| Committees and Sponsors |
| Preface |
| List of Participants |
| Grain Boundary Diffusion and Oxidation Processes / J. Philibert |
| Influence of Grain Boundary Diffusion on Thin Film Reactions / P. Gas |
| Motion of the Grain Boundary System with the Triple Junctions / L.S. Shvindlerman ; G. Gottstein ; U. Czubayko ; V.G. Sursaeva |
| Study of Grain-Boundary Diffusion of Au in Copper within [Sigma]5 Misorientation Range in the Context of Structure of Grain Boundaries / E. Budke ; Chr. Herzig ; S. Prokofjev ; L. Shvindlerman |
| Grain Boundary Diffusion in Polycrystalline Solids with an Arbitrary Grain Size / S.V. Divinski |
| Pseudo Type-B Diffusion Regime in Cu Grain Boundaries below 250 [degree]C / D. Gupta |
| Segregation and Grain Boundary Diffusion in Metals and Elemental Semi-Conductors / J. Bernardini |
| Nonlinear Segregation Effects on Grain Boundary Heterodiffusion. Extraction of Segregation Term from a Triple Product / B. Bokstein ; A. Ostrovsky |
| Solute Diffusion and Segregation in Grain Boundaries of Silver and Copper / T. Surholt ; C. Minkwitz |
| Grain Boundary Diffusion and Stability of the Triple Junctions / A.N. Aleshin ; W. Gust ; E. Rabkin |
| A New Method for Grain Boundary Diffusion Coefficient Measurement / R. Le Gall ; G. Saindrenan ; D. Roptin |
| Structure, Bonding and Property Changes due to Grain Boundary Segregation / Sh. Subramanian ; D.A. Muller ; J. Silcox ; S.L. Sass |
| Complex Atomic-Scale Dynamics in Grain Boundaries in Silicon / S.T. Pantelides ; A. Maiti ; M. Chisholm ; S.J. Pennycook |
| Relation between Segregation at Interfaces, Structure and Diffusion in Germanium / A. Charai ; A. Rolland ; F. Cabane |
| Microscopic Investigation of Surface Segregation in Random Alloys / A.Yu. Lozovoi ; P.A. Korzhavyi ; Yu.Kh. Vekilov |
| Segregation, Phase Separation and Grain Boundary Diffusion in Thin Films / Cs. Cserhati ; D.L. Beke ; I. A. Szabo |
| AES Study of the Mass Transport of Nickel near Ni / Cu (111) Interface / Zs. Tokei |
| Grain Boundary Segregation in the Cu-Bi System / L.-S. Chang ; B.B. Straumal ; S. Hofmann ; B. Baretzky |
| Grain Boundary Electromigration in Thin Films: Interface Reaction and Segregation Effects / E.E. Glickman |
| Grain Boundary Diffusion, Electromigration and Segregation in Cu and Cu-2wt% Sn Alloy |
| The Effect of Pressure on Grain Boundary Wetting, Segregation and Diffusion / W. Lojkowski ; B. Straumal |
| Strain Induced Grain Boundary Premelting due to Heavy Pile-up of Screw Dislocations in Deformed Copper Bicrystals / F. Inoko ; T. Okada ; T. Yoshikawa |
| Copper Diffusion in Nickel Thin Films under Stresses in the Kinetic Regime "B" / N. Balandina |
| Influence of Precipitates on the Grain Boundary Diffusion: A Perturbative Approach / N.S. Khader ; D.E. Mekki ; R.J. Tarento |
| The Manifestations of the Diffusion-Coefficient Distribution Functions of the Grain Boundaries in W and Au Polycrystals / M.I. Kurkin ; S.M. Klotsman ; A.N. Timofeev ; V.V. Dyakin |
| The Study of the Diffusion of [superscript 57]Co in Polycrystalline Gold at the Upper Boundary of the Temperature Interval Ordinarily used in Intercrystallite Diffusion Investigations / V.K. Rudenko |
| Low-Temperature Interdiffusion in Binary and Multilayer Thin Film System / S.I. Sidorenko ; S.M. Voloshko ; M.A. Vasiliev |
| Exact Solution of Triple Junction Diffusion Problem / V.A. Ivanov ; A.S. Ostrovsky ; A.L. Peteline ; S.A. Peteline |
| Relaxation Processes in Ultrafine-Grained Copper Processed by Severe Plastic Deformation / N.M. Amirkhanov ; R.K. Islamgaliev |
| Growth and Healing of Voids at Grain Boundary during High Temperature Creep / V.S. Gostomelskii |
| Mechanisms of Grain Boundary Diffusion in Intermetallic Compounds / L.N. Larikov |
| Grain Boundary Diffusion in Thin Films under Stress Field in Kinetic Regime "C" |
| Diffusion in Intermetallics / Round Table Discussion I： |
| Grain Boundary Wetting and Liquid Grooving / Round Table Discussion II： |
| Author Index |
| Keyword Index |
図書
