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1.

図書
図書
1. Fish swimming (: pbk)
John J. Videler
出版情報: [S.l.] : Springer-Science+Business Media, 1993  xx, 260 p. ; 24 cm
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2.

図書
図書
2. Українсько-англійський словник = Ukrainian-English dictionary (: pbk)
compiled by C.H. Andrusyshen and J.N. Krett ; assisted by Helen Virginia Andrusyshen
出版情報: [Toronto] : Published for the University of Saskatchewan by University of Toronto Press, 1993, c1955  xxix, 1163 p. ; 22 cm
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3.

雑誌
雑誌
3. IO, Management-Zeitschrift
Betriebswissenschaftliches Institut der Eidg. Technischen Hochschule
出版情報: Zürich : Industrielle Organisation, -1993
巻次年月次: 49. Jahrg. (1980)-62. Jahrg., Nr. 12 (1993)
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4.

雑誌
雑誌
4. Bulletin der Vereinigung Schweiz. Petroleum-Geologen und- Ingenieure
Vereinigung Schweiz. Petroleum-Geologen und -Ingenieure
出版情報: [Swiss] : [s.n.], -[1993]  v ; 25 cm
巻次年月次: -v. 60, Nr. 137 (Dez. 1993)
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5.

雑誌
雑誌
5. Journal français d'hydrologie
Association pharmaceutique française pour l'hydrologie
出版情報: Paris : Association pharmaceutique française pour l'hydrologie, -1993  v
巻次年月次: -t. 24, fasc. 2 (1993)
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6.

図書
図書
6. Object-oriented programming ([text] ; computer disk)
Peter Coad and Jill Nicola
出版情報: London : Prentice-Hall International, c1993  xlii, 582 p. ; 23 cm.
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目次情報: 続きを見る
The Count / 1：
Getting Started with Some OOA
OOP--Problem Domain Component: Smalltalk
OOP--Problem Domain Component: C++
OOD--Human Interaction Component
OOD--Human Interaction Component: Smalltalk
OOP--Human Interaction Component: Smalltalk
OOD--Human Interaction Component: C++
OOP--Human Interaction Component: C++
ASCII Count
ASCII Count: Smalltalk
ASCII Count: C++
Date Count
Date Count: Smalltalk
Date Count: C++
Sequence Count
Sequence Count: Smalltalk
Sequence Count: C++
Summary
The Vending Machine / 2：
Some OOA
Some Planning
OOD--The Problem Domain Component (The First Round)
OOP--The Problem Domain Component: Smalltalk (The First Round)
OOP--The Problem Domain Component: C++ (The First Round)
About Implementing Connections with Other Objects
OOD--The Problem Domain Component (The Second Round)
OOP--The Problem Domain Component: Smalltalk (The Second Round)
OOP--The Problem Domain Component: C++ (The Second Round)
OOD--The Human Interaction Component: Smalltalk
About Making Change
Sales, Sales, Sales / 3：
OOD--Problem Domain Component
OOD--Data Management Component
OOP--Problem Domain Component Update: Smalltalk
OOP--Problem Domain Component Update: C++
OOP--Data Management Component: Smalltalk
OOP--Data Management Component: C++
Go With the Flow / 4：
OOP--The Problem Domain Component: Smalltalk
Epilogue
Appendixes
A--Practical Language Summaries
B--OOA and OOD Notation
C--OOP Principles
Bibliography.
The Count / 1：
Getting Started with Some OOA
OOP--Problem Domain Component: Smalltalk
7.

図書
図書
7. Proceedings of the Yamada Conference XXXV on High Energy Spin Physics : 10th International Symposium on High Energy Spin Physics, November 9-14, 1992, Nagoya, Japan
edited by T. Hasegawa ... [et al.]
出版情報: [Osaka] : Yamada Science Foundation, c1993  xx, 950 p. ; 23 cm
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8.

図書
図書
8. An introduction to the finite element method. 2nd ed., International ed
J.N. Reddy
出版情報: New York ; Tokyo : McGraw-Hill, c1993  xix, 684 p. ; 23 cm
シリーズ名: McGraw-Hill series in mechanical engineering
McGraw-Hill international editions
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9.

図書
図書
9. Practical applications of infrared thermal sensing and imaging equipment
Herbert Kaplan
出版情報: Bellingham, Wash. : SPIE Optical Engineering Press, c1993  xiv, 137 p. ; 26 cm
シリーズ名: Tutorial texts in optical engineering ; v. TT 13
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目次情報: 続きを見る
Preface
Basics and Instrument Overview / Part I：
Introduction / Chapter 1：
The Reasons for Using Infrared Instruments / 1.1：
Advantages of Noncontact Thermal Measurement / 1.2：
Some Historical Background / 1.3：
An Overview of This Text / 1.4：
Basics of Noncontact Thermal Measurements / Chapter 2：
Heat Transfer and Radiation Exchange Basics / 2.1：
Heat and Temperature / 2.1.1：
Converting Temperature Units / 2.1.2：
The Three Modes of Heat Transfer / 2.1.3：
Conduction / 2.1.4：
Convection / 2.1.5：
Radiation / 2.1.6：
Radiation Exchange at the Target Surface / 2.1.7：
Specular and Diffuse Surfaces / 2.1.8：
Transient Heat Exchange / 2.1.9：
The Infrared Measurement Problem / 2.2：
Noncontact Thermal Measurements / 2.2.1：
The Target Surface / 2.2.2：
The Transmitting Medium / 2.2.3：
The Measuring Instrument / 2.2.4：
Introduction to Thermal Scanning and Imaging Instruments / 2.3：
Line Scanning / 2.3.1：
Two-dimensional Scanning / 2.3.2：
Multidetector Scanners and SPRITE Technology / 2.3.3：
Infrared Focal Plane Array (IRFPA) Imagers / 2.3.4：
Pyroelectric Vidicon Thermal Imagers / 2.3.5：
Matching the Instrument to the Application / Chapter 3：
Point-Sensing Instruments / 3.1：
Scanners and Imagers--Qualitative and Quantitative / 3.2：
Performance Parameters of Imaging Radiometers / 3.2.1：
Thermal Imaging Software / 3.3：
Overview of Instruments / Chapter 4：
Introduction and Classification of Instruments / 4.1：
Instrument Manufacturers / 4.2：
Discussion of Instruments / 4.3：
Point Sensors (Radiation Thermometers) / 4.3.1：
Infrared Thermocouples and Probes / 4.3.1.1：
Portable Hand-held Group / 4.3.1.2：
On-line Monitoring and Control / 4.3.1.3：
Special / 4.3.1.4：
Line Scanners / 4.3.2：
Portable Line Scanner / 4.3.2.1：
On-line (Monitoring and Control) Line Scanners / 4.3.2.2：
Thermographic / 4.3.3：
Mechanically Scanned Thermal Viewers / 4.3.3.1：
Electronically Scanned Thermal Viewers (Pyrovidicon Imagers) / 4.3.3.2：
"Staring" FPA Thermal Viewers (Qualitative) / 4.3.3.3：
Thermographic Raster Scanners (Imaging Radiometers) / 4.3.3.4：
FPA Imaging Radiometers (Quantitative) / 4.3.3.5：
Thermal Imaging Diagnostic Software / 4.4：
Quantitative Thermal Measurements of Targets / 4.4.1：
Detailed Processing and Image Diagnostics / 4.4.2：
Image Recording, Storage and Recovery / 4.4.3：
Image Comparison / 4.4.4：
Report and Database Preparation / 4.4.5：
Recording, Hard Copy and Storage of Images and Data / 4.5：
Using Ir Sensing and Imaging Instruments / Chapter 5：
Introduction: The Thermal Behavior of the Target / 5.1：
Emissivity Difference / 5.1.1：
Reflectance Difference / 5.1.2：
Transmittance Difference / 5.1.3：
Geometric Difference / 5.1.4：
Mass Transport Difference / 5.1.5：
Phase-change Difference / 5.1.6：
Thermal Capacitance Difference / 5.1.7：
Induced Heating Difference / 5.1.8：
Energy Conversion Difference / 5.1.9：
Direct Heat Transfer Difference / 5.1.10：
Learning about the Target Environment / 5.1.11：
Preparation of Equipment for Operation / 5.2：
Calibration / 5.2.1：
Checking Calibration / 5.2.1.1：
Transfer Calibration / 5.2.1.2：
The Equipment Checklist / 5.2.2：
Equipment Checkout and Calibration / 5.2.3：
Batteries / 5.2.4：
Avoiding Common Mistakes in Instrument Operation / 5.3：
Start-up Procedure / 5.3.1：
Memorizing the Default Values / 5.3.2：
Setting the Correct Emissivity / 5.3.3：
Filling the IFOV meas for Accurate Temperature Measurements / 5.3.4：
Aiming Normal to the Target Surface / 5.3.5：
Recognizing and Avoiding Reflections from External Sources / 5.3.6：
Avoiding Radiant Heat Damage to the Instrument / 5.3.7：
Instrument Applications / Part II：
Introduction to Applications / Chapter 6：
Plant Condition Monitoring and Predictive Maintenance / Chapter 7：
Electrical / 7.1：
High Electrical Resistance / 7.2.1：
Short Circuits / 7.2.2：
Open Circuits / 7.2.3：
Inductive Currents / 7.2.4：
Energized Grounds / 7.2.5：
Condition Guidelines / 7.2.6：
Mechanical / 7.3：
Friction / 7.3.1：
Valve or Pipe Blockage/Leakage / 7.3.2：
Insulation within the Plant or Facility / 7.3.3：
Miscellaneous Applications / 7.4：
Rebar Location / 7.4.1：
Condenser Air In-leakage / 7.4.2：
Containment Spray Ring Headers / 7.4.3：
Hydrogen Igniters / 7.4.4：
Effluent Thermal Plumes / 7.4.5：
Buildings and Infrastructure / Chapter 8：
Measuring Insulating Properties / 8.1：
Considering the Total Structure / 8.3：
Industrial Roof Moisture Detection / 8.4：
Thermographic Inspection of Our Aging Infrastructure / 8.5：
Materials Testing / Chapter 9：
Materials Testing--Infrared Nondestructive Testing / 9.1：
Failure Modes and Establishment of Acceptance Criteria / 9.2：
Selecting the IR Imaging System / 9.3：
Pulsed Heat Injection Applications / 9.4：
Boiler Tube Corrosion Thinning Assessment / 9.4.1：
Infrastructure NDT / 9.5：
Product and Process Monitoring and Control / Chapter 10：
The Evolution of Noncontact Process Control / 10.1：
Full Image Process Monitoring / 10.2：
Product Monitoring of Semiconductors / 10.3：
Steel Wire Drawing Machine Monitoring / 10.4：
Full Image Process Control / 10.5：
Closing the Loop--Examples / 10.6：
Night Vision, Security and Surveillance / Chapter 11：
Nonmilitary Applications / 11.1：
Aerial and Ground (Sea) Based Search and Rescue / 11.2.1：
Firefighting / 11.2.2：
Space and Airborne Reconnaissance / 11.2.3：
Police Surveillance and Crime Detection and Security / 11.2.4：
Drivers' Aid Night Vision / 11.2.5：
Commercial Instrument Performance Characteristics / Appendix A：
Manufacturers of Ir Sensing and Imaging Instruments / Appendix B：
Generic Emissivities of Materials / Appendix C：
Preface
Basics and Instrument Overview / Part I：
Introduction / Chapter 1：
10.

図書
図書
10. Dynamics of structures. 2nd ed, international ed (: pbk)
Ray W. Clough, Joseph Penzien
出版情報: New York : McGraw-Hill, 1993  xxii, 738 p. ; 25 cm
シリーズ名: McGraw-Hill civil engineering series
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