Microdrop generation

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Microdrop generation / Eric R. Lee

資料種別:: 図書
出版情報:: Boca Raton : CRC Press, c2003
形態:: 252 p. ; 25 cm
シリーズ名:: Nano- and microscience, engineering, technology and medicine series <BA5182498X>
著者名:: Lee, Eric R.
ISBN:: 9780849315596 [084931559X]
書誌ID:: BA64750853

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注記:

Includes bibliographical references and index

主題:

Atomizers; Electrostatic atomization; Spraying

言語:

英語

目次情報:

What Can You Do With a Microdrop? / Chapter 1：

Characteristics of Microdrops / 1.1：

Size / 1.1.1：

Precision Deposition Ability / 1.1.2：

Isolation / 1.1.3：

High Rate Production / 1.1.4：

Use of Microdrops in Pure Science / 1.2：

Particle Physics / 1.2.1：

Fluid Dynamics / 1.2.2：

Physical Optics / 1.2.3：

Physical Chemistry / 1.2.4：

Use of Microdrops in Applied Science / 1.3：

Combinatorial Chemistry / 1.3.1：

Micromixing / 1.3.2：

Automated Microtitration / 1.3.3：

MALDI TOF Spectroscopy Sample Loading / 1.3.4：

Loading and Dispensing Reagents from Microreactors / 1.3.5：

Gas Flow Visualization / 1.3.6：

Biotechnology Applications of Microdrops / 1.4：

Cell Sorting / 1.4.1：

DNA Microarrays / 1.4.2：

DNA Synthesis / 1.4.3：

Drug Discovery / 1.4.4：

Medical Therapeutics / 1.4.5：

Applications in Manufacturing and Engineering / 1.5：

Optics / 1.5.1：

Droplet-Based Manufacturing / 1.5.2：

Inkjet Soldering / 1.5.3：

Precision Fluid Deposition / 1.5.4：

Displays / 1.5.5：

Thin Film Coating / 1.5.6：

Heat Radiators / 1.5.7：

Monodisperse Aerosolizing for Combustion / 1.5.8：

Monodisperse Aerosolizing for Dispersing Pesticides / 1.5.9：

Document Security / 1.5.10：

Integrated Circuit (IC) Manufacturing / 1.5.11：

IC Manufacturing--Photoresist Deposition / 1.5.12：

IC Manufacturing--Conductor and Insulating Dielectric Deposition / 1.5.13：

IC Manufacturing--Depositing Sensing and Actuating Compounds / 1.5.14：

References

Methods of Generating Monodisperse Microdrops / Chapter 2：

Acoustically Disrupted Continuous Fluid Jet / 2.1：

Thermal Inkjet (Bubble Jet) / 2.2：

Piezoelectric Direct Pressure Pulse / 2.3：

Focused Acoustic Beam Ejection / 2.4：

Liquid Spark Inkjet / 2.5：

Electrohydrodynamic Inkjet / 2.6：

Flextensional Aperture Plate Inkjet / 2.7：

Electro-Rheological Fluid Inkjet / 2.8：

Liquid Ink Fault Tolerant (LIFT) Process / 2.9：

TopSpot Microdrop Ejector / 2.10：

Summary and Recommendations / 2.11：

Particle Kinetics of Ejected Microdrops / Chapter 3：

Reynolds Number and Stokes Law / 3.1：

Buoyancy Correction / 3.1.1：

Internal Drop Flow / 3.1.2：

Nonspherical Drops / 3.1.3：

Terminal Velocity / 3.2：

Relaxation Time Constant / 3.3：

Streaming / 3.4：

Impact / 3.5：

Brownian Motion / 3.6：

Motion in Electric Fields / 3.7：

Electrostatic Deflection of Charged Microdrops / 3.7.1：

Electric Charging of Microdrops / Chapter 4：

Rayleigh Limit to Charging Microdrops / 4.1：

Drop Charging Mechanisms / 4.2：

Triboelectric Charging / 4.2.1：

Fluid Jet Polarization / 4.2.2：

Electrical Double Layer Charging / 4.2.3：

Spray Charging / 4.2.4：

Statistical Fluctuations / 4.2.5：

Absorption of Gaseous Ions / 4.2.6：

Photoelectric Emission / 4.2.7：

Practical Drop Charge Control Methods / 4.3：

Contact Surface Modification / 4.3.1：

Charge Control Using Ionized Air / 4.3.2：

Variations in the Induced Charge / 4.4：

Engineering Requirements for Reliable Microdrop Generation / Chapter 5：

Conditions Needed for Monodisperse Drop-On-Demand Operation / 5.1：

Drive Pulse Amplitude / 5.2：

Drive Pulse Shape / 5.3：

Double Pulse Excitation / 5.3.1：

Bipolar Pulse Excitation / 5.3.2：

Internal Pressure Level / 5.4：

Drop Ejection Rate / 5.5：

Fluid Fill Level / 5.6：

Fluid Temperature / 5.7：

Troubleshooting Microdrop Ejectors / Chapter 6：

Clogged Nozzles / 6.1：

Damaged Nozzles / 6.2：

Internal Air Bubbles / 6.3：

Misdirected Jets / 6.4：

Overly Wetted Meniscus / 6.5：

Internal Pressure / 6.6：

Insufficient Drive Amplitude / 6.7：

Nonoptimal Pulse Waveform / 6.8：

Pulse Rate / 6.9：

Problematic Fluids / 6.10：

Mechanical Mounting / 6.11：

Imaging System / 6.12：

Recommended Startup Procedure to Test a New Drop Generation and Imaging System / 6.13：

Reference

Imaging Microdrops / Chapter 7：

Direct Viewing of Illuminated Microdrops / 7.1：

Backlight Illumination Sources / 7.1.1：

Bright Background Imaging of Microdrops / 7.2：

Bright Source Stroboscopically Illuminated Droplets / 7.3：

Light Emitting Diode Illumination Arrays / 7.4：

Imaging System Synchronization / 7.5：

Cameras / 7.6：

Stroboscopic Illumination Sources / 7.8：

Low-Cost Microdrop Imaging Hardware / 7.9：

Low-Cost Cameras / 7.9.1：

Low Cost Optics / 7.9.2：

Drop Ejector Drive Electronics / Chapter 8：

Gated Voltage Source Pulsers / 8.1：

Linear Pulse Power Amplifiers / 8.2：

Fabrication of Ejection Aperture Nozzles / Chapter 9：

Ejection Nozzle Requirements / 9.1：

Fabricating Acute Edge Conical Glass Nozzles / 9.2：

Fabricating Tapered Profile Glass Nozzles / 9.3：

Silicon Micromachined Ejection Apertures / 9.4：

Fabrication Sequence for Silicon Micromachined Apertures / 9.5：

Processing Steps for Fabricating Silicon Fluid Ejection Nozzles / 9.5.1：

Electroformed Ejection Apertures / 9.6：

Jewel Bearings and Nozzles / 9.6.1：

Metal Optical Pinhole Apertures / 9.7：

Small Hole Manufacturing Technologies--A Summary of Techniques / 9.8：

Mechanical Drilling / 9.8.1：

Mechanical Punching / 9.8.2：

Photosensitive Glass / 9.8.3：

Soluble Core Glass Fibers / 9.8.4：

Laser Drilling / 9.8.5：

Electroforming Over a Sacrificial Post / 9.8.6：

Photon Directed Chemical Etching / 9.8.7：

Electron Beam Machining / 9.8.8：

Electro-Discharge-Machining (EDM) / 9.8.9：

Lithography and Chemical Etching / 9.8.10：

Lithography and Anisotropic Reactive Ion Etching / 9.8.11：

Thermally Tapered Glass Pipettes / 9.8.12：

Anti-Wetting Surface Coatings / 9.9：

Coating Methods / 9.9.1：

Drop Ejector Construction / Chapter 10：

Tubular Reservoir Piezoelectric Drop Ejectors / 10.1：

Metal Body Drop Generator / 10.2：

Glass, Straight Tube, Welded Aperture / 10.3：

Fabricating the Apertures / 10.3.1：

Thermal Weld Attachment of the Ejection Aperture / 10.3.2：

Trimming / 10.3.4：

Attaching the Piezoelectric Element / 10.3.5：

Glass, Pipette, Welded Aperture / 10.4：

Glass, Miniature, Welded Aperture / 10.5：

Piezoelectric Element Configuration / 10.6：

Piezoelectric Disc Actuators / 10.7：

Rectangular Slab Drive Elements / 10.8：

Cylindrical Piezoelectric Drive Elements / 10.9：

Integral Heating Elements / 10.10：

Pressure Control / Chapter 11：

Manometer Tube Pressure Control System / 11.1：

Variable Height Reservoir Pressure Control System / 11.2：

Automated Pressure Control / 11.3：

Fluid Engineering for Microdrop Ejectors / Chapter 12：

Nonclogging Fluids / 12.1：

First Drop Reliability / 12.3：

Jetting Stability / 12.4：

Directional Stability / 12.5：

Freedom from Satellite Drops / 12.6：

Wide Jet Velocity Tolerance / 12.7：

Drive Waveform Tolerance / 12.8：

Repetition Rate / 12.9：

Environmental and Temporal Stability / 12.10：

Chemical Reactivity with Drop Generator / 12.11：

Toxicity / 12.12：

Cost / 12.13：

Components of Drop-on-Demand Ejector Fluids / Chapter 13：

Payload / 13.1：

Solvent / 13.2：

Humectants / 13.3：

Viscosity Modifiers / 13.4：

Newtonian / 13.4.1：

Shear Thinning (Pseudo-Plastic) / 13.4.2：

Shear Thickening (Dilatant Fluids) / 13.4.3：

Plastic (Bingham-Plastic) / 13.4.4：

Surfactants / 13.5：

Dispersants / 13.6：

Polymeric Fluid Elasticity Agents / 13.7：

Anti-Fungal Agents (Biocides, Preservatives) / 13.8：

Chelating Agents / 13.9：

pH Controllers / 13.10：

Corrosion Inhibitors / 13.11：

Defoamer / 13.12：

Electrical Conductivity Salts / 13.13：

Additives Specific for Thermal Inkjet / 13.14：

Antikogation Agent / 13.14.1：

Bubble Nucleation Promoter / 13.14.2：

Additives Specific for Inkjet Image Printing / 13.15：

Making Jettable Suspensions of Ground Solids / Chapter 14：

Obtaining Small Diameter Particles / 14.1：

Necessary Particle Size / 14.2：

Wetting and Dispersing / 14.3：

High Powered Ultrasound / 14.3.1：

Fluid Jet Impingement / 14.3.2：

Rotary Mixers / 14.3.3：

Filtering and Settling / 14.4：

Essential References / 14.5：

Ejectability / 14.6：

Final Caution--Make Sure You Have a Real Suspension / 14.7：

Setting Up a Microdrop System ASAP / Appendix I：

Buying a System / I.1：

Companies that Sell Nonimage Printing Microdrop Generating Systems / I.2：

Piezoelectrically Actuated Drop-on-Demand Systems / I.2.1：

Focused Acoustic Beam Drop-on-Demand Systems / I.2.2：

Fluid Displacement Drop-on-Demand Systems (TopSpot Array Printer) / I.2.3：

Continuous Jet Microdrop Arrays Printers / I.2.4：

Imaging Systems / I.2.5：

Microdrop Systems Consulting / I.2.6：

Building a System / I.3：

Drop Dispensers / I.3.1：

Drive Electronics / I.4：

Imaging / I.5：

Setup and Testing / I.6：

Cleaning / I.6.1：

Filling / I.6.2：

Electronic Drive Settings / I.6.3：

Example Inkjet Ink Formulations from Patent Literature / Appendix II：

Dye Based Inkjet Inks / II.1：

Pigment Based Inkjet Inks / II.2：

Ejection Tests of Biological Fluids / Appendix III：

Test Series I / III.1：

Test Fluids / III.1.1：

Test Procedure / III.1.2：

Results / III.1.3：

DNA Marker 1 Microgram/Microliter / III.1.3.1：

DNA Marker Diluted (10% Marker, 90% Distilled Water) / III.1.3.2：

Yeast Cell Suspension / III.1.3.3：

E. Coli Cell Suspension / III.1.3.4：

Spe I Enzyme, 20% Glycerol / III.1.3.5：

Summary of Results / III.1.4：

Test Series II / III.2：

Cleaning Protocol / III.2.1：

Control Buffer-10mM Tris-Acetate, pH 8.2 / III.2.3：

Plasmid DNA in Buffer / III.2.3.2：

MO Reagent / III.2.3.3：

DNA + MO / III.2.3.4：

Polyplex (DNA + dendrimer) / III.2.3.5：

Dendrimer / III.2.3.6：

Supplemental Control Tests Utilizing the Same Drop Ejector / III.2.4：

Distilled Water / III.2.4.1：

Distilled Water with 20% Glycerol / III.2.4.2：

Distilled Water with 20% Propylene Glycol / III.2.4.3：

Fluid #2 (Plasmid DNA in Buffer) with 20% Glycerol / III.2.4.4：

Fluid #2 (Plasmid DNA in Buffer) with 20% Propylene Glycol / III.2.4.5：

Index / III.2.5：

What Can You Do With a Microdrop? / Chapter 1：

Characteristics of Microdrops / 1.1：

Size / 1.1.1：

Precision Deposition Ability / 1.1.2：

Isolation / 1.1.3：

High Rate Production / 1.1.4：

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