3：
Instrumentation to control and automate curd cutting time / 8.4.4：
Curd drainage and moulding / 8.5：
Buffer tanks / 8.5.1：
Casomatic systems / 8.5.2：
Pre-pressing vats / 8.5.3：
Pressing / 8.6：
Cheese pressing / 8.6.1：
Mould handling / 8.6.2：
Brining / 8.7：
Brine composition / 8.7.1：
Hygiene measures / 8.7.2：
Brining systems / 8.7.3：
Dry salting / 8.7.4：
Treatment during natural ripening / 8.8：
Cheese handling systems / 8.8.1：
Conditioning of the ripening room / 8.8.2：
Soft fresh cheese and soft ripened cheese / H. Pointurier9：
Characteristics of ripened and fresh soft cheeses / 9.1：
Soft ripened cheeses (les fromages a pate molle) / 9.2.1：
Fresh cheese (fromage frais) / 9.2.2：
The key phases in the process plant for soft cheese manufacture / 9.3：
Soft ripened cheeses / 9.3.1：
Soft fresh cheeses / 9.3.2：
Cottage cheese / 9.3.3：
Mechanisation and automation solutions / 9.4：
Pasta Filata cheeses / O. Salvadori del Prato9.4.1：
General introduction and basic classification / 10.1：
Technology of Pasta Filata cheeses / 10.2：
Mozzarella and soft Pasta Filata cheeses / 10.2.1：
Provolone and hard Pasta Filata cheeses / 10.2.2：
Mechanisation and control of Pasta Filata cheese production / 10.3：
Coagulators or cheese vats / 10.3.1：
Filatrici and moulding machines / 10.3.2：
Hardening and brining / 10.3.3：
Packaging / 10.3.4：
Miscellaneous systems / 10.3.5：
Quality control of Pasta Filata cheese processing / 10.4：
Rheological properties / 10.4.1：
Microstructure / 10.4.2：
Hazard analysis critical control points / 10.4.3：
Membrane processing / H.C. Van der Horst11：
Principles of membrane processes / 11.1：
Process control and automation of membrane processes / 11.2：
Membrane applications for milk / 11.3：
Milk concentration by reverse osmosis / 11.3.1：
Demineralisation by nanofiltration / 11.3.2：
Milk protein standardisation by ultrafiltration / 11.3.3：
Milk protein concentration by ultrafiltration and microfiltration / 11.3.4：
Removal of bacteria, spores and somatic cells from raw milk by microfiltration / 11.3.5：
Applications to cheese / 11.4：
Soft and hard cheese varieties / 11.4.1：
Applications for whey / 11.5：
Concentration of whey by reverse osmosis / 11.5.1：
Demineralisation of whey by nanofiltration / 11.5.2：
Whey protein concentrate production by ultrafiltration / 11.5.3：
Whey protein fractionation / 11.5.4：
Miscellaneous processes / 11.6：
Clarification of brine / 11.6.1：
Recycling of cleaning solutions / 11.6.2：
Nonproduct operations, services and waste handling / L. Robertson12：
Nonproduct operation and maintenance / 12.1：
Plant commissioning / 12.1.1：
Start-up and shut-down / 12.1.2：
Maintenance, including predictive or planned maintenance / 12.1.3：
Cleaning-in-place operation, control and automation / 12.1.4：
Supply and control of services / 12.2：
Water quality / 12.2.1：
Electricity / 12.2.2：
Steam / 12.2.3：
Hot water / 12.2.4：
Chilled water / 12.2.5：
Compressed air / 12.2.6：
Dryer air / 12.2.7：
Cogeneration / 12.2.8：
Waste heat recovery and re-use / 12.2.9：
Waste handling / 12.3：
Legal issues / 12.3.1：
Waste minimisation / 12.3.2：
Waste characterisation / 12.3.3：
Waste product and by-product treatment / 12.3.4：
Nutrient and biological oxygen demand reduction / 12.3.5：
Index
Principles of automation in the dairy industry / W. Kirkland1：
Introduction and historical development / 1.1：
Automation and control of dairy processes / 1.2：
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