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1.

電子ブック
ＥＢ
1. A Tiny Handbook of R
Mike Allerhand
出版情報: SpringerLink Books - AutoHoldings , Springer Berlin Heidelberg, 2011
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Introduction to R / 1：
Why Command Lines and Scripts? / 1.1：
The R Console / 1.1.1：
Variables / 1.1.2：
Functions / 1.1.3：
Finding Functions and Getting Help / 1.2：
Libraries / 1.2.1：
Packages / 1.2.2：
Finding Functions / 1.2.3：
Getting Help / 1.2.4：
R Projects / 1.3：
Saving Your Session / 1.3.1：
Scripts / 1.3.2：
Data Structures / 2：
Vectors, Matrices, and Arrays / 2.1：
Data Frames and Lists / 2.1.2：
Creating Data / 2.1.3：
Sampling Data / 2.1.4：
Reading Data / 2.1.5：
Operations on Vectors and Matrices / 2.2：
Arithmetic Functions / 2.2.1：
Descriptive Functions / 2.2.2：
Operators and Expressions / 2.2.3：
Factors / 2.3：
Making Factors / 2.3.1：
Operations on Factors / 2.3.2：
Re-ordering and Re-labelling / 2.3.3：
Indexing / 2.4：
Indexing by Name / 2.4.1：
Indexing by Number / 2.4.2：
Inserting and Deleting Rows or Columns / 2.4.3：
Indexing with Factors / 2.4.4：
Conditional Indexing / 2.4.5：
Sorting / 2.4.6：
Reshaping / 2.5：
Stacking and Unstacking? / 2.5.1：
Reshaping: Wide and Long / 2.5.2：
Merging / 2.5.3：
Missing Values / 2.6：
Recoding Missing Values / 2.6.1：
Operations with Missing Values / 2.6.2：
Counting and Sorting Missing Values / 2.6.3：
Handling Missing Values / 2.6.4：
Mapping Functions / 2.7：
Repeated Evaluation / 2.7.1：
Applying Functions / 2.7.2：
Writing Functions / 2.8：
Anonymous Functions / 2.8.1：
Optional Arguments / 2.8.2：
Tables and Graphs / 3：
Tables / 3.1：
Frequency Tables / 3.1.1：
Tables of Cell Means and Other Summaries / 3.1.2：
Saving Tables / 3.1.3：
Graphs / 3.2：
Base Graphics / 3.2.1：
Lattice Graphics / 3.2.2：
Multiple Plot Layout / 3.2.3：
Saving Graphics / 3.2.4：
Hypothesis Tests / 4：
Probability Distributions / 4.1：
How to Run a t test / 4.2：
Linear Models / 5：
Model Formulas / 5.1：
Formula and Data Frame / 5.1.1：
Updating Model Fits / 5.1.2：
General Linear Models / 5.2：
Regression Diagnostics / 5.2.1：
Testing the Regression Coefficients / 5.2.2：
Prediction / 5.2.3：
Stepwise Regression / 5.2.4：
Extracting Information from the Fit Object / 5.2.5：
Residualizing / 5.2.6：
ANOVA / 5.3：
ANOVA Tables / 5.3.1：
Comparisons / 5.3.2：
Learning R / 5.4：
Index
Introduction to R / 1：
Why Command Lines and Scripts? / 1.1：
The R Console / 1.1.1：
2.

電子ブック
ＥＢ
2. Asymmetric Synthesis of Three-membered Rings
H?l?ne; Lattanzi, Alessandra; Dalpozzo, Renato Pellissier, Renato Dalpozzo, Alessandra Lattanzi
出版情報: Wiley Online Library - AutoHoldings Books , Wiley-VCH, 2017
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Preface
List of Abbreviations
Asymmetric Cyclopropanation / 1：
Introduction / 1.1：
Simmons-Smith Cyclopropanation / 1.2：
Chiral Substrates / 1.2.1：
Chiral Allylic Alcohols / 1.2.1.1：
Chiral Allylic Amines / 1.2.1.2：
Chiral Acetal-Directed Cyclopropanations / 1.2.1.3：
Simple Chiral Alkenes / 1.2.1.4：
Chiral Auxiliaries / 1.2.2：
Chiral Catalysts / 1.2.3：
Charette's Ligand / 1.2.3.1：
Other Stoichiometric Ligands / 1.2.3.2：
Walsh' Procedure / 1.2.3.3：
True Catalytic Procedures / 1.2.3.4：
Transition-Metal-Catalyzed Decomposition of Diazoalkanes / 1.3：
Intermolecular Cyclopropanation / 1.3.1：
Chiral Catalysts: Cobalt / 1.3.1.1：
Chiral Catalysts: Copper / 1.3.1.3：
Chiral Catalysts: Rhodium / 1.3.1.4：
Chiral Catalysts: Ruthenium / 1.3.1.5：
Chiral Catalyst: Other Metals / 1.3.1.6：
Intramolecular Cyclopropanation / 1.3.2：
Chiral Auxiliaries and Chiral Compounds / 1.3.2.1：
Chiral Stoichiometric Carbenes / 1.3.2.2：
Michael-Initiated and Other Ring Closures / 1.4：
Chiral Michael Acceptors / 1.4.1：
Chiral Nucleophiles / 1.4.2.2：
Organocatalysis / 1.4.3：
Ylides / 1.4.3.1：
Nitrocyclopropanation / 1.4.3.2：
Halocarbonyl Compounds / 1.4.3.3：
Metal Catalysis / 1.4.4：
Other Ring Closures / 1.4.5：
Miscellaneous Reactions / 1.5：
Rearrangement of Chiral Oxiranes / 1.5.1：
Cycloisomerization of 1,n-Enynes / 1.5.2：
Denitrogenation of Chiral Pyrazolines / 1.5.3：
C-H Insertion / 1.5.4：
Addition to Cyclopropenes / 1.5.5：
Other Methods / 1.5.6：
Conclusions / 1.6：
References
Asymmetric Aziridination / 2：
Aziridination Based on the Use of Chiral Substrates / 2.1：
Addition to Alkenes / 2.2.1：
Aziridination via Nitrene Transfer to Alkenes / 2.2.1.1：
Aziridination via Addition-Elimination Processes / 2.2.1.2：
Addition to Imines / 2.2.1.3：
Methylidation of Imines / 2.2.2.1：
Aza-Darzens and Analogous Reactions / 2.2.2.2：
Addition/Elimination Processes / 2.2.2.3：
Addition to Azirines / 2.2.2.4：
Aziridination via Intramolecular Substitution / 2.2.4：
From 1,2-Amino Alcohols / 2.2.4.1：
From 1,2-Amino Halides / 2.2.4.2：
From 1,2-Azido Alcohols / 2.2.4.3：
From 1,2-Amino Sulfides and 1,2-Amino Selenides / 2.2.4.4：
From Epoxides / 2.2.4.5：
Aziridination Based on the Use of Chiral Catalysts / 2.2.5：
Cu-Catalyzed Aziridination / 2.3.1：
Rh-Catalyzed Aziridination / 2.3.1.2：
Ru-Catalyzed Aziridination / 2.3.1.3：
Catalysis by Other Metals / 2.3.1.4：
Organocatalyzed Aziridination / 2.3.1.5：
Aziridination via Carbene Transfer to Imines / 2.3.2：
Carbene Methodology / 2.3.2.1：
Sulfur-Ylide-Mediated Aziridination / 2.3.2.2：
Kinetic Resolutions of Aziridines / 2.3.3：
Asymmetric Epoxidation / 2.4：
Asymmetric Epoxidations Based on the Use of Chiral Auxiliaries / 3.1：
Asymmetric Metal-Catalyzed Epoxidations / 3.3：
Ti-, Zr-, Hf-Catalyzed Epoxidations / 3.3.1：
V-, Nb-, Ta-Catalyzed Epoxidations / 3.3.2：
Cr-, Mo-, W-Catalyzed Epoxidations / 3.3.3：
Mn-, Re-, Fe-, Ru-Catalyzed Epoxidations / 3.3.4：
Pt-, Zn-, Lanthanoid-Catalyzed Epoxidations / 3.3.5：
Asymmetric Organocatalyzed Epoxidations / 3.4：
Phase-Transfer Catalyst / 3.4.1：
Polyamino Acids and Aspartate-Derived Peracids / 3.4.2：
Chiral Dioxiranes, Iminium Salts, and Alkyl Hydroperoxides / 3.4.3：
Chiral Amines / 3.4.4：
Kinetic Resolution of Racemic Epoxides / 3.5：
Asymmetric Sulfur-Ylide-Mediated Epoxidations / 3.6：
Asymmetric Darzens-Type Epoxidations / 3.7：
Chiral Auxiliary- and Reagent-Mediated Darzens Reactions / 3.7.1：
Catalytic Asymmetric Darzens Reactions / 3.7.2：
Other Ylide-Mediated Epoxidations / 3.8：
Asymmetric Biocatalyzed Synthesis of Epoxides / 3.9：
Asymmetric Oxaziridination / 3.10：
Oxaziridination Using Chiral Substrates / 4.1：
Oxaziridination Using Chiral Catalysts / 4.3：
Kinetic Resolutions / 4.4：
Asymmetric Azirination and Thiirination / 4.5：
Asymmetric Azirination / 5.1：
Neber Approaches / 5.2.1：
Elimination Approaches / 5.2.2：
Other Approaches / 5.2.3：
Asymmetric Thiirination / 5.3：
Conversion of Epoxides / 5.3.1：
Condensation of Sulfur-Stabilized Carbanions to Carbonyl Compounds / 5.3.2：
Intramolecular Nucleophilic Substitution / 5.3.3：
Index / 5.3.4：
Preface
List of Abbreviations
Asymmetric Cyclopropanation / 1：
3.

電子ブック
ＥＢ
3. Cybercrime and Cyberwarfare
Igor Bernik
出版情報: Wiley Online Library - AutoHoldings Books , Hoboken : Wiley-ISTE, 2014
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Introduction
Acknowledgement
Cybercrime / Chapter 1：
The perpetrators of cybercrime / 1.1：
Motives of the perpetrators of cybercrime / 1.1.1：
Types of offenders / 1.1.2：
Organization of perpetrators / 1.1.3：
Tools for implementing attacks / 1.2：
System protection against attacks / 1.3：
Fear of cybercrime / 1.4：
Investigation of cybercrime / 1.5：
Cost of cybercrime / 1.6：
Measuring the cost of cybercrime model / 1.6.1：
Cost framework for cybercrime model / 1.6.2：
Laws and legal bodies / 1.7：
The Council of Europe Convention on Cybercrime / 1.7.1：
Agreement on Trade-Related Aspects of Intellectual Property Rights / 1.7.2：
Digital Millennium Copyright Act / 1.7.3：
United Nations Charter / 1.7.4：
Cybercrime conclusion / 1.8：
Cyberwarfare / Chapter 2：
Information and cyberspace / 2.1：
Cyberspace and ICT / 2.1.1：
Information power and information conflict / 2.1.2：
Understanding cyberwarfare / 2.2：
The nature of cyberwarfare / 2.2.1：
Types and techniques of cyberwarfare / 2.2.2：
Perpetrators and victims of cyberwarfare / 2.3：
Committing cyberwarfare / 2.4：
Espionage / 2.4.1：
Active warfare / 2.4.2：
Information operations / 2.4.3：
Propaganda activity / 2.4.4：
Organizations and cyberwarfare / 2.5：
Industrial espionage / 2.5.1：
Politically and ideologically motivated groups - perpetrators of cyberwarfare / 2.5.2：
The role of countries in cyberwarfare / 2.6：
The United States / 2.6.1：
China / 2.6.2：
Russia / 2.6.3：
India / 2.6.4：
Iran / 2.6.5：
Israel / 2.6.6：
North Korea / 2.6.7：
Efforts against cyberwarfare: international and national legislation / 2.7：
Defense against cyberwarfare / 2.8：
Cyberwarfare conclusion / 2.9：
Conclusion
Bibliography
Index
Introduction
Acknowledgement
Cybercrime / Chapter 1：
4.

電子ブック
ＥＢ
4. Cyclic Plasticity of Engineering Materials: Experiments and Models
Guozheng; Kan, Qianhua Kang, Qianhua Kan
出版情報: Wiley Online Library - AutoHoldings Books , John Wiley & Sons, Inc., 2017
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Introduction
Monotonic Elastoplastic Deformation / 1.1：
Cyclic Elastoplastic Deformation / 1.2：
Cyclic Softening/Hardening Features / 1.2.1：
Mean Stress Relaxation / 1.2.2：
Ratchetting / 1.2.3：
Contents of This Book / 1.3：
References
Fundamentals of Inelastic Constitutive Models / 1：
Fundamentals of Continuum Mechanics
Kinematics / 1.1.1：
Definitions of Stress Tensors / 1.1.2：
Frame-Indifference and Objective Rates / 1.1.3：
Thermodynamics / 1.1.4：
The First Thermodynamic Principle / 1.1.4.1：
The Second Thermodynamic Principle / 1.1.4.2：
Constitutive Theory of Solid Continua / 1.1.5：
Constitutive Theory of Elastic Solids / 1.1.5.1：
Constitutive Theory of Elastoplastic Solids / 1.1.5.2：
Classical Inelastic Constitutive Models
J2 Plasticity Model
Unified Visco-plasticity Model
Fundamentals of Crystal Plasticity
Single Crystal Version / 1.3.1：
Polycrystalline Version / 1.3.2：
Fundamentals of Meso-mechanics for Composite Materials / 1.4：
Eshelby's Inclusion Theory / 1.4.1：
Mori-Tanaka's Homogenization Approach / 1.4.2：
Cyclic Plasticity of Metals: I. Macroscopic and Microscopic Observations and Analysis of Micro-mechanism / 2：
Macroscopic Experimental Observations / 2.1：
Cyclic Softening/Hardening Features in More Details / 2.1.1：
Uniaxial Cases / 2.1.1.1：
Multiaxial Cases / 2.1.1.2：
Ratchetting Behaviors / 2.1.2：
Thermal Ratchetting / 2.1.2.1：
Microscopic Observations of Dislocation Patterns and Their Evolutions / 2.2：
FCC Metals / 2.2.1：
Uniaxial Case / 2.2.1.1：
Multiaxial Case / 2.2.1.2：
BCC Metals / 2.2.2：
Micro-mechanism of Ratchetting / 2.2.2.1：
Uniaxial Ratchetting / 2.3.1：
Multiaxial Ratchetting / 2.3.1.2：
Summary / 2.3.2：
Cyclic Plasticity of Metals: II. Constitutive Models / 3：
Macroscopic Phenomenological Constitutive Models / 3.1：
Framework of Cyclic Plasticity Models / 3.1.1：
Governing Equations / 3.1.1.1：
Brief Review on Kinematic Hardening Rules / 3.1.1.2：
Combined Kinematic and Isotropic Hardening Rules / 3.1.1.3：
Viscoplastic Constitutive Model for Ratchetting at Elevated Temperatures / 3.1.2：
Nonlinear Kinematic Hardening Rules / 3.1.2.1：
Nonlinear Isotropic Hardening Rule / 3.1.2.2：
Verification and Discussion / 3.1.2.3：
Constitutive Models for Time-Dependent Ratchetting / 3.1.3：
Separated Version / 3.1.3.1：
Unified Version / 3.1.3.2：
Evaluation of Thermal Ratchetting / 3.1.4：
Physical Nature-Based Constitutive Models / 3.2：
Crystal Plasticity-Based Constitutive Models / 3.2.1：
Application to Polycrystalline Metals / 3.2.1.1：
Dislocation-Based Crystal Plasticity Model / 3.2.2：
Multi-mechanism Constitutive Model / 3.2.2.1：
2M1C Model / 3.2.3.1：
2M2C Model / 3.2.3.2：
Two Applications of Cyclic Plasticity Models / 3.3：
Rolling Contact Fatigue Analysis of Rail Head / 3.3.1：
Experimental and Theoretical Evaluation to the Ratchetting of Rail Steels / 3.3.1.1：
Finite Element Simulations / 3.3.1.2：
Bending Fretting Fatigue Analysis of Axles in Railway Vehicles / 3.3.2：
Equivalent Two-Dimensional Finite Element Model / 3.3.2.1：
Finite Element Simulation to Bending Fretting Process / 3.3.2.2：
Predictions to Crack Initiation Location and Fretting Fatigue Life / 3.3.2.3：
Thermomechanically Coupled Cyclic Plasticity of Metallic Materials at Finite Strain / 3.4：
Cyclic Plasticity Model at Finite Strain / 4.1：
Framework of Finite Elastoplastic Constitutive Model / 4.1.1：
Equations of Kinematics / 4.1.1.1：
Constitutive Equations / 4.1.1.2：
Kinematic and Isotropic Hardening Rules / 4.1.1.3：
Logarithmic Stress Rate / 4.1.1.4：
Finite Element Implementation of the Proposed Model / 4.1.2：
Discretization Equations of the Proposed Model / 4.1.2.1：
Implicit Stress Integration Algorithm / 4.1.2.2：
Consistent Tangent Modulus / 4.1.2.3：
Verification of the Proposed Model / 4.1.3：
Determination of Material Parameters / 4.1.3.1：
Simulation of Monotonic Simple Shear Deformation / 4.1.3.2：
Simulation of Cyclic Free-End Torsion and Tension-Torsion Deformations / 4.1.3.3：
Simulation of Uniaxial Ratchetting at Finite Strain / 4.1.3.4：
Thermomechanically Coupled Cyclic Plasticity Model at Finite Strain / 4.2：
Framework of Thermodynamics / 4.2.1：
Kinematics and Logarithmic Stress Rate / 4.2.1.1：
Thermodynamic Laws / 4.2.1.2：
Generalized Constitutive Equations / 4.2.1.3：
Restrictions on Specific Heat and Stress Response Function / 4.2.1.4：
Specific Constitutive Model / 4.2.2：
Nonlinear Kinematic Hardening Rule / 4.2.2.1：
Simulations and Discussions / 4.2.2.2：
Cyclic Viscoelasticity-Viscoplasticity of Polymers / 4.3：
Experimental Observations / 5.1：
Uniaxial Strain-Controlled Cyclic Tests / 5.1.1：
Multiaxial Strain-Controlled Cyclic Tests / 5.1.1.2：
Cyclic Viscoelastic Constitutive Model / 5.1.2：
Original Schapery's Model / 5.2.1：
Main Equations of Schapery's Viscoelastic Model / 5.2.1.1：
Simulations and Discussion / 5.2.1.2：
Extended Schapery's Model / 5.2.2：
Main Modification / 5.2.2.1：
Cyclic Viscoelastic-Viscoplastic Constitutive Model / 5.2.2.2：
Main Equations / 5.3.1：
Viscoelasticity / 5.3.1.1：
Viscoplasticity / 5.3.1.2：
Cyclic Plasticity of Particle-Reinforced Metal Matrix Composites / 5.3.2：
Uniaxial Ratchetting at Room Temperature / 6.1：
Uniaxial Ratchetting at 573K / 6.1.2.2：
Time-Independent Cyclic Plasticity / 6.2：
Main Equations of the Time-Independent Cyclic Plasticity Model / 6.2.1.1：
Basic Finite Element Model and Simulations / 6.2.1.2：
Effect of Interfacial Bonding / 6.2.1.3：
Results with 3D Multiparticle Finite Element Model / 6.2.1.4：
Time-Dependent Cyclic Plasticity / 6.2.2：
Finite Element Model / 6.2.2.1：
Meso-mechanical Time-Independent Plasticity Adodel / 6.2.2.2：
Framework of the Model / 6.3.1：
Time-Independent Cyclic Plasticity Model for the Matrix / 6.3.1.1：
Extension of the Mori-Tanaka Homogenization Approach / 6.3.1.2：
Numerical Implementation of the Model / 6.3.2：
Under the Strain-Controlled Loading Condition / 6.3.2.1：
Under the Stress-Controlled Loading Condition / 6.3.2.2：
Continuum and Algorithmic Consistent Tangent Operators / 6.3.2.3：
Meso-mechanical Time-Dependent Plasticity Model / 6.3.3：
Time-Dependent Cyclic Plasticity Model for the Matrix / 6.4.1：
Mori-Tanaka Homogenization Approach / 6.4.1.2：
Generalized Incrementally Affine Linearization Formulation / 6.4.2：
Extension of Mori-Tanaka's Model / 6.4.2.2：
Algorithmic Consistent Tangent Operator and Its Regularization / 6.4.2.3：
Numerical Integration of the Viscoplasticity Model / 6.4.2.4：
Under Monotonic Tension / 6.4.3：
Under Strain-Controlled Cyclic Loading Conditions / 6.4.3.2：
Time-Dependent Uniaxial Ratchetting / 6.4.3.3：
Thermomechanical Cyclic Deformation of Shape-Memory Alloys / 6.5：
Degeneration of Super-Elasticity and Transformation Ratchetting / 7.1：
Thermomechanical Cyclic Deformation Under Strain-Controlled Loading Conditions / 7.1.1.1：
Thermomechanical Cyclic Deformation Under Uniaxial Stress-Controlled Loading Conditions / 7.1.1.2：
Thermomechanical Cyclic Deformation Under Multiaxial Stress-Controlled Loading Conditions / 7.1.1.3：
Rate-Dependent Cyclic Deformation of Super-Elastic NiTi SMAs / 7.1.2：
Thermomechanical Cyclic Deformation Under Stress-Controlled Loading Conditions / 7.1.2.1：
Thermomechanical Cyclic Deformation of Shape-Memory NiTi SMAs / 7.1.3：
Pure Mechanical Cyclic Deformation under Stress-Controlled Loading Conditions / 7.1.3.1：
Thermomechanical Cyclic Deformation with Thermal Cycling and Axial Stress / 7.1.3.2：
Phenomenological Constitutive Models / 7.2：
Pure Mechanical Version / 7.2.1：
Thermodynamic Equations and Internal Variables / 7.2.1.1：
Main Equations of Constitutive Model / 7.2.1.2：
Predictions and Discussions / 7.2.1.3：
Thermomechanical Version / 7.2.2：
Strain Definitions / 7.2.2.1：
Evolution Rules of Transformation and Transformation-Induced Plastic Strains / 7.2.2.2：
Simplified Temperature Field / 7.2.2.3：
Evolution Rules of Internal Variables / 7.2.2.4：
Explicit Scale Transition Rule / 7.3.1.3：
Verifications and Discussions / 7.3.1.4：
Thermomechanical Coupled Analysis for Temperature Field / 7.3.2：
Index / 7.3.2.4：
Introduction
Monotonic Elastoplastic Deformation / 1.1：
Cyclic Elastoplastic Deformation / 1.2：
5.

電子ブック
ＥＢ
5. Ecosystems Knowledge
Samuel Szoniecky
出版情報: Wiley Online Library - AutoHoldings Books , John Wiley & Sons, Inc., 2018
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Introduction
Use of the Ecosystem Concept on the Web / Chapter 1：
For marketing / 1.1：
For personal data / 1.2：
For services and applications / 1.3：
For dynamic interactivity / 1.4：
For pictorial analogies / 1.5：
For the information and communication sciences / 1.6：
Ecosystem Modeling: A Generic Method of Analysis / Chapter 2：
Hypertextual gardening fertilized by the chaos of John Cage / 2.1：
An entrepreneurial experience / 2.2：
Objectives / 2.2.1：
Principle of the game / 2.2.2：
Motivations / 2.2.3：
Why model a cognitive ecology? / 2.2.3.1：
The relevance of the garden analogy / 2.2.3.2：
Strategic interests and potential benefits / 2.2.4：
The maturation of a research project / 2.3：
Evaluating index activity / 2.3.1：
Folksonomies explorer / 2.3.2：
Tweet Palette: Semantic mapping / 2.3.3：
Fundamental Principles for Modeling an Existence / Chapter 3：
Key concepts for thinking about knowledge ecosystems / 3.1：
The noosphere / 3.1.1：
Enaction / 3.1.2：
Complexity / 3.1.3：
Trajective reason / 3.1.4：
Agency / 3.1.5：
Spinozist principles for an ethical ontology / 3.2：
Spinoza: ethical ontology / 3.2.1：
Limitations of Spinozism / 3.2.2：
Three dimensions of existence and three kinds of knowledge / 3.2.3：
Spinozist symbol politics / 3.2.4：
Spinozist ethics for the Web / 3.2.5：
The ontological principles of Descola / 3.2.6：
Principles of ontological matrices / 3.2.7：
The Web as analogist ontology / 3.2.8：
Principles of computer models / 3.2.9：
From Zeno to Turing via Spinoza / 3.2.10：
The search for the perfect language / 3.2.11：
Semantic knowledge management / 3.3：
The boundaries of ontologies / 3.3.1：
The semantic sphere IEML / 3.3.2：
Graphical Specifications for Modeling Existences / Chapter 4：
Principles of graphical modeling / 4.1：
Unified modeling language / 4.1.1：
Graphic partitions and diagrams / 4.1.2：
Fixed image versus dynamic diagram / 4.1.3：
Semantic maps / 4.2：
Maps of physical spaces / 4.2.1：
Time maps / 4.2.2：
Maps of conceptual spaces / 4.2.3：
Interpretation maps / 4.2.4：
Graphical modeling rules / 4.3：
Physical dimensions / 4.3.1：
Actors / 4.3.2：
Concepts / 4.3.3：
Relations / 4.3.4：
Calculating the complexity of an ecosystem / 4.3.5：
Web Platform Specifications for Knowledge Ecosystems / Chapter 5：
The generic management of resources / 5.1：
Non-digital resources / 5.1.1：
Digital resources / 5.1.2：
Management of digital resources / 5.1.3：
Principles for developing a Web ecosystem platform / 5.2：
Databases as a model of the ecosystem / 5.2.1：
Algorithmic platform to manage the ecosystem / 5.2.2：
Editorial platform for controlling collaborative practices / 5.2.3：
Client applications to explore ecosystem views / 5.2.4：
From technical specification to the organization of collective intelligence / 5.2.5：
Conclusion
Appendix
Bibliography
Index
Introduction
Use of the Ecosystem Concept on the Web / Chapter 1：
For marketing / 1.1：
6.

電子ブック
ＥＢ
6. Damage Mechanics in Metal Forming : Advanced Modeling and Numerical Simulation
Khemais Saanouni, K. Saanouni
出版情報: Wiley Online Library - AutoHoldings Books , Wiley-ISTE, 2012
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Preface
Principle of Mathematical Notations
Elements of Continuum Mechanics and Thermodynamics / Chapter 1：
Elements of kinematics and dynamics of materially simple continua / 1.1：
Homogeneous transformation and gradient of transformation / 1.1.1：
Homogeneous transformation / 1.1.1.1：
Gradient of transformation and its inverse / 1.1.1.2：
Polar decomposition of the transformation gradient / 1.1.1.3：
Transformation of elementary vectors, surfaces and volumes / 1.1.2：
Transformation of an elementary vector / 1.1.2.1：
Transformation of an elementary volume: the volume dilatation / 1.1.2.2：
Transformation of an oriented elementary surface / 1.1.2.3：
Various definitions of stretch, strain and strain rates / 1.1.3：
On some definitions of stretches / 1.1.3.1：
On some definitions of the strain tensors / 1.1.3.2：
Strain rates and rotation rates (spin) tensors / 1.1.3.3：
Volumic dilatation rate, relative extension rate and angular sliding rate / 1.1.3.4：
Various stress measures / 1.1.4：
Conjugate strain and stress measures / 1.1.5：
Change of referential or configuration and the concept of objectivity / 1.1.6：
Impact on strain and strain rates / 1.1.6.1：
Impact on stress and stress rates / 1.1.6.2：
Impact on the constitutive equations / 1.1.6.3：
Strain decomposition into reversible and irreversible parts / 1.1.7：
On the conservation laws for the materially simple continua / 1.2：
Conservation of mass: continuity equation / 1.2.1：
Principle of virtual power: balance equations / 1.2.2：
Energy conservation. First law of thermodynamics / 1.2.3：
Inequality of the entropy. Second law of thermodynamics / 1.2.4：
Fundamental inequalities of thermodynamics / 1.2.5：
Heat equation deducted from energy balance / 1.2.6：
Materially simple continuum thermodynamics and the necessity of constitutive equations / 1.3：
Necessity of constitutive equations / 1.3.1：
Some fundamental properties of constitutive equations / 1.3.2：
Principle of determinism or causality axiom / 1.3.2.1：
Principle of local action / 1.3.2.2：
Principle of objectivity or material indifference / 1.3.2.3：
Principle of material symmetry / 1.3.2.4：
Principle of consistency / 1.3.2.5：
Thermodynamic admissibility / 1.3.2.6：
Thermodynamics of irreversible processes. The local state method / 1.3.3：
A presentation of the local state method / 1.3.3.1：
Internal constraints / 1.3.3.2：
Mechanics of generalized continua. Micromorphic theory / 1.4：
Principle of virtual power for micromorphic continua / 1.4.1：
Thermodynamics of micromorphic continua / 1.4.2：
Thermomechanically-Consistent Modeling of the Metals Behavior with Ductile Damage / Chapter 2：
On the main schemes for modeling the behavior of materially simple continuous media / 2.1：
Behavior and fracture of metals and alloys: some physical and phenomenological aspects / 2.2：
On the microstructure of metals and alloys / 2.2.1：
Phenomenology of the thermomechanical behavior of polycrystals / 2.2.2：
Linear elastic behavior / 2.2.2.1：
Inelastic behavior / 2.2.2.2：
Inelastic behavior sensitive to the loading rate / 2.2.2.3：
Initial and induced anisotropies / 2.2.2.4：
Other phenomena linked to the shape of the loading paths / 2.2.2.5：
Phenomenology of the inelastic fracture of metals and alloys / 2.2.3：
Micro-defects nucleation / 2.2.3.1：
Micro-defects growth / 2.2.3.2：
Micro-defects coalescence and final fracture of the RVE / 2.2.3.3：
A first definition of the damage variable / 2.2.3.4：
From ductile damage at a material point to the total fracture of a structure by propagation of macroscopic cracks / 2.2.3.5：
Summary of the principal phenomena to be modeled / 2.2.4：
Theoretical framework of modeling and main hypotheses / 2.3：
The main kinematic hypotheses / 2.3.1：
Choice of kinematics and compliance with the principle of objectivity / 2.3.1.1：
Decomposition of strain rates / 2.3.1.2：
On some rotating frame choices / 2.3.1.3：
Implementation of the local state method and main mechanical hypotheses / 2.3.2：
Choice of state variables associated with phenomena being modeled / 2.3.2.1：
Definition of effective variables: damage effect functions / 2.3.2.2：
State potential: state relations / 2.4：
State potential in case of damage anisotropy / 2.4.1：
Formulation in strain space: Helmholtz free energy / 2.4.1.1：
Formulation in stress space: Gibbs free enthalpy / 2.4.1.2：
State potential in the case of damage isotropy / 2.4.2：
Microcracks closure: quasi-unilateral effect / 2.4.2.1：
Concept of micro-defect closure: deactivation of damage effects / 2.4.3.1：
State potential with quasi-unilateral effect / 2.4.3.2：
Dissipation analysis: evolution equations / 2.5：
Thermal dissipation analysis: generalized heat equation / 2.5.1：
Heat flux vector: Fourier linear conduction model / 2.5.1.1：
Generalized heat equation / 2.5.1.2：
Intrinsic dissipation analysis: case of time-independent plasticity / 2.5.2：
Damageable plastic dissipation: anisotropic damage with two yield surfaces / 2.5.2.1：
Damageable plastic dissipation: anisotropic damage with a single yield surface / 2.5.2.2：
Incompressible and damageable plastic dissipation: isotropic damage with two yield surfaces / 2.5.2.3：
Incompressible and damageable plastic dissipation: single yield surface / 2.5.2.4：
Intrinsic dissipation analysis: time-dependent plasticity or viscoplasticity / 2.5.3：
Damageable viscoplastic dissipation without restoration: anisotropic damage with two viscoplastic potentials / 2.5.3.1：
Viscoplastic dissipation with damage: isotropic damage with a single viscoplastic potential and restoration / 2.5.3.2：
Some remarks on the choice of rotating frames / 2.5.4：
Modeling some specific effects linked to metallic material behavior / 2.5.5：
Effects on non-proportional loading paths on strain hardening evolution / 2.5.5.1：
Strain hardening memory effects / 2.5.5.2：
Cumulative strains or ratchet effect / 2.5.5.3：
Yield surface and/or inelastic potential distortion / 2.5.5.4：
Viscosity-hardening coupling: the Piobert-Lüders peak / 2.5.5.5：
Accounting for the material microstructure / 2.5.5.6：
Some specific effects on ductile fracture / 2.5.5.7：
Modeling of the damage-induced volume variation / 2.6：
On the compressibility induced by isotropic ductile damage / 2.6.1：
Concept of volume damage / 2.6.1.1：
State coupling and state relations / 2.6.1.2：
Dissipation coupling and evolution equations / 2.6.1.3：
Modeling of the contact and friction between deformable solids / 2.7：
Kinematics and contact conditions between solids / 2.7.1：
Impenetrability condition / 2.7.1.1：
Equilibrium condition of contact interface / 2.7.1.2：
Contact surface non-adhesion condition / 2.7.1.3：
Contact unilaterality condition / 2.7.1.4：
On the modeling of friction between solids in contact / 2.7.2：
Time-independent friction model / 2.7.2.1：
Nonlocal modeling of damageable behavior of micromorphic continua / 2.8：
Principle of virtual power for a micromorphic medium: balance equations / 2.8.1：
State potential and state relations for a micromorphic solid / 2.8.2：
Dissipation analysis: evolution equations for a micromorphic solid / 2.8.3：
Continuous tangent operators and thermodynamic admissibility for a micromorphic solid / 2.8.4：
Transformation of micromorphic balance equations / 2.8.5：
On the micro-macro modeling of inelastic flow with ductile damage / 2.9：
Principle of the proposed meso-macro modeling scheme / 2.9.1：
Definition of the initial RVE / 2.9.2：
Localization stages / 2.9.3：
Constitutive equations at different scales / 2.9.4：
State potential and state relations / 2.9.4.1：
Intrinsic dissipation analysis: evolution equations / 2.9.4.2：
Homogenization and the mean values of fields at the aggregate scale / 2.9.5：
Summary of the meso-macro polycrystalline model / 2.9.6：
Numerical Methods for Solving Metal Forming Problems / Chapter 3：
Initial and boundary value problem associated with virtual metal forming processes / 3.1：
Strong forms of the initial and boundary value problem / 3.1.1：
Posting a fully coupled problem / 3.1.1.1：
Some remarks on thermal conditions at contact interfaces / 3.1.1.2：
Weak forms of the initial and boundary value problem / 3.1.2：
On the various weak forms of the IBVP / 3.1.2.1：
Weak form associated with equilibrium equations / 3.1.2.2：
Weak form associated with heat equation / 3.1.2.3：
Weak form associated with micromorphic damage balance equation / 3.1.2.4：
Summary of the fully coupled evolution problem / 3.1.2.5：
Temporal and spatial discretization of the IBVP / 3.2：
Time discretization of the IBVP / 3.2.1：
Spatial discretization of the IBVP by finite elements / 3.2.2：
Spatial semi-discretization of the weak forms of the IBVP / 3.2.2.1：
Examples of isoparametric finite elements / 3.2.2.2：
On some global resolution scheme of the IBVP / 3.3：
Implicit static global resolution scheme / 3.3.1：
Newton-Raphson scheme for the solution of the fully coupled IBVP / 3.3.1.1：
On some convergence criteria / 3.3.1.2：
Calculation of the various terms of the tangent matrix / 3.3.1.3：
The purely mechanical consistent Jacobian matrix / 3.3.1.4：
Implicit global resolution scheme of the coupled IBVP / 3.3.1.5：
Dynamic explicit global resolution scheme / 3.3.2：
Solution of the mechanical problem / 3.3.2.1：
Solution of thermal (parabolic) problem / 3.3.2.2：
Solution of micromorphic damage problem / 3.3.2.3：
Sequential scheme of explicit global resolution of the IBVP / 3.3.2.4：
Numerical handling of contact-friction conditions / 3.3.3：
Lagrange multiplier method / 3.3.3.1：
Penalty method / 3.3.3.2：
On the search for contact nodes / 3.3.3.3：
On the numerical handling of the incompressibility condition / 3.3.3.4：
Local integration scheme: state variables computation / 3.4：
On numerical integration using the Gauss method / 3.4.1：
Local integration of constitutive equations: computation of the stress tensor and the state variables / 3.4.2：
On the numerical integration of first-order ODEs / 3.4.2.1：
Choice of constitutive equations to integrate / 3.4.2.2：
Integration of time-independent plastic constitutive equations: the case of a von Mises isotropic yield criterion / 3.4.2.3：
Integration of time-independent plastic constitutive equations: the case of a Hill quadratic anisotropic yield criterion / 3.4.2.4：
Integration of the constitutive equation in the case of viscoplastic flow / 3.4.2.5：
Calculation of the rotation tensor: incremental objectivity / 3.4.2.6：
Remarks on the integration of the micromorphic damage equation / 3.4.2.7：
On the local integration of friction equations / 3.4.3：
Adaptive analysis of damageable elasto-inelastic structures / 3.5：
Adaptation of time steps / 3.5.1：
Adaptation of spatial discretization or mesh adaptation / 3.5.2：
On other spatial discretization methods / 3.6：
An outline of non-mesh methods / 3.6.1：
On the FEM-meshless methods coupling / 3.6.2：
Application to Virtual Metal Forming / Chapter 4：
Why use virtual metal forming? / 4.1：
Model identification methodology / 4.2：
Parametrical study of specific models / 4.2.1：
Choosing typical constitutive equations / 4.2.1.1：
Isothermal uniaxial tension (compression) load without damage / 4.2.1.2：
Accounting for ductile damage effect / 4.2.1.3：
Accounting for initial anisotropy in inelastic flow / 4.2.1.4：
Identification methodologies / 4.2.2：
Some general remarks on the issue of identification / 4.2.2.1：
Recommended identification methodology / 4.2.2.2：
Illustration of the identification methodology / 4.2.2.3：
Using a nonlocal model / 4.2.2.4：
Some applications / 4.3：
Sheet metal forming / 4.3.1：
Some deep drawing processes of thin sheets / 4.3.1.1：
Some hydro-bulging test of thin sheets and tubes / 4.3.1.2：
Cutting processes of thin sheets / 4.3.1.3：
Bulk metal forming processes / 4.3.2：
Classical bulk metal forming processes / 4.3.2.1：
Bulk metal forming processes under severe conditions / 4.3.2.2：
Toward the optimization of forming and machining processes / 4.4：
Appendix: Legendre-Fenchel Transformation
Bibliography
Index
Preface
Principle of Mathematical Notations
Elements of Continuum Mechanics and Thermodynamics / Chapter 1：
7.

電子ブック
ＥＢ
7. Fault-Tolerance Techniques for Spacecraft Control Computers
Mengfei; Hua, Gengxin; Feng, Yanjun; Gong, Jian; Yang, Mengfei Yang, Yanjun Feng, Jian Gong, Gengxin Hua, Mengfei Yang
出版情報: Wiley Online Library - AutoHoldings Books , John Wiley & Sons, Incorporated, 2017
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Brief Introduction
Preface
Introduction / 1：
Fundamental Concepts and Principles of Fault-tolerance Techniques / 1.1：
Fundamental Concepts / 1.1.1：
Reliability Principles / 1.1.2：
Reliability Metrics / 1.1.2.1：
Reliability Model / 1.1.2.2：
The Space Environment and Its Hazards for the Spacecraft Control Computer / 1.2：
Introduction to Space Environment / 1.2.1：
Solar Radiation / 1.2.1.1：
Galactic Cosmic Rays (GCRs) / 1.2.1.2：
Van Allen Radiation Belt / 1.2.1.3：
Secondary Radiation / 1.2.1.4：
Space Surface Charging and Internal Charging / 1.2.1.5：
Summary of Radiation Environment / 1.2.1.6：
Other Space Environments / 1.2.1.7：
Analysis of Damage Caused by the Space Environment / 1.2.2：
Total Ionization Dose (TID) / 1.2.2.1：
Single Event Effect (SEE) / 1.2.2.2：
Internal/surface Charging Damage Effect / 1.2.2.3：
Displacement Damage Effect / 1.2.2.4：
Other Damage Effect / 1.2.2.5：
Development Status and Prospects of Fault Tolerance Techniques / 1.3：
References
Fault-Tolerance Architectures and Key Techniques / 2：
Fault-tolerance Architecture / 2.1：
Module-level Redundancy Structures / 2.1.1：
Backup Fault-tolerance Structures / 2.1.2：
Cold-backup Fault-tolerance Structures / 2.1.2.1：
Hot-backup Fault-tolerance Structures / 2.1.2.2：
Triple-modular Redundancy (TMR) Fault-tolerance Structures / 2.1.3：
Other Fault-tolerance Structures / 2.1.4：
Synchronization Techniques / 2.2：
Clock Synchronization System / 2.2.1：
Basic Concepts and Fault Modes of the Clock Synchronization System / 2.2.1.1：
Clock Synchronization Algorithm / 2.2.1.2：
System Synchronization Method / 2.2.2：
The Real-time Multi-computer System Synchronization Method / 2.2.2.1：
System Synchronization Method with Interruption / 2.2.2.2：
Fault-tolerance Design with Hardware Redundancy / 2.3：
Universal Logic Model and Flow in Redundancy Design / 2.3.1：
Scheme Argumentation of Redundancy / 2.3.2：
Determination of Redundancy Scheme / 2.3.2.1：
Rules Obeyed in the Scheme Argumentation of Redundancy / 2.3.2.2：
Redundancy Design and Implementation / 2.3.3：
Basic Requirements / 2.3.3.1：
FDMU-Design / 2.3.3.2：
CSSU Design / 2.3.3.3：
IPU Design / 2.3.3.4：
Power Supply Isolation Protection / 2.3.3.5：
Testability Design / 2.3.3.6：
Others / 2.3.3.7：
Validation of Redundancy by Analysis / 2.3.4：
Hardware FMEA / 2.3.4.1：
Redundancy Switching Analysis (RSA) / 2.3.4.2：
Analysis of the Common Cause of Failure / 2.3.4.3：
Reliability Analysis and Checking of the Redundancy Power / 2.3.4.4：
Analysis of the Sneak Circuit in the Redundancy Management Circuit / 2.3.4.5：
Validation of Redundancy by Testing / 2.3.5：
Testing by Failure Injection / 2.3.5.1：
Specific Test for the Power of the Redundancy Circuit / 2.3.5.2：
Other Things to Note / 2.3.5.3：
Fault Detection Techniques / 3：
Fault Model / 3.1：
Fault Model Classified by Time / 3.1.1：
Fault Model Classified by Space / 3.1.2：
Fault Detection Methods for CPLTs / 3.2：
Fault Detection Methods Used for CPUs / 3.2.2.1：
Example of CPU Fault Detection / 3.2.2.2：
Fault Detection Methods for Memory / 3.2.3：
Fault Detection Method for ROM / 3.2.3.1：
Fault Detection Methods for RAM / 3.2.3.2：
Fault Detection Methods for I/Os / 3.2.4：
Bus Techniques / 4：
Introduction to Space-borne Bus / 4.1：
Fundamental Terminologies / 44.1：
The MIL-STD-1553B Bus / 4.2：
Fault Model of the Bus System / 4.21：
Bus-level Faults / 4.2.1.1：
Terminal Level Faults / 4.2.1.2：
Redundancy Fault-tolerance Mechanism of the Bus System / 4.2.2：
The Bus-level Fault-tolerance Mechanism / 4.2.2.1：
The Bus Controller Fault- tolerance Mechanism / 4.2.2.2：
Fault-tolerance Mechanism of Remote Terminals / 4.2.2.3：
The CAN Bus / 4.3：
The Bus Protocol / 4.3.1：
Physical Layer Protocol and Fault-tolerance / 4.3.2：
Node Structure / 4.3.2.1：
Bus Voltage / 4.3.2.2：
Transceiver and Controller / 4.3.2.3：
Physical Fault-tolerant Features / 4.3.2.4：
Data Link Layer Protocol and Fault-tolerance / 4.3.3：
Communication Process / 4.3.34：
Message Sending / 4.3.3.2：
The President Mechanism of Bus Access / 4.3.3.3：
Coding / 4.3.3.4：
Data Frame / 4.3.3.5：
Error Detection / 4.3.3.6：
The Space-Wire Bus / 4.4：
Connector / 4.4.1：
Cable / 4.4.1.2：
Low Voltage Differential Signal / 4.4.1.3：
Data Filter (DS) Coding / 4.4.1.4：
Packet Character / 4.4.2：
Packet Parity Check Strategy / 4.4.2.2：
Packet Structure / 4.4.2.3：
Communication Link Control / 4.4.2.4：
Networking and Routing / 4.4.3：
Major Technique used by the SpaceWire Network / 4.4.3.1：
SpaceWire Router / 4.4.3.2：
Fault-tolerance Mechanism / 4.4.4：
Other Buses / 4.5：
The IEEE 1394 Bus / 4.5.1：
Ethernet / 4.5.2：
The I2C Bus / 4.5.3：
Software Fault-Tolerance Techniques / 5：
Software Fault-tolerance Concepts and Principles / 5.1：
Software Faults / 5.1.1：
Software Fault-tolerance / 5.1.2：
Software Fault Detection and Voting / 5.1.3：
Software Fault Isolation / 5.1.4：
Software Fault Recovery / 5.1.5：
Classification of Software Fault-tolerance Techniques / 5.1.6：
Single-version Software Fault-tolerance Techniques / 5.2：
Checkpoint and Restart / 5.2.1：
Software-implemented Hardware Fault-tolerance / 5.2.2：
Control Flow Checking by Software Signatures (CFCSS) / 5.2.2.1：
Error Detection by Duplicated Instructions (EDDI) / 5.2.2.2：
Software Crash Trap / 5.2.3：
Multiple-version Software Fault-tolerance Techniques / 5.3：
Recovery Blocks (RcB) / 5.3.1：
N-version Programming (NVP) / 5.3.2：
Distributed Recovery Blocks (DRB) / 5.3.3：
N Self-checking Programming (NSCP) / 5.3.4：
Consensus Recovery Block (CRB) / 5.3.5：
Acceptance Voting (AV) / 5.3.6：
Advantage and Disadvantage of Multiple-version Software / 5.3.7：
Data Diversity Based Software Fault-tolerance Techniques / 5.4：
Data Re-expression Algorithm (DRA) / 5.4.1：
Retry Blocks (RtB) / 5.4.2：
N copy Programming (NCP) / 5.4.3：
Two-pass Adjudicators (TPA) / 5.4.4：
Fault-Tolerance Techniques for FPGA / 6：
Effect of the Space Environment on FPGAs / 6.1：
Single Event Transient Effect (SET) / 6.1.1：
Single Event Upset (SEU) / 6.1.2：
Single Event Latch-up (SEL) / 6.1.3：
Single Event Burnout (SEB) / 6.1.4：
Single Event Gate Rupture (SEGR) / 6.1.5：
Single Event Functional Interrupt (SEFI) / 6.1.6：
Fault Modes of SRAM-based FPGAs / 6.2：
Structure of a SRAM-based FPGA / 6.2.1：
Faults Classification and Fault Modes Analysis of SRAM-based FPGAs / 6.2.2：
Faults Classification / 6.2.2.1：
Fault Modes Analysis / 6.2.2.2：
Fault-tolerance Techniques for SRAM-based FPGAs / 6.3：
SRAM-based FPGA Mitigation Techniques / 6.3.1：
The Triple Modular Redundancy (TMR) Design Technique / 6.3.1.1：
The Inside RAM Protection Technique / 6.3.1.2：
The Inside Register Protection Technique / 6.3.1.3：
EDAC Encoding and Decoding Technique / 6.3.1.4：
Fault Detection Technique Based on DMR and Fault Isolation Technique Based on Tristate Gate / 6.3.1.5：
SRAM-based FPGA Reconfiguration Techniques / 6.3.2：
Single Fault Detection and Recovery Technique Based on ICAP+FrameECC / 6.3.2.1：
Multi-fault Detection and Recovery Technique Based on ICAP Configuration Read-back+RS Coding / 6.3.2.2：
Dynamic Reconfiguration Technique Based on EAPR / 6.3.2.3：
Fault Recovery Technique Based on Hardware Checkpoint / 6.3.2.4：
Summary of Reconfiguration Fault-tolerance Techniques / 6.3.2.5：
Typical Fault-tolerance Design of SRAM-based FPGA / 6.4：
Fault-tolerance Techniques of Anti-fuse Based FPGA / 6.5：
Fault-Injection Techniques / 7：
Basic Concepts / 7.1：
Experimenter / 7.1.1：
Establishing the Fault Model / 7.1.2：
Conducting Fault-injection / 7.1.3：
Target System for Fault-injection / 7.1.4：
Observing the System's Behavior / 7.1.5：
Analyzing Experimental Findings / 7.1.6：
Classification of Fault-injection Techniques / 7.2：
Simulated Fault-injection / 7.2.1：
Transistor Switch Level Simulated Fault-injection / 7.2.1.1：
Logic Level Simulated Fault-injection / 7.2.1.2：
Functional Level Simulated Fault-injection / 7.2.1.3：
Hardware Fault-injection / 7.2.2：
Software Fault-injection / 7.2.3：
Injection During Compiling / 7.2.3.1：
Injection During Operation / 7.2.3.2：
Physical Fault-injection / 7.2.4：
Mixed Fault-injection / 7.2.5：
Fault-injection System Evaluation and Application / 7.3：
Injection Controllability / 7.3.1：
Injection Observability / 7.3.2：
Injection Validity / 7.3.3：
Fault-injection Application / 7.3.4：
Verifying the Fault Detection Mechanism / 7.3.4.1：
Fault Effect Domain Analysis / 7.3.4.2：
Fault Restoration / 7.3.4.3：
Coverage Estimation / 7.3.4.4：
'Delay Time / 7.3.4.5：
Generating Fault Dictionary / 7.3.4.6：
Software Testing / 7.3.4.7：
Fault-injection Platform and Tools / 7.4：
Fault-injection Platform in Electronic Design Automation (EDA) Environment / 7.4.1：
Computer Bus-based Fault-injection Platform / 7.4.2：
Serial Accelerator Based Fault-injection Case / 7.4.3：
Future Development of Fault-injection Technology / 7.4.4：
Intelligent Fault-Tolerance Techniques / 8：
Evolvable Hardware Fault-tolerance / 8.1：
Fundamental Concepts and Principles / 8.1.1：
Evolutionary Algorithm / 8.1.2：
Encoding Methods / 8.1.2.1：
Fitness Function Designing / 8.1.2.2：
Genetic Operators / 8.1.2.3：
Convergence of Genetic Algorithm / 8.1.2.4：
Programmable Devices / 8.1.3：
ROM / 8.1.3.1：
PAL and GAL / 8.1.3.2：
FPGA / 8.1.3.3：
VRC / 8.1.3.4：
Evolvable Hardware Fault-tolerance Implementation Methods / 8.1.4：
Modeling and Organization of Hardware Evolutionary Systems / 8.1.4.1：
Reconfiguration and Its Classification / 8.1.4.2：
Evolutionary Fault-tolerance Architectures and Methods / 8.1.4.3：
Evolutionary Fault-tolerance Methods at Various Layers of the Hardware / 8.1.4.4：
Method Example / 8.1.4.5：
Artificial Immune Hardware Fault-tolerance / 8.2：
Biological Immune System and its Mechanism / 8.2.1：
Adaptive Immunity / 8.2.1.2：
Artificial Immune Systems / 8.2.1.3：
Fault-tolerance Principle of Immune Systems / 8.2.1.4：
Fault-tolerance Methods with Artificial Immune System / 8.2.2：
Artificial Immune Fault-tolerance System Architecture / 8.2.2.1：
Immune Object / 8.2.2.2：
Immune Control System / 8.2.2.3：
Working Process of Artificial Immune Fault-tolerance System / 8.2.2.4：
Implementation of Artificial Immune Fault-tolerance / 8.2.3：
Hardware / 8.2.3.1：
Software / 8.2.3.2：
Acronyms
Index
Brief Introduction
Preface
Introduction / 1：
8.

電子ブック
ＥＢ
8. Design and Analysis of Centrifugal Compressors
Rene Van den Braembussche
出版情報: Wiley Online Library - AutoHoldings Books , John Wiley & Sons, Inc., 2019
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Preface
Acknowledgements
List of Symbols
Introduction / 1：
Application of Centrifugal Compressors / 1.1：
Achievable Efficiency / 1.2：
Diabatic Flows / 1.3：
Transformation of Energy in Radial Compressors / 1.4：
Performance Map / 1.5：
Theoretical Performance Curve / 1.5.1：
Finite Number of Blades / 1.5.2：
Real Performance Curve / 1.5.3：
Degree of Reaction / 1.6：
Operating Conditions / 1.7：
Compressor Inlets / 2：
Inlet Guide Vanes / 2.1：
Influence of Prerotation on Pressure Ratio / 2.1.1：
Design of IGVs / 2.1.2：
The Inducer / 2.2：
Calculation of the Inlet / 2.2.1：
Determination of the Inducer Shroud Radius / 2.2.1.1：
Optimum Incidence Angle / 2.2.2：
Inducer Choking Mass Flow / 2.2.3：
Radial Impeller Flow Calculation / 3：
Inviscid Impeller Flow Calculation / 3.1：
Meridional Velocity Calculation / 3.1.1：
Blade to Blade Velocity Calculation / 3.1.2：
Optimal Velocity Distribution / 3.1.3：
3D Impeller Flow / 3.2：
3D Inviscid Flow / 3.2.1：
Boundary Layers / 3.2.2：
Secondary Flows / 3.2.3：
Shrouded-unshrouded / 3.2.3.1：
Full 3D Geometries / 3.2.4：
Performance Predictions / 3.3：
Flow in Divergent Channels / 3.3.1：
Impeller Diffusion Model / 3.3.2：
Two-zone Flow Model / 3.3.3：
Calculation of Average Flow Conditions / 3.3.4：
Influence of the Wake/let Velocity Ratio v on Impeller Performance / 3.3.5：
Slip Factor / 3.4：
Disk Friction / 3.5：
The Diffuser / 4：
Vaneless Diffusers / 4.1：
One-dimensional Calculation / 4.1.1：
Circumferential Distortion / 4.1.2：
Three-dimensional Flow Calculation / 4.1.3：
Vaned Diffusers / 4.2：
Curved Vane Diffusers / 4.2.1：
Channel Diffusers / 4.2.2：
The Vaneless and Semi-vaneless Space / 4.2.3：
The Diffuser Channel / 4.2.4：
Detailed Geometry Design / 5：
Inverse Design Methods / 5.1：
Analytical Inverse Design Methods / 5.1.1：
Inverse Design by CFD / 5.1.2：
Optimization Systems / 5.2：
Parameterized Definition of the Impeller Geometry / 5.2.1：
Search Mechanisms / 5.2.2：
Gradient Methods / 5.2.2.1：
Zero-order Search Mechanisms / 5.2.2.2：
Evolutionary Methods / 5.2.2.3：
Metamodel Assisted Optimization / 5.2.3：
Muitiobjective and Constraint Optimization / 5.2.4：
Muitiobjective Ranking / 5.2.4.1：
Constraints / 5.2.4.2：
Muitiobjective Design of Centrifugal Impellers / 5.2.4.3：
Multipoint Optimization / 5.2.5：
Design of a Low Solidity Diffuser / 5.2.5.1：
Multipoint Impeller Design / 5.2.5.2：
Robust Optimization / 5.2.6：
Volutes / 6：
Inlet Volutes / 6.1：
Inlet Bends / 6.1.1：
Vaned Inlet Volutes / 6.1.2：
Tangential Inlet Volute / 6.1.4：
Outlet Volutes / 6.2：
Volute Flow Model / 6.2.1：
Main Geometrical Parameters / 6.2.2：
Detailed 3D Flow Structure in Volutes / 6.2.3：
Design Mass Flow Operation / 6.2.3.1：
Lower than Design Mass Flow / 6.2.3.2：
Higher than Design Mass Flow / 6.2.3.3：
Central Elliptic Volutes / 6.2.4：
High Mass Flow Measurements / 6.2.4.1：
Medium and Low Mass Flow Measurements / 6.2.4.2：
Volute Outlet Measurements / 6.2.4.3：
Internal Rectangular Volutes / 6.2.5：
Medium Mass Flow Measurements / 6.2.5.1：
Low Mass Flow Measurements / 6.2.5.3：
Volute Cross Sectional Shape / 6.2.6：
Volute Performance / 6.2.7：
Experimental Results / 6.2.7.1：
Detailed Evaluation of Volute Loss Model / 6.2.7.2：
3D analysis of Volute Flow / 6.2.8：
Volute-diffuser Optimization / 6.3：
Non-axisymmetric Diffuser / 6.3.1：
Increased Diffuser Exit Width / 6.3.2：
Impeller Response to Outlet Distortion / 7：
Experimental Observations / 7.1：
Theoretical Predictions / 7.2：
1D Model / 7.2.1：
CFD- Mixing Plane Approach / 7.2.2：
3D Unsteady Flow Calculations / 7.2.3：
Impeller with 20 Full Blades / 7.2.3.1：
Impeller with Splitter Vanes / 7.2.3.2：
Inlet and Outlet Flow Distortion / 7.2.4：
Parametric Study / 7.2.4.1：
Frozen Rotor Approach / 7.2.5：
Radial Forces / 7.3：
Computation of Radial Forces / 7.3.1：
Off-design Performance Prediction / 7.4：
Impeller Response Model / 7.4.1：
Diffuser Response Model / 7.4.2：
Volute Flow Calculation / 7.4.3：
Impeller Outlet Pressure Distribution / 7.4.4：
Evaluation and Conclusion / 7.4.5：
Stability and Range / 8：
Distinction Between Different Types of Rotating Stall / 8.1：
Vaneless Diffuser Rotating Stall / 8.2：
Theoretical Stability Calculation / 8.2.1：
Comparison with Experiments / 8.2.2：
Influence of the Diffuser Inlet Shape and Pinching / 8.2.3：
Abrupt Impeller Rotating Stall / 8.3：
Theoretical Prediction Models / 8.3.1：
Comparison with Experimental Results / 8.3.2：
Progressive Impeller Rotating Stall / 8.4：
Vaned Diffuser Rotating Stall / 8.4.1：
Return Channel Rotating Stall / 8.5.1：
Surge / 8.6：
Lumped Parameter Surge Model / 8.6.1：
Mild Versus Deep Surge / 8.6.2：
An Alternative Surge Prediction Model / 8.6.3：
Operating Range / 9：
Active Surge Control / 9.1：
Throttle Valve Control / 9.1.1：
Variable Plenum Control / 9.1.2：
Active Magnetic Bearings / 9.1.3：
Close-coupled Resistance / 9.1.4：
Bypass Valves / 9.2：
Increased Impeller Stability / 9.3：
Dual Entry Compressors / 9.3.1：
Casing Treatment / 9.3.2：
Enhanced Vaned Diffuser Stability / 9.4：
Impeller-diffuser Matching / 9.5：
Enhanced Vaneless Diffuser Stability / 9.6：
Low Solidity Vaned Diffusers / 9.6.1：
Half-height Vanes / 9.6.2：
Rotating Vaneless Diffusers / 9.6.3：
Bibliography
Index
Preface
Acknowledgements
List of Symbols
9.

電子ブック
ＥＢ
9. Electron Microscopical Investigation of Interdiffusion and Phase Formation at Gd2O3/CeO2- and Sm2O3/CeO2-Interfaces
Christian Rockenhäuser
出版情報: SpringerLink Books - AutoHoldings , Springer Fachmedien Wiesbaden, 2015
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10.

電子ブック
ＥＢ
10. Chalcogenide Photovoltaics: Physics, Technologies, and Thin Film Devices
Roland Scheer, Hans-Werner Schock
出版情報: Wiley Online Library - AutoHoldings Books , John Wiley & Sons, Inc., 2011
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目次情報: 続きを見る
Preface
Symbols and Acronyms
Introduction / 1：
History of Cu(In,Ga)(S,Se)2 Solar Cells / 1.1：
Milestones of Cu(In,Ga)(S,Se)2 Development / 1.1.1：
History of CdTe Solar Cells / 1.2：
Milestones of CdTe Development / 1.2.1：
Prospects of Chalcogenide Photovoltaics / 1.3：
Thin Film Heterostructures / 2：
Energies and Potentials / 2.1：
Charge Densities and Fluxes / 2.2：
Energy Band Diagrams / 2.3：
Rules and Conventions / 2.3.1：
Absorber/Window / 2.3.2：
Absorber/Buffer/Window / 2.3.3：
Interface States / 2.3.4：
Interface Dipoles / 2.3.5：
Deep Bulk States / 2.3.6：
Bandgap Gradients / 2.3.7：
Diode Currents / 2.4：
Superposition Principle and Shifting Approximation / 2.4.1：
Regions of Recombination / 2.4.2：
Radiative Recombination / 2.4.3：
Auger Recombination / 2.4.4：
Defect Related Recombination / 2.4.5：
SCR Recombination / 2.4.5.1：
QNR Recombination / 2.4.5.2：
Back Surface Recombination / 2.4.5.3：
Interface Recombination / 2.4.5.4：
Parallel Processes / 2.4.6：
SCR and QNR Recombination / 2.4.6.1：
SCR and IF Recombination / 2.4.6.2：
Barriers for Diode Current / 2.4.7：
Bias Dependence / 2.4.8：
Non-Homogeneities / 2.4.9：
Light Generated Currents / 2.5：
Generation Currents / 2.5.1：
Generation Function / 2.5.2：
Photo Current / 2.5.3：
Collection Function / 2.5.4：
Absorber Quasi Neutral Region / 2.5.4.1：
QNR with Graded Bandgap / 2.5.4.2：
QNR with Back Surface Field / 2.5.4.3：
Absorber Space Charge Region / 2.5.4.4：
Buffer Layer / 2.5.4.5：
Simulating the Collection Function / 2.5.4.6：
Quantum Efficiency and Charge Collection Efficiency / 2.5.5：
Barriers for Photo Current / 2.5.6：
Voltage Dependence of Photo Current / 2.5.7：
Width of SCR / 2.5.7.1：
Photo Current Barriers / 2.5.7.2：
Device Analysis and Parameters / 2.6：
Equivalent Circuits / 2.6.1：
DC Equivalent Circuit / 2.6.1.1：
AC Equivalent Circuit / 2.6.1.2：
Module Equivalent Circuit / 2.6.1.3：
Current-Voltage Analysis / 2.6.2：
External Collection Efficiency / 2.6.2.1：
Diode Parameters / 2.6.2.2：
Open Circuit Voltage / 2.6.2.3：
Fill Factor / 2.6.2.4：
Capacitance-Voltage Analysis / 2.6.3：
Admittance Spectroscopy / 2.6.4：
Design Rules for Heterostructure Solar Cells and Modules / 3：
Absorber Bandgap / 3.1：
Band Alignment / 3.2：
Emitter Doping and Doping Ratio / 3.3：
Fermi Level Pinning / 3.4：
Absorber Doping / 3.5：
Absorber Thickness / 3.6：
Grain Boundaries / 3.7：
Back Contact Barrier / 3.8：
Buffer Thickness / 3.9：
Front Surface Gradient / 3.10：
Back Surface Gradients / 3.11：
Monolithic Series Interconnection / 3.12：
Thin Film Material Properties / 4：
AII-BVI Absorbers / 4.1：
Physico-Chemical Properties / 4.1.1：
Lattice Dynamics / 4.1.2：
Electronic Properties / 4.1.3：
Practical Doping Limits / 4.1.3.1：
Defect Spectroscopy / 4.1.3.2：
Minority Carrier Lifetime / 4.1.3.3：
Optical Properties / 4.1.4：
CdTe / 4.1.4.1：
Multinary Phases / 4.1.4.2：
Surface Properties / 4.1.5：
Properties of Grain Boundaries / 4.1.6：
AI-BIII-C2VI Absorbers / 4.2：
Ternary Phase Diagrams / 4.2.1：
Diffusion Coefficients / 4.2.1.2：
Single Point Defects / 4.2.2：
Defect Complexes / 4.2.3.2：
Carrier Mobility / 4.2.3.3：
Minority Carrier lifetime / 4.2.3.6：
Ternary Semiconductors / 4.2.4：
Multinary Semiconductors / 4.2.4.2：
Surface Composition / 4.2.5：
Surface Electronics / 4.2.5.2：
Buffer Layers / 4.2.6：
Window Layers / 4.4：
Low Resistance Windows / 4.4.1：
High Resistance Windows / 4.4.2：
Interfaces / 4.5：
Thin Film Technology / 5：
CdTe Cells and Modules / 5.1：
Substrates / 5.1.1：
Window Layers for CdTe Cells / 5.1.2：
Buffer Layers for CdTe Cells / 5.1.3：
CdTe Absorber Layer / 5.1.4：
Activation by Chlorine Treatment / 5.1.5：
Influence of Oxygen / 5.1.6：
Influence of Copper / 5.1.7：
Back Contact / 5.1.8：
Surface Modification / 5.1.8.1：
Primary and Secondary Contacts / 5.1.8.2：
Module Fabrication and Life Cycle Analysis / 5.1.9：
Cu(In,Ga)(S,Se)2 Cells and Modules / 5.2：
Back Contacts / 5.2.1：
Cu(In,Ga)(S,Se)2 Absorber Layers / 5.2.3：
Co-evaporation / 5.2.3.1：
Deposition Reaction / 5.2.3.2：
Sputtering / 5.2.3.3：
Epitaxy, Chemical Vapor Deposition, and Vapor Transport Processes / 5.2.3.4：
Influence of Sodium / 5.2.4：
Influence of Gallium / 5.2.5：
Influence of Sulfur / 5.2.6：
Buffer Layers of CIGS / 5.2.7：
Chemical Bath Deposited CdS / 5.2.8.1：
Alternative Buffer Layers / 5.2.8.2：
Window Layers of CIGS / 5.2.9：
Module Fabrication / 5.2.10：
Photovoltaic Properties of Standard Devices / 6：
CdTe Device Properties / 6.1：
Solar Cell Parameters / 6.1.1：
Collection Functions / 6.1.2：
Device Anomalies / 6.1.4：
Transient Effects and Metastability / 6.1.5：
Device Model / 6.1.6：
Stability / 6.1.7：
AI-BIII-C2VI Device Properties / 6.2：
Relaxed State / 6.2.1：
Models for Relaxed State / 6.2.4.2：
Red light Effect / 6.2.4.3：
Forward Bias Effect / 6.2.4.4：
Blue Light Effect / 6.2.4.5：
White Light Effect / 6.2.4.6：
Reverse Bias Effect / 6.2.4.7：
Models for Metastability / 6.2.4.8：
Implications for Module Testing / 6.2.4.9：
Appendix A: Frequently Observed Anomalies / 6.2.5：
JV Curves / 7.1：
Roll Over Effect / 7.1.1：
Crossover / 7.1.2：
Kink in Light JV Curve / 7.1.3：
Violation of Shifting Approximation / 7.1.4：
Reduced Jsc but High Voc / 7.2：
Reduced Voc but High Jsc / 7.2.2：
High Jsc but Low FF / 7.2.3：
Diode Parameter A > 2 / 7.3：
Activation Energy Ea < Eg,a / 7.3.2：
Diode Quality Factor Illumination Dependent / 7.3.3：
Diode Quality Factor Temperature-Dependent / 7.3.4：
Quantum Efficiency / 7.4：
High Jsc but Low EQE / 7.4.1：
Low Jsc but High EQE / 7.4.2：
Low Blue Response in IQE / 7.4.3：
Low Red Response in IQE / 7.4.4：
Quantum Efficiency Low at All Wavelengths / 7.4.5：
Apparent Quantum Efficiency / 7.4.6：
Transient Effects / 7.5：
Voc Time-Dependent with dVoc/dt > 0 / 7.5.1：
Voc Time-Dependent with dVoc/dt < 0 / 7.5.2：
Appendix B: Tables / 8：
References
Index
Preface
Symbols and Acronyms
Introduction / 1：
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