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図書

図書
垂井康夫編
出版情報: 東京 : オーム社, 2010.12  339p ; 20cm
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図書

図書
斎藤茂吉著
出版情報: 東京 : 新潮社, 2010.12  358p ; 16cm
シリーズ名: 新潮文庫 ; 6439, さ-40-1
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図書
町田健著 ; なかむら治彦イラスト
出版情報: 名古屋 : 中日新聞社, 2010.12  218p ; 19cm
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図書

図書
Christopher Hellman
出版情報: Tokyo : Tuttle Pub., c2010  126 p. ; 20 cm
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目次情報: 続きを見る
Introduction
The Mysterious Skills of the Old Cat
Sword Theory
A Treatise on the Sword
Joseishi's Discussions on the Sword
Ignorance in Swordsmanship
Acknowledgments
Introduction
The Mysterious Skills of the Old Cat
Sword Theory
5.

図書

図書
Frederick Harris
出版情報: Tokyo : Tuttle, c2010  192 p. ; 29 cm
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図書

図書
旺文社
出版情報: [東京] : 旺文社, [2010.8]  317p ; 21cm
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7.

図書

図書
T・S・エリオット作 ; 岩崎宗治訳
出版情報: 東京 : 岩波書店, 2010.8  323p ; 15cm
シリーズ名: 岩波文庫 ; 赤(32)-258-2
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8.

図書

図書
栄陽子著
出版情報: 東京 : 三修社, 2010.8  275p ; 21cm
シリーズ名: 栄陽子留学研究所
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9.

図書

図書
Allan Kelly著 ; 荒木貞雄, 石橋敬久, 齋藤彰一共訳
出版情報: 東京 : 構造計画研究所 , 東京 : 共立出版 (発売), 2010.8  xii, 262p ; 22cm
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図書

図書
edited by Yoshimi Ito
出版情報: New York : McGraw-Hill, c2010  xx, 214 p. ; 24 cm
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目次情報: 続きを見る
Preface
Abbreviations
Nomenclature
Table for Conversation
Fundamentals in Design of Structural Body Components / 1:
Necessities and Importance of Lightweighted Structure in Reduction of Thermal Deformation-Discussion Using Mathematical Models / 1.1:
First-hand View for Lightweighted Structures with High Stiffness and Damping in Practice / 1.2:
Axi-symmetrical Configuration-Portal Column (Column of Twin-Pillar Type) / 1.2.1:
Placement and Allocation of Structural Configuration Entities / 1.2.2:
References
What Is Thermal Deformation? / 2:
General Behavior of Thermal Deformation / 2.1:
Estimation of Heat Sources and Their Magnitudes / 2.2:
Estimation of Heat Source Position / 2.2.1:
Estimation of Magnitude of Heat Generation / 2.2.2:
Estimation of Thermal Deformation of Machine Tools / 2.3:
Estimation of Thermal Deformation in General / 2.3.1:
Thermal Deformation Caused by Inner Heat Sources / 2.3.2:
Thermal Deformation Caused by Both Inner and Outer Heat Sources / 2.3.3:
Heat Sources Generated by Chips and Their Dissipation / 2.4:
Mathematical Model of Chips / 2.4.1:
Thermal Properties of Chips-Equivalent Thermal Conductivity and Contact Resistance / 2.4.2:
An Example of Heat Transfer from Piled Chips to Machine Tool Structure / 2.4.3:
Dissipation of Chips / 2.4.4:
Future Perspectives in Research and Development for Heat Sources and Dissipation / 2.5:
Structural Materials and Design for Preferable Thermal Stability / 3:
Remedies Concerning Raw Materials for Structural Body Components / 3.1:
Concrete / 3.1.1:
Painting and Coating Materials / 3.1.2:
New Materials / 3.1.3:
Remedies Concerning Structural Configurations and Plural-Spindle Systems / 3.2:
Non-Sensitive Structure / 3.2.1:
Non-Constraint Structure / 3.2.2:
Deformation Minimization Structure / 3.2.3:
Plural-Spindle Systems-Twin-Spindle Configuration Including Spindle-over-Spindle Type / 3.2.4:
Future Perspectives in Research and Development for Structural Configuration to Minimize Thermal Deformation / 3.3:
Two-Layered Spindle with Independent Rotating Function / 3.3.1:
Selective Modular Design for Advanced Quinaxial-Controlled MC with Turning Function / 3.3.2:
Various Remedies for Reduction of Thermal Deformation / 4:
Thermal Deformations and Effective Remedies / 4.1:
Classification of Remedies for Reduction of Thermal Deformation / 4.2:
Separation of Heat Sources / 4.2.1:
Reduction of Generated Heat / 4.2.2:
Equalization of Temperature Distribution / 4.2.3:
Compensation of Thermal Deformations / 4.2.4:
Innovative Remedies for Minimizing Thermal Deformation in the Near Future / 4.3:
Appendix
Optimization of Structural Design / A.1:
Finite Element Analysis for Thermal Behavior / 5:
Numerical Computation for Thermal Problems in General / 5.1:
Introduction / 5.1.1:
Finite Element Method / 5.1.2:
Finite Differences Method / 5.1.3:
Decision Making for the Selection of Methods / 5.1.4:
Procedure for Thermal Finite Element Analysis / 5.2:
Discretisation / 5.2.1:
Materials / 5.2.3:
Assembling Components to an Entire Machine Tool Model / 5.2.4:
Boundary Conditions / 5.2.5:
Loadcases / 5.2.6:
Linear and Non-Linear Thermal Computation / 5.2.7:
Determination of Boundary Conditions / 5.3:
Convection Heat Transfer Coefficients / 5.3.1:
Emission Coefficients and View Factors / 5.3.3:
Heat Sources and Sinks / 5.3.4:
Thermomechanical Simulation Process / 5.4:
Serial Processing / 5.4.1:
Coupled Processing / 5.4.3:
Future Perspectives in Research and Development for Thermal FEA / 5.5:
Engineering Computation for Thermal Behavior and Thermal Performance Test / 6:
Tank Model / 6.1:
Bond Graph Simulation to Estimate Thermal Behavior within High-Voltage and NC Controllers / 6.2:
Thermal Performance Testing / 6.3:
Index
Preface
Abbreviations
Nomenclature
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