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1.

図書

図書
editors, P. C. Andricacos ...[et al.] ; sponsoring divisions, Electrodeposition, Dielectric Science and Technology, Electronics
出版情報: Pennington, N.J. : Electrochemical Society, c2002  viii, 258 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2000-8
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2.

図書

図書
editors, M.J. Deen, D. Misra, J. Ruzyllo ; sponsoring divisions, Electronics, Dielectric Science and Technology
出版情報: Pennington, N.J. : Electrochemical Society, c2002  viii, 436 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-28
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3.

図書

図書
editors, P. Vanƴsek ... [et al.] ; sponsoring divisions, Electrodeposition, Dielectric Science and Technology, Physical Electrochemistry, and Corrosion
出版情報: Pennington, N.J. : Electrochemical Society, c2002  xii, 228 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; 2000-30
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4.

図書

図書
editors, M. Cahay ... [et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics, and Luminescene an Display Materials
出版情報: Pennington, NJ : Electrochemical Society, Inc., c2002  viii, 218 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2002-9
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5.

図書

図書
editors, P.J. Timans ... [et al.] ; sponsoring deivisions, Electronics, Dielectric Science and Technology, and High Temperature Materials
出版情報: Pennington, NJ : Electrochemical Society, c2002  xiii, 478 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2002-11
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6.

図書

図書
editor, L. Mendicino ; sponsoring divisions, Dielectric Science and Technology and Electroncis
出版情報: Pennington, N.J. : Electrochemical Society, c2002  viii, 262 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2002-15
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目次情報: 続きを見る
Process Emissions Characterization and Treatment / A.:
Emissions Characterization of Advanced CVD Processes and Abatement Performance / V. Vartanian ; B. Goolsby ; C. Reddy ; V. Arunachalam ; L. Mendicino
Effective Management of Process Exhaust from Low-K CVD Processes / S. Carss ; A. Seeley ; J. Van Gompel
Development and Evaluation of the ATMI CDO 865 for Abatement of Low-K Process Effluent / B. Flippo ; R. Vermeulen
Managing Fluorine Emissions at Semiconductor Fabrication Facilities / M. Smylie
Characterization of Plasma-Etched RuO[subscript 2] Substrates / S. Samavedam ; L Mendicino ; J.J. Lee ; T. Guenther ; S. Dakshina-Murthy ; C. Sparks
Evaluation of Ozone Emissions Destruction Units for SACVD Process Tools / C. Nauert ; R. Camacho ; B. Day ; R. Lathrop ; H. Kwong ; J. Fox
Potential Cost of Ownership Reduction for a Nitride Furnace Point of Use Abatement Device / B. Davis ; M. Rossow
Electrochemical Removal of Hydrogen Sulfide from Geothermal Brines / B.G. Ateya ; F.M. AlKharafi
PFC Emissions Reduction / B.:
The Evaluation of Hexafluoro-1,3-Butadiene as an Environmentally Benign Dielectric Etch Chemistry in a Medium Density Etch Chamber / R. Chatterjee ; R. Reif ; T. Sparks
Post-Pump PFC Abatement by Atmospheric Microwave Plasmas: Completion of Metal Etch Beta Test / J.C. Rostaing ; D. Guerin ; C. Larquet ; A. El-Krid ; C.H. Ly ; J. Bruat ; E. Coffre ; M. Moisan ; H. Dulphy ; P. Moine ; J. Wiechers
Characterization of NF[subscript 3] Chamber Cleans on Multiple CVD Platforms / J. Rivers ; J. Vires ; A. Soyemi ; S.P. Sun ; M. Turner ; C. Esber
Reduction of PFC Emissions Through Process Advances in CVD Chamber Cleaning / S. Hsu ; C. Allgood ; M. Mocella
PFC Emissions Reduction and Process Improvements with Remote Plasma CVD Chamber Cleans / P.T. Brown ; S. Filipiak ; H. Estep ; M. Fletcher
Thermal Reductive Destruction of Perfluorocarbons into Safe Products Through In-situ Generation of Alkali Metals in Heated Solid Mixtures / M.C. Lee ; W. Choi
Alternative Cleans Technologies and Emerging Issues / C.:
Post Oxide Etching Cleaning Process Using Integrated Ashing and HF Vapor Process / O. Kwon ; H. Sawin
Fluorocarbon Film and Residue Removal Using Supercritical CO[subscript 2] Mixtures / S. Myneni ; D. Hess
A Summary of Recent Motorola Water Conservation Efforts from Source Reduction of Process Equipment / B. Raley ; T. Dietrich
Partnerships to Address EHS Aspects of Chemical Management in the Semiconductor Industry: Lessons from the PFAS Experience / M. Bowden ; L. Beu ; S. Pawsat
PFAS: Treatment Options and Sampling Methods / K. Barbee ; L. Lovejoy
EHS Risk Assessment and Management / D.:
Concepts and Application of Risk Management of Address Business Needs / S. Trammell ; J. Heironimus
Emergency Preparedness and Response for Semiconductor Manufacturing / S. Harris
Environmental Health and Safety (EHS) Investigation of CVD Exhaust System: Identification and Mitigation of Potential Release of Process Gases and By-products / L. Chandna ; A. Reynoso ; K. Hendricksen
Point of Use Abatement Unit By-Pass for NF[subscript 3]-Based CVD Chamber Clean Applications / D. Babbitt
Process Emissions Characterization and Treatment / A.:
Emissions Characterization of Advanced CVD Processes and Abatement Performance / V. Vartanian ; B. Goolsby ; C. Reddy ; V. Arunachalam ; L. Mendicino
Effective Management of Process Exhaust from Low-K CVD Processes / S. Carss ; A. Seeley ; J. Van Gompel
7.

図書

図書
editor, G.S. Mathad ; assistant editors, M.D. Allendorf, R.E. Sah, M. Yang ; sponsoring divisions, Dielectric Science and Technology and Electronics
出版情報: Pennington, N.J. : Electrochemical Society, c2002  ix, 324 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2002-17
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目次情報: 続きを見る
Preface
Plasma Enhanced Deposition
Process and Material Properties of PECVD Boron-doped Amorphous Silicon Films / H. Nominanda ; Y. Kuo
Properties of Boron-doped Amorphous Silicon Films Obtained with a Low Frequency Plasma / A. Heredia-J ; A. Torres-J ; A. Jaramillo-N ; F.J. De la Hidalga-W ; C. Zuniga-I ; A. Munguia-C
Si Epitaxial Growth on Atomic-Order Nitrided Si (100) using an ECR Plasma / M. Mori ; T. Seino ; D. Muto ; M. Sakuraba ; J. Murota
Optimizing Pulse Protocols in Plasma-Enhanced Atomic Layer Deposition / V. Prasad ; M.K. Gobbert ; T.S. Cale
High Density Plasma Deposited Silicon Nitride Films for Coating InGaAlAs High-Power Lasers / R.E. Sah ; F. Rinner ; R. Keifer ; M. Mikulla ; G. Weimann
High Productivity 300 mm HDP-CVD for Next-Generation Gap Fill Processes / B. Geoffrion ; N. Dubey ; P. Krishnaraj
Modeling & Mechanisms
Plasma Hydrogenation of a Buried Trap Layer in Silicon: Formation of a Platelet Layer / A.Y. Usenko ; W.N. Carr ; B. Chen
Integrated Modeling Investigation of Plasma Dielectric Etching Processes / D. Zhang ; S. Rauf ; T.G. Sparks ; P.L.G. Ventzek
Plasma-Surface Kinetics and Feature Profile Evolution in Cl[subscript 2] + HBr Etching of Poly-silicon / W. Jin ; S.A. Vitale ; H.H. Sawin
Surface Treatment of SiC using NF[subscript 3]/O[subscript 2] Plasmas / T. Kai ; W. Shimizu ; A. Hibi ; T. Iwase ; T. Abe ; M. Inaba ; Z. Ogumi ; T. Tojo ; A. Taska
Quantitative Analysis and Comparison of Endpoint Detection Based on Multiple Wavelength Analysis - Part I: Multi-Wavelength Method / B.E. Goodlin ; D.S. Boning
Quantitative Analysis and Comparison of Endpoint Detection Based on Multiple Wavelength Analysis - Part II: Noise Analysis of Multi-Wavelength OES
Equipment / Plasma Etching II:
Investigations of 300 mm Wafer Tool Set Progress and Performance / K. Mautz
Simultaneous Fault Detection and Classification for Semiconductor Manufacturing Tools / B.M. Wise
Effects of Showerhead Face Chemistry on Capacitively Coupled Plasma Discharges / B. Devulapalli ; G.I. Font
Gate Dielectrics and Silicon / Plasma Etching III:
Differential Surface Charging of the Dielectric during Plasma Etching and Surface Charge Leakage Kinetic / M.K. Abatchev ; B.J. Howard ; D.S. Becker ; R.L. Stocks ; J. Chapman
Thickness Scaling of Gate Dielectric on Plasma Charging Damage in MOS Devices / K-S. Chang-Liao ; P-J. Tzeng
Gate Oxide Integrity and Micro-loading Characterization of 300 mm Process Tools
Measurement of Device Charging Damage in a Dielectric Etch 300 mm Chamber with a Bias Voltage Diagnostic Cathode / M.C. Kutney ; S. Ma ; K. Horioka ; R. Lindley ; S. Kats ; T. Kropewnicki ; K. Doan ; H. Shan
Etching of High-k Gate Dielectrics and Gate Metal Candidates / S.K. Han ; I. Kim ; H. Zhong ; G.P. Heuss ; J.H. Lee ; D. Wicaksana ; J.P. Maria ; V. Misra ; C.M. Osburn
Etching High Aspect Ratio Silicon Trenches / S. Panda ; R. Ranade ; G.S. Mathad
Inverse Micro-loading Effect in Reactive Ion Etching of Silicon / S. Jensen ; O. Hansen
Plasma Etched Micro-machined Silicon Stampers for Plastic Bio-Technology Applications / D. Weston ; W.J. Dauksher ; D. Rhine ; T. Smekal ; P.J. Stout
Silicon Dioxide / Plasma Etching IV:
Radical Control in a Hole to Break an Etch-Stop Barrier in Highly Selective HAC Etching / N. Negishi ; K. Yokogawa ; T. Yoshida ; M. Izawa
Etching vs Deposition: The Effect on Profiles and Etching Yield Curves for Oxide Etching / O. Kwon
Dual Damascene, Low-k / Plasma Etching V:
Effect of Oxygen and Nitrogen Additions on Silicon Nitride Reactive Ion Etching in Fluorine Containing Plasmas / C. Reyes-Betanzo ; S.A. Moshkalyov ; A.C.S. Ramos ; M.A. Cotta ; J.W. Swart
A Novel Approach to Reduce Via Corner Faceting in the Via-First, No Middle Stop Layer Dual Damascene Trench Etch / Y-S. Kim ; K.L. Doan ; C. Bjorkman ; A. Paterson ; Z. Sui
Patterning 180 nm Copper Oxide Dual Damascene Baseline with 193 nm Resists / V. Bakshi ; G. Smith
Copper Fine Patterns Etched with HBr Plasma Based Processes / S. Lee
Intellectual Property Creation from Semiconductor Process and Equipment Development
Author Index
Subject Index
Preface
Plasma Enhanced Deposition
Process and Material Properties of PECVD Boron-doped Amorphous Silicon Films / H. Nominanda ; Y. Kuo
8.

図書

図書
editors, M. Cahay ... [et. al] ; sponsoring divisions, Dielectric Science and Technology, Electronics, and Luminescence and Display Materials
出版情報: Pennington, N.J. : Electrochemical Society, c2002  viii, 416 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2002-18
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目次情報: 続きを見る
Preface
Carbon Nanotubes
Quantum Interference Effects in the Nanotriode / S. Johnson ; A. Blackburn ; A. Driskill-Smith ; D. Hasko ; H. Ahmed
Microgated In-Situ Grown Carbon Nanotube Field Emitter Arrays / D. Hsu ; J. Shaw
A Micromachined On-chip Vacuum Microtriode Using a Carbon Nanotube Cold Cathode / W. Zhu ; L.H. Chen ; C. Bower ; D. Shalom ; D. Lopez
Electron Emission Microscopy Measurements of Nitrogen and Sulfer Doped Carbon Films / F. Koeck ; S. Gupta ; B.R. Weiner ; G. Morell ; J.M. Garguilo ; B. Brown ; R.J. Nemanich
Carbon Nanotubes for Future Field Electron Emission Devices / O. Groning ; R. Clergeraux ; L. Nilsson ; P. Ruffieux ; L. Schlapbach ; P. Groning
Saturated Emmision from Carbon Nanotubes
Fabrication and Characterization of Field Emission Devices Based on Single Vertically Aligned Carbon Nanofibers / M.A. Guillorn ; V.I. Merkulov ; A.V. Melechko ; E.D. Ellis ; L.R. Baylor ; D.K. Hensley ; R.J. Kasica ; T.R. Subich ; D. Lowndes ; M.L. Simpson
Atom-by-atom Analysis of Field Emission Sources by the Scanning Atom Probe / O. Nishikawa ; T. Yagyu ; T. Murakami ; M. Watanabe ; M. Taniguchi ; T. Kuzumaki ; S. Kondo
Field Emitter Arrays
Microfabricated Field Emitter Performance Enhancement by High Current Processing / P.R. Schwoebel ; C.A. Spindt ; C.E. Holland
Study of Emitter Materials for use in Hostile Environments / W.A. Mackie ; C. Dandeneau ; L.A. Southall ; F.M. Charbonnier
Intelligent Silicon Field Emission Arrays / C.Y. Hong ; A.I. Akinwande
Field Emission Array Cathode Material Selection for Compatibility with Electric Propulsion Applications / C.M. Marrese-Reading ; J. Polk ; B. Koel ; M. Quinlan
Field Induced Thickening of Au-coated Nanosize Si-tip and Field Emission from PR-coated Si-tip / S.S. Choi ; M.Y. Jung ; D.W. Kim ; M.S. Joo
Field Emission Study of Ti-Silicide Array / S.B. Kim ; H.T. Jeon
Theory and Simulation
Emissive and Cooling Properties of Carbon Based Materials for Microelectronics / N.M Miskovsky ; P.H. Cutler ; A. Mayer ; P.B. Lerner
Modeling Device Performance and Feature Variation in Microtip Field Emitters / J. Zuber ; K.L. Jensen
Simulations of Transport and Field-Emission Properties of Multi-wall Carbon Nanotubes / N.M. Miskovsky
Equilibrium Theory of Nanotips / G. Bilbro
An Analysis of FEA Noise Mechanisms / M. Cahay
Sub-Poissonian and Super-Poissonian Shot Noise in Planar Cold Cathodes / R. Krishnan
Electrostatic Factors Affecting Emission From Discrete Isolated Diamond Nanodots / D.L. Jaeger ; T. Tyler ; A.K. Kvit ; J.J. Hren ; V.V. Zhirnov
Current Density Evaluation At The Barrier Maximum / P. O'Shea ; D. Feldman
Tunnel Charcateristics of the Metal Tip-Cathodes with the Superthin Diamond Coatings Using Non-Local Considerations / L. Il'chenko ; V. Il'chenko ; R.M. Novosad ; Y.V. Kryuchenko
About Theoretical Calculation of Semiconductor's Surface Images for Closely Spaced Semiconductor and Metal in STM
Thin films and Nanostructures
Emission from GaN p-n Junction Cold Cathodes / R. Treece ; D. Patel ; C. Menoni ; J. Smith ; J. Pankove
Effect of Film Thickness on Low-Energy Electron Transmission in Thin CVD Diamond Films / J. Yater ; A. Shih ; J. Butler ; P. Pehrsson
Growth and Characterization of LaS and NdS Thin Films on Si, GaAs, and InP Substrates / Y. Modukuru ; J. Thachery ; P. Boolchand ; J. Grant
Surface-Emitting Ballistic Cold Cathodes Based on Nanocrystalline Silicon Diodes / N. Koshida ; K. Kojima ; Y. Nakajima ; T. Ichihara ; Y. Watabe ; T. Komoda
Microwave-Tube Experiments Utilizing Ferroelectric Electron-Gun / M. Einat ; E. Jerby ; G. Rosenman
Author Index
Subject Index
Preface
Carbon Nanotubes
Quantum Interference Effects in the Nanotriode / S. Johnson ; A. Blackburn ; A. Driskill-Smith ; D. Hasko ; H. Ahmed
9.

図書

図書
editors, G.M. Swain ... [et al.] ; sponsoring divisions, Dielectric Science and Technology, High Temperature Materials, and Electronics
出版情報: Pennington, N.J. : Electrochemical Society, c2002  ix, 290 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-25
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