close
1.

図書
図書
1. Thin film materials, processes, and reliability : proceedings of the international symposium
editor, G.S. Mathad ; assistant editors, M. Engelhardt ...[et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  viii, 216 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-24
所蔵情報: loading…
2.

図書
図書
2. Combinatorial and composition spread techniques in materials and device development : 26 January 2000, San Jose, California
Ghassan E. Jabbour, chair/editor ; sponsored and published by SPIE--the International Society for Optical Engineering
出版情報: Bellingham, Wash. : SPIE, c2000  vii, 122 p. ; 28 cm
シリーズ名: Proceedings / SPIE -- the International Society for Optical Engineering ; v. 3941
所蔵情報: loading…
3.

図書
図書
3. Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium
editor, G.S. Mathad ; assistant editors, T. S. Cale ...[et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics
出版情報: Pennington, N.J. : Electrochemical Society, c2003  x, 424 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2003-13
所蔵情報: loading…
目次情報: 続きを見る
Preface
Plasma Processing for the 100 nm Node / Part I：
Plasma Processes
Kinetic Modeling for Multi-Component Thin Film Growth in Plasma-Enhanced Atomic Layer Deposition / J-H. Kim ; J-Y. Kim ; P-K. Park ; S-W. Kang
Incidence of Deposition Parameters on the Structural Properties of Y[subscript 2]O[subscript 3] Grown by Pulsed Injection PE-MOCVD / C. Durand ; C. Vallee ; O. Salicio ; V. Loup ; M. Bonavalot ; O. Joubert ; C. Dubourdieu
Copper-Barrier and Hard-Mask Elaboration by Plasma-Enhanced Chemical Vapor Deposition Using Organosilane Precursors / B. Remiat ; F. Fusalba ; P. Maury ; V. Jousseaume ; C. Lecornec ; F. Gaillard ; J. Durand
Gas-Phase and Surface Reactions in Plasma Enhanced Chemical Etching of High-k Dielectrics / L. Sha ; J.P. Chang
A Comparative Study of the Etching Behavior of Thin AlN and Al[subscript 2]O[subscript 3] Films / M. Engelhardt
Etching of Low-k Interconnect Materials for Next Generation Devices / T. Chevolleau ; N. Posseme ; L. Vallier ; I. Thomas-Boutherin
Resist Transformation during Etching Steps Involved in Patterning Low-k Dielectric Materials: Impact on Process Control / E. Pargon
Adhesion of Copper and Sulfur-Modified SiLK / D.-L. Bae ; J.J. Senkevich ; C. Kezewski ; Y. Kwon ; T.S. Cale
Porous SiOCH Modification Studies Induced by Ashing Processes / Thomas-Boutherin
Modeling Investigation of Plasma Clean Processes / D. Zhang ; D. Denning
Copper Interconnects with Low-k Inter Level Dielectric Films / Part II：
Copper Deposition
Preparation of Cu Films on Polymer Substrate by ECR-MOCVD Coupled with DC Bias at Room Temperature / J-K. Lee ; B-W. Cho
Effect of Novel Plasma Treatment on Superfilling Behavior in Chemically Enhanced CVD (CECVD) Cu Process / S-G. Pyo ; W-S, Min ; D-W. Lee ; S. Kim ; J-G. Lee
A Model of Copper Deposition for the Damascene Process / C. Gabrielli ; J. Kittel ; P. Mocoteguy ; H. Perrot ; A. Zdunek ; P. Bouard ; M. Haddix ; L. Doyen ; M.C. Clech
AFM Observation of Microstructural Evolution at Room Temperature in Electrodeposited Copper Metallization / S. Ahmed ; D.N. Buckley ; A. Arshak ; A.M. O'Connell ; L.D. Burke
"Seedless" Electrochemical Deposition of Copper on Liner-Materials for ULSI Devices / D.J. Duquette ; S.J. Kim ; M.J. Shaw
Electroless Metallization of Hydrogen-Terminated Si[left angle bracket]100[right angle bracket] Surface Functionalized by Viologen / W.H. Yu ; E.T. Kang ; K.G. Neoh
Barrier and Low-k Films
TiZrN as a Copper Barrier for 0.13 [mu]m and 0.09 [mu]mTechnology Nodes / L. Swedberg ; C. Prindle
Nanostructured Ta-Si-N Thin Films as Diffusion Barriers between Cu and SiO[subscript 2] / L.W. Lai ; C.C. Chang ; J.S. Chen ; Y.K. Lin
Selectivity Studies on Tantalum Barrier Layer for Copper Chemical Mechanical Planarization / A. Vijayakumar ; T. Du ; K.B. Sundaram ; V. Desai
Investigation of Barrier Layers for Cu-Ultra Low-k Porous Polymer Integration / L.Y. Yang ; D.H. Zhang ; C.Y. Li ; P.D. Foo ; K. Prasad ; C.M. Tan
Atomic Layer Deposition of Ruthenium Glue Layer for Copper Damascene Interconnect / O-K. Kwon
Introducing Advanced ULK Dielectric Mateials in Interconnects: Performance and Integration Challenges / C. Le Cornec ; K. Haxaire ; T. Mourier ; P.H. Haumesser ; S. Maitrejean ; J. Simon ; A. Chabli ; G. Passemard
Surface Modification of Porous Low-k Dielectrics / Q.T. Le ; C.M. Whelan ; H. Struyf ; S.H. Brongersma ; T. Conard ; W. Boullart ; S. Vanhaelemeersch ; K. Maex
Structural and Electrical Characteristics of Low Dielectric Constant Porous Hydrogen Silsesquioxane for Cu Metallization / J.H. Wang ; P.T. Liu ; T.C. Chang ; W.J. Chen ; S.L. Cheng ; J.Y. Lin ; L.J. Chen
Nanoporous Low-k Polyimide Films Prepared from Poly(Amic Acid) with Grafted Poly(Acrylic Acid)/Poly (Ethylene Glycol) Side Chains / W.C. Wang ; C.K. Ong ; L.F. Chen
X-Ray Photoelectron Spectroscopic Study of Surface Modification of SiLK under UV-Irradiation / Y. Uchida ; T. Fukuda ; H. Yanazawa
Characteristics of Low-k Methyl-Silsesquiazane (MSZ) for CMP Process Using Oxygen Plasma Treatment / T.M. Tsai ; S.T. Yan ; Y.C. Chang ; H. Aoki ; T.Y. Tseng
Copper CMP and Reliability
Electrochemical Planarization of Copper
A Multiscale Mechanical CMP Model for Patterned Wafers / J. Seok ; C.P. Sukam ; A.T. Kim ; J.A. Tichy
The Roles of Complexing Agents on Copper CMP / G. Lim ; T.E. Kim ; J.-H. Lee ; J. Kim ; H.-W. Lee
The Effect of Inhibitor and Complexing Agents on Cu CMP / Y. Luo
Role of Oxidizer and Inhibitor on Chemical Mechanical Planarization of Copper / S.C. Kuiry ; S. Seal
Effect of Abrasive Particles on Chemical Mechanical Polishing Performance / D. Tamboli ; G. Banerjee ; S. Chang ; M. Waddell ; I. Butcher ; Q. Arefeen ; S. Hymes
Chemical Mechanical Planarization of Ruthenium for Capacitor Bottom Electrode in DRAM Technology / S-H. Lee ; Y-J. Kang ; J-G. Park ; S-I. Lee
Industry Challenges in Post-Etch Cleaning Chemistries for Advanced Copper/Low-k Applications / M.A. Fury
Cleaning of Copper Surface Using Vapor-Phase Organic Acids / T. Yagishita ; K. Ishikawa ; M. Nakamura
Time-Zero Failure Current Measurement for Early Monitoring of Defective Cu Lines at Wafer Level / J-H. Park ; B-T. Ahn
Annealing Characteristics of Copper Films for Power Device Applications / L. Castoldi ; S. Morin ; G. Visalli ; T. Fukada ; M. Ouaknine ; E.H. Roh ; W.S. Yoo
The Stability of Carbon-Doped Silicon Oxide Low Dielectric Constant Thin Films / Y.H. Wang ; R. Kumar
Nickel Silicide Formation Using a Stacked Hotplate-Based Low Temperature Annealing System / T. Murakami ; B. Froment ; V. Carron ; W-S. Yoo
3-D Interconnects
3-D Electromigration Modeling and Simulation in Aluminum-Silicon Dioxide and Copper-Low-k Multilevel Interconnects / V. Sukharev ; R. Choudhary ; C.W. Park
Transient Thermal and Mechanical Modeling of 3D-IC Structures / J. Zhang ; J.-Q. Lu ; R.J. Gutmann
3D System-on-a-Chip Using Dielectric Glue Bonding and Cu Damascene Inter-Wafer Interconnects / A. Jindal ; J.J. McMahon ; K.-W. Lee ; R.P. Craft ; B. Altemus ; D. Cheng ; E. Eisenbraum
The Impact of Wafer-Level Layer Transfer on High Performance Devices and Circuits for 3D IC Fabrication / K.W. Guarini ; A.W. Topol ; M. Ieong ; K. Bernstein ; K. Xiu ; R.V. Joshi ; R. Yu ; L. Shi ; M.R. Newport ; D.V. Singh ; G.M. Cohen ; H.B. Pogge ; S. Purushothaman ; W.E. Haensch
Wafer Bonding and Thinning Integrity for 3D-IC Fabrication
Author Index
Subject Index
Preface
Plasma Processing for the 100 nm Node / Part I：
Plasma Processes
4.

図書
図書
4. Interfacial engineering for optimized properties II : symposium held December 1-2, 1999, Boston, Massachusetts, U.S.A.
editors, C. Barry Carter, Ernest L. Hall, Steven R. Nutt, Clyde L. Briant
出版情報: Warrendale, Pa. : Materials Research Society, c2000  xi, 308 p. ; 24 cm
シリーズ名: Materials Research Society symposium proceedings ; v. 586
所蔵情報: loading…
目次情報: 続きを見る
Preface
Materials Research Society Symposium Proceedings
General Concepts and Modeling
Influence of Processing Method on the Grain Boundary Character Distribution and Network Connectivity / Adam J. Schwartz ; Mukul Kumar ; Wayne E. King
Local Potential at Atomically Abrupt Oxide Interfaces by Scanning Probe Microscopy / Sergei V. Kalinin ; Dawn A. Bonnell
The Mechanism of Mixed-Mode Phase TransformationS / R.C. Pond ; P. Shang ; T.T. Cheng ; M. Aindow
Thermodynamics and Kinetics of Interfacial Decohesion / Y. Mishin ; C.J. McMahon ; J.L. Bassani ; P. Sofronis
Z-Contrast STEM Imaging and Ab Initio Calculations of Grain Boundaries in SrTiO[subscript 3] / Miyoung Kim ; Nigel D. Browning ; Stephen J. Pennycook ; Karl Sohlberg ; Sokrates T. Pantelides
Ab Initio Study of the Local Bonding at Metal-Ceramic Heterophase Boundaries / S. Kostlmeier ; C. Elsasser
Molecular Simulations of Tilted Chain Crystal - Amorphous Interfaces in Polymers / S. Gautam ; S. Balijepalli ; G.C. Rutledge
Reactions and Wetting
Control of Grain Boundary Microstructures in Liquid-Phase Sintered Alumina / N. Ravishankar ; C. Barry Carter
Influence of the Interfacial Properties on the Microstructural Development and Properties of Silicon Nitride Ceramics / M.J. Hoffmann ; H. Gu ; R.M. Cannon
Modeling the Effect of Composition on the Stability of Equilibrium Intergranular Films with Diffuse Interfaces / C.M. Bishop ; W.C. Carter
Observation of Localized Corrosion of Ni-Based Alloys Using Coupled Orientation Imaging Microscopy and Atomic Force Microscopy / Peter J. Bedrossian
Dewetting of Reactive CaMgSiO[subscript 4] Glass Films on Single-Crystal MgO(001) Substrate / S.V. Yanina ; C.B. Carter
Interfacial Reactions in Ti-6Al-4V With Laser-Embedded SiC Particles and the Origin of Intergranular Corrosion Susceptibility of an Al-Mg Alloy / B.J. Kooi ; J.Th.M. De Hosson
Angle-Resolved XPS Studies of Interfacial Bonding States in Silicon Oxynitrides Fabricated Using Different Thermal Methodologies / Sanjit Singh Dang ; Christos G. Takoudis
Optimization of the Broadband Reflectance of Graded Multilayers for Hard X-ray Mirrors / Adrian Ivan ; Richardo Bruni ; Kyung Byun ; Paul Gorenstein ; Suzanne Romaine
Liquid Phase Diffusion Bonding for Thermoelectric Material Pb-Sn-Te / Y. Shinohara ; M. Hashimoto ; Y. Imai ; Y. Isoda ; I.A. Nishida
Triple Junction Engineering: The Distribution of Triple Junctions in Polycrystalline Gold Thin Films / Kwame Owusu-Boahen ; Alexander H. King
Interface Structure/Composition/Character
Tailoring Grain-Boundary Segregation to Control Mechanical Properties / D.B. Williams ; V.J. Keast
Engineering the Interfacial Chemistry in Metal/Oxide Systems / K. Prussner ; B.A. Pint ; P.Y. Hou ; K.B. Alexander ; P.F. Tortorelli
Interface Multiplication Through the Combination of Interface and Lattice Diffusion-Controlled Transformations in Alloys / I.G. Solorzano ; J.A. Cohn ; R.M. Andrade
On the Influence of Applied Fields on Spinel Formation / C. Korte ; J.K. Farrer ; J.R. Michael ; H. Schmalzried
Adhesion Properties of Cellulose Films / Xiujuan Zhang ; Raymond A. Young
Impact of Grain Boundary Character on Electrical Property in Polycrystalline Silicon / Shu Hamada ; Koichi Kawahara ; Sadahiro Tsurekawa ; Tadao Watanabe ; Takashi Sekiguchi
Observations of Interaction Between Magnetic Domain Wall and Grain Boundaries in Fe-3wt%Si Alloy by Kerr Microscopy / K. Kawahara ; Y. Yagyu ; S. Tsurekawa ; T. Watanabe
Interface Related Strength Phenomena in Two-Phase Titanium Aluminides / U. Christoph ; M. Oehring ; F. Appel
Mechanical Properties
Optimization of Adhesion at Transition Metal-Oxide Interfaces by Processing at Well-Chosen Oxygen Activity / M. Backhaus-Ricoult
Annealing Effects on Interfacial Fracture of Gold-Chromium Films in Hybrid Microcircuits / N.R. Moody ; D.P. Adams ; A.A. Volinsky ; M.D. Kriese ; W.W. Gerberich
Interface Properties of Ceramic Composites at High Temperature / X-F. Zhou ; C. Marston ; S.R. Nutt
Measurements of the Adhesion Strength of Cu/Epoxy Interfaces / H.Y. Lee ; Jin Yu
Intergranular Fracture: The Effect of Grain Boundary Orientation and Crack Growth Directions / Jeffrey W. Kysar
Creep in Polycrystalline Aluminum / C.L. Briant ; D.L. Davidson
Grain Boundary Microstructure Dependent-Intergranular Fracture in Polycrystalline Molybdenum
Enhancement of the Adhesion of Cordierite Glass-Ceramic Coatings on Molybdenum by the Deposition of Metallic Interlayers on the Substrate / Jesus Noel Calata ; Guo-Quan Lu ; Thomas A. Kuhr
Biaxial Zero Creep Measurements of Interface Energies in Ni/Ag Multilayers / A.C. Lewis ; A.B. Mann ; D. Josell ; J. Tapson ; T.P. Weihs
Indentation-Induced Debonding of Ductile Films / Alex A. Volinsky ; W. Miles Clift ; Neville R. Moody ; William W. Gerberich
Effect of Self-Assembling Monolayers (SAMs) on Ice Adhesion to Metals / S.L. Peng ; V.F. Petrenko ; M. Arakawa
The Critical Stress for Transmission of a Dislocation Across an Interface: Results from Peierls and Embedded Atom Models / P.M. Anderson ; S. Rao ; Y. Cheng ; P.M. Hazzledine
Structural Design of the Geometrical Shape of Interfaces in Bonded Dissimilar Materials Based on Theoretical Elastic Analysis / Masayoshi Tateno ; Yasushi Fukuzawa ; Shigeru Nagasawa ; Hiroshi Sakuta
Near-Interface Crack Initiation in Thermal Barrier Coatings / Z. Zhang ; T.E. Bloomer ; J. Kameda ; S. Sakurai
Abstracts of Other Invited Papers
Interfacial Engineering in Nanocomposites / Brian Cantor
Structure and Properties of Polycrystalline Materials From Simulation: An Interfacial Perspective / S.R. Phillpot ; P. Keblinski ; D. Wolf ; F. Cleri
Ultrathin Alumina Films on Metallic Substrates: Structure and Metal Adsorption / Dwight R. Jennison ; Alexander Bogicevic
Oxidation Resistant Ceramic Composites: How Weak Interfaces Became Designed Failure Processes / Ronald J. Kerans
Interfacial Engineering for Optimized Adhesion in Polymeric Composite Materials / Lawrence T. Drzal
Wetting Transitions of Grain Boundaries / John Blendell
Interface Characterization Using the Automated-EBSP Technique / John A. Sutliff
Enhancing Oxidation Performance by Control of Interfacial Segregation and Microstructural Design / Kathleen B. Alexander ; Bruce A. Pint ; Peter F. Tortorelli
Dynamic Embrittlement: Quasi-Static Interfacial Decohesion / C.J. McMahon Jr.
Author Index
Subject Index
Preface
Materials Research Society Symposium Proceedings
General Concepts and Modeling
5.

図書
図書
5. Group IV semiconductor nanostructures--2006 : symposium held November 27-December 1, 2006, Boston, Massachusetts, U.S.A.
editors, Leonid Tsybeskov ... [et al.]
出版情報: Warrendale, Pa. : Materials Research Society, c2007  xi, 311 p. ; 24 cm
シリーズ名: Materials Research Society symposium proceedings ; v. 958
所蔵情報: loading…
6.

図書
図書
6. Stimuli-responsive polymeric films and coatings
Marek W. Urban, editor ; sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc
出版情報: Washington, DC : American Chemical Society, c2005  x, 254 p. ; 24 cm
シリーズ名: ACS symposium series ; 912
所蔵情報: loading…
目次情報: 続きを見る
Preface
Stimuli-Responsive Macromolecules and Polymeric Coatings / Anna M. Urban ; Marek W. Urban1：
Synthetic Aspects of Stimuli-Responsive Polymers
Controlling Polymer Chain Topology and Architecture by ATRP from Flat Surfaces / Joanna Pietrasik ; Lindsay Bombalski ; Brian Cusick ; Jinyu Huang ; Jeffrey Pyun ; Tomasz Kowalewski ; Krzysztof Matyjaszewski2：
Synthesis of Terminally Functionalized (Co) Polymers via Reversible Addition Fragmentation Chain Transfer Polymerization and Subsequent Immobilization to Solid Surfaces with Potential Biosensor Applications / Charles W. Scales ; Anthony J. Convertine ; Brent S. Sumerlin ; Andrew B. Lowe ; Charles L. McCormick3：
Synthesis and Application of Polyelectrolyte Brushes / Stephen G. Boyes ; Crystal Cyrus ; Bulent Akgun ; Adam Caplan ; Brian Mirous ; William J. Brittain4：
Gradient Stimuli-Responsive Polymer Grafted Layers / Sergiy Minko ; Leonid Ionov ; Alexander Sydorenko ; Nikolay Houbenov ; Manfred Stamm ; Bogdan Zdyrko ; Viktor Klep ; Igor Luzinov5：
Tailoring of Thin Polymer Films Chemisorbed onto Conductive Surfaces by Electrografting / C. Jerome ; R. Jerome6：
Physico-Chemical Aspects of Stimuli-Responsive Polymers
Temperature-Responsive Films of Amphiphilic Poly(N-isopropylacrylamides) of Various Architectures at the Air-Water Interface / Roger C. W. Liu ; Francoise M. Winnik7：
Stimuli-Responsive Behavior of Sodium Dodecyl Sulfate and Sodium Dioctyl Sulfosuccinate during Coalescence of Colloidal Particles / David J. Lestage ; W. Reid Dreher8：
Fluorescence Methods for Latex Film Formation / Onder Pekcan ; Ertan Arda9：
Finite Element Modeling for Scratch Damage of Polymers / G. T. Lim ; J. N. Reddy ; H.-J. Sue10：
An Artificial Neural Network Approach to Stimuli-Response Mechanisms in Complex Systems / Eduardo Nahmad-Achar ; Javier E. Vitela11：
Maleimide-Vinyl Ether-Based Polymer Dispersed Liquid Crystals / Molly L. Hladik ; Askym F. Senyurt ; Charles E. Hoyle ; Joe B. Whitehead ; Charles M. Werneth ; Garfield T. Warren12：
Stimuli-Responsive Supramolecular Solids: Functional Porous and Inclusion Materials / Dmitriy V. Soldatov13：
Indexes
Author Index
Subject Index
Preface
Stimuli-Responsive Macromolecules and Polymeric Coatings / Anna M. Urban ; Marek W. Urban1：
Synthetic Aspects of Stimuli-Responsive Polymers
7.

図書
図書
7. Fifth International Conference on Thin Film Physics and Applications : 31 May-2 June, 2004, Shanghai, China
Junhao Chu ... [et al.], editors ; organized and sponsored by Chinese Physical Society (China) ... [et al.]
出版情報: Bellingham, Wash. : SPIE, c2004  xxiii, 654 p. ; 28 cm
シリーズ名: Proceedings / SPIE -- the International Society for Optical Engineering ; v. 5774
所蔵情報: loading…
8.

図書
図書
8. Nanostructured thin films and nanodispersion strengthened coatings
edited by Andrey A. Voevodin ... [et al.]
出版情報: Dordrecht : Kluwer Academic Publishers, c2004  xv, 322 p. ; 25 cm
シリーズ名: NATO science series ; Series II . Mathematics, physics, and chemistry ; v. 155
所蔵情報: loading…
9.

図書
図書
9. Superconducting and related oxides, physics and nanoengineering IV : 24-28 April 2000, Orlando, USA
Davor Pavuna, Ivan Bozovic, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering ; cosponsored by Oxxel GmbH Bremen (Germany)
出版情報: Bellingham, Wash. : SPIE, c2000  xi, 442 p. ; 28 cm
シリーズ名: Proceedings / SPIE -- the International Society for Optical Engineering ; v. 4058
所蔵情報: loading…
10.

図書
図書
10. Superconducting and related oxides : physics and nanoengineering V : 8-11 July, 2002, Seattle, Washington, USA
Ivan Bozovic, Davor Pavuna, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organizations, the Boeing Company (USA) ... [et al.]
出版情報: Bellingham, Washington : SPIE, c2002  ix, 296 p. ; 28 cm
シリーズ名: Proceedings / SPIE -- the International Society for Optical Engineering ; v. 4811
所蔵情報: loading…
11.

図書
図書
11. Combinatorial and composition spread techniques in materials and device development II : 22-23, 25 January, 2001, San Jose, USA
Ghassan E. Jabbour, Hideomi Koinuma, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering
出版情報: Bellingham, Wash. : SPIE, c2001  xxxii, 124 p. ; 28 cm
シリーズ名: Proceedings / SPIE -- the International Society for Optical Engineering ; v. 4281
所蔵情報: loading…
12.

図書
図書
12. Engineering thin films with ion beams, nanoscale diagnostics, and molecular manufacturing : 30-31 July 2001, San Diego, USA
Emile J. Knystautas, Wiley P. Kirk, Valerie Browning, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering
出版情報: Bellingham, Wash., USA : SPIE, c2001  ix, 192 p. ; 28 cm
シリーズ名: Proceedings / SPIE -- the International Society for Optical Engineering ; v. 4468
所蔵情報: loading…
13.

図書
図書
13. Fourth International Conference on Thin Film Physics and Applications : 8-11 May 2000, Shanghai, China : proceedings
Junhao Chu, Pulin Liu, Yong Chang, editors ; organized and sponsored by Chinese Physical Society ... [et al.]
出版情報: Bellingham, Wash. : SPIE, c2000  xxiv, 888 p. ; 28 cm
シリーズ名: Proceedings / SPIE -- the International Society for Optical Engineering ; v. 4086
所蔵情報: loading…
14.

図書
図書
14. Sixth International Conference on Thin Film Physics and Applications : 25-28 September 2007, Shanghai, China
Wenzhong Shen, Junhao Chu, editors ; organized and sponsored by Department of Physics, Shanghai Jiao Tong University (China) ... [et al.] ; published by SPIE
出版情報: Bellingham, Wash. : SPIE, c2008  1 v. (various pagings) ; 28 cm
シリーズ名: Proceedings / SPIE -- the International Society for Optical Engineering ; v. 6984
所蔵情報: loading…
15.

図書
図書
15. Thin-film coatings for optical applications IV : 29-30 August 2007, San Diego, California, USA (: pbk)
Michael J. Ellison, editor ; sponsored and published by SPIE
出版情報: Bellingham, Wash. : SPIE, c2007  1 v. (various pagings) ; 28 cm
シリーズ名: Proceedings / SPIE -- the International Society for Optical Engineering ; v. 6674
所蔵情報: loading…
16.

図書
図書
16. Nanostructured thin films : 13-14 August 2008, San Diego, California, USA
Geoffrey B. Smith, Akhlesh Lakhtakia, editors ; sponsored and published by SPIE
出版情報: Bellingham, Wash. : SPIE, c2008  1 v. (various pagings) ; 28 cm
シリーズ名: Proceedings / SPIE -- the International Society for Optical Engineering ; v. 7041
所蔵情報: loading…
17.

図書
図書
17. Advances in thin-film coatings for optical applications V : 11 August, 2008, San Diego, California, USA
Jennifer D. T. Kruschwitz, Michael J. Ellison, editors ; sponsored and published by SPIE
出版情報: Bellingham, Wash. : SPIE, c2008  1 v. (various pagings) ; 28 cm
シリーズ名: Proceedings / SPIE -- the International Society for Optical Engineering ; v. 7067
所蔵情報: loading…
18.

図書
図書
18. Reliability of photovoltaic cells, modules, components, and systems : 11-13 August 2008, San Diego, California, USA
Neelkanth G. Dhere, editor ; sponsored and published by SPIE
出版情報: Bellingham, Wash. : SPIE, c2008  1 v. (various pagings) ; 28 cm
シリーズ名: Proceedings / SPIE -- the International Society for Optical Engineering ; v. 7048
所蔵情報: loading…
文献の複写および貸借の依頼を行う
 文献複写・貸借依頼