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1.

図書

図書
edited by John H. Lau
出版情報: New York : Van Nostrand Reinhold, c1991  xx, 631 p. ; 24 cm
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2.

図書

図書
by R.J. Klein Wassink
出版情報: Ayr, Scotland : Electrochemical Publications, c1989  xx, 753 p. ; 24 cm
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3.

図書

図書
Ralph W. Woodgate
出版情報: New York : Wiley, c1988  xiv, 256 p. ; 24 cm
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4.

図書

図書
edited by D.R. Frear ... [et al]
出版情報: New York : Van Nostrand Reinhold, c1994  xiv, 418 p. ; 24 cm
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目次情報: 続きを見る
Foreword
Acknowldgement
Introduction: the mechanics of soldere alloy interconnect
Microstructural influences on the mechanical properties of solder
Interfaces and intermetallics
Constitutivemodels
Prediction of solder joint geometry
Life prediction and accelerated testing
Thermomechanical modeling of solder joints - numerical considerations
Applications - through-hole
Surface mount solder joints under thermal, mechanical, and vibration conditions
Index
Foreword
Acknowldgement
Introduction: the mechanics of soldere alloy interconnect
5.

図書

図書
Giles Humpston, David M. Jacobson
出版情報: Materials Park, OH : ASM International, c1993  xiii, 281 p. ; 26 cm
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6.

図書

図書
edited by F.G. Yost, F.M. Hosking, D.R. Frear
出版情報: New York : Van Nostrand Reinhold, c1993  xviii, 356 p. ; 24 cm
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