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1.

図書
図書
1. Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read
出版情報: New York, N.Y. : American Society of Mechanical Engineers, c1997  vi, 193 p. ; 28 cm
シリーズ名: AMD ; vol. 222
EEP ; vol. 20
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2.

図書
図書
2. Advances in electronic packaging, 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii (:set ; 1 ; 2)
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir ... [et al.]
出版情報: New York, N.Y : American Society of Mechanical Engineers, c1997  2 v. ; 28 cm
シリーズ名: EEP ; vol. 19
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3.

図書
図書
3. CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.]
出版情報: New York : American Society of Mechanical Engineers, c1997  v, 109 p. ; 28 cm
シリーズ名: EEP ; vol. 23
HTD ; vol. 356
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4.

図書
図書
4. Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. Liu
出版情報: New York : American Society of Mechanical Engineers, c1997  vi, 136 p. ; 28 cm
シリーズ名: EEP ; vol. 22
AMD ; vol. 226
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5.

図書
図書
5. Structural analysis in microelectronics and fiber optics, 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir
出版情報: New York : American Society of Mechanical Engineers, c1997  v, 272 p. ; 28 cm
シリーズ名: EEP ; vol. 21
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6.

図書
図書
6. Manufacturing science and engineering, 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas (vol. 1 ; vol. 2)
sponsored by the Manufacturing Engineering Division, ASME ; co-sponsored by the Dynamic Systems and Control Division, ASME, the Electrical and Electronics Packaging Division, ASME ; principal editor, Gloria J. Wiens; contributing editors, Y. Altintas ... [et al.]
出版情報: New York : American Society of Mechanical Engineers, c1997  2 v. ; 28 cm
シリーズ名: MED ; vol. 6
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目次情報:
v. 1. Sensor-fused intelligent machining systems. Quality of traditionally and nontraditionally machined surfaces: modeling, analysis, and measurement. Automatic deburring and finishing methods: nontraditional and traditional processes. Process sensoring
v. 2. Predictable modeling in metal cutting as means of bridging gap between theory and practice. Advances in cutting tools and work holding technology for machine tools. Machine tools
v. 1. Sensor-fused intelligent machining systems. Quality of traditionally and nontraditionally machined surfaces: modeling, analysis, and measurement. Automatic deburring and finishing methods: nontraditional and traditional processes. Process sensoring
v. 2. Predictable modeling in metal cutting as means of bridging gap between theory and practice. Advances in cutting tools and work holding technology for machine tools. Machine tools
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