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電子ブック

EB
Tim C.; Schiffman, Susan S.; Nagle, H. Troy Pearce, Tim C. Pearce, Susan S. Schiffman
出版情報: Wiley Online Library - AutoHoldings Books , John Wiley & Sons, Inc., 2003
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Introduction to Olfaction: Perception, Anatomy, Physiology, and Molecular Biology / 1:
Introduction To Olfaction
Perception, Anatomy, Physiology And Molecular Biology Chemical Sensing In Humans And Machines Odour Handling And Delivery Systems Introduction To Chemosensors Signal Conditioning And Preprocessing Pattern Analysis For Electronic Noses Commercial / 1.1:
E-Nose Instruments Optical Electronic Noses Hand-Held And Palm-Top Microsensor Systems For Gas Analysis Integrated E-Nose And Microsystems For Chemcial Analysis
Introduction to Olfaction
Electronic Tongues And Combinations Of Artificial Senses Dynamic Pattern Recognition Methods And System Indent
Drift Compensation,Standards, Calibration Methods Chemical Sensor Array Optimization: Geometric And Information / 1.2:
Theoretic Approaches Correlating Endata And Sensory Panel Data Machine Olfaction For Mobile Robots Environmental Monitoring Medical Diagnostics And Health Monitoring Recognition Of Natural Products
Odor Classification Schemes Based on Adjective Descriptors
Process Monitoring Food And Beverage Quality Assurance Automotive And Aerospace Applications Detection Of Explosives Cosmetics And Fragrances
Index / 1.3:
Odor Classification Based on Chemical Properties
History of Structure-activity Studies of Olfaction / 1.3.1:
Odor Structures Associated with Specific Odor Classes Based on Qualitative Descriptors / 1.3.2:
Relationship of Physicochemical Parameters to Classifications of Odor Based on Similarity Measures / 1.3.3:
Molecular Parameters and Odor Thresholds / 1.3.4:
Conclusions Regarding Physicochemical Parameters and Odor Quality / 1.3.5:
Physiology and Anatomy of Olfaction / 1.4:
Basic Anatomy / 1.4.1:
Transduction and Adaptation of Olfactory Signals / 1.4.2:
Molecular Biology Of Olfaction / 1.5:
Taste / 1.6:
Taste Classification Schemes Based on Sensory Properties / 1.6.1:
Physiology and Anatomy of Taste / 1.6.2:
Transduction of Taste Signals / 1.6.3:
Molecular Biology of Taste / 1.6.4:
Final Comment / 1.7:
Chemical Sensing in Humans and Machines / 2:
Human Chemosensory Perception of Airborne Chemicals / 2.1:
Nasal Chemosensory Detection / 2.2:
Thresholds for Odor and Nasal Pungency / 2.2.1:
Stimulus-Response (Psychometric) Functions for Odor and Nasal Pungency / 2.2.2:
Olfactory and Nasal Chemesthetic Detection of Mixtures of Chemicals / 2.3:
Physicochemical Determinants of Odor and Nasal Pungency / 2.4:
The Linear Solvation Model / 2.4.1:
Application of the Solvation Equation to Odor and Nasal Pungency Thresholds / 2.4.2:
Human Chemical Sensing: Olfactometry / 2.5:
Static Olfactometry / 2.5.1:
Dynamic Olfactometry / 2.5.2:
Environmental Chambers / 2.5.3:
Instruments for Chemical Sensing: Gas Chromatography-Olfactometry / 2.6:
Charm Analysis / 2.6.1:
Aroma Extract Dilution Analysis (AEDA) / 2.6.2:
Osme Method / 2.6.3:
Odor Handling and Delivery Systems / 3:
Introduction / 3.1:
Physics of Evaporation / 3.2:
Sample Flow System / 3.3:
Headspace Sampling / 3.3.1:
Diffusion Method / 3.3.2:
Permeation Method / 3.3.3:
Bubbler / 3.3.4:
Method using a Sampling Bag / 3.3.5:
Static System / 3.4:
Preconcentrator / 3.5:
Sensitivity Enhancement / 3.5.2:
Removal of Humidity
Selectivity Enhancement by Varying Temperature / 3.5.3:
Measurement of Sensor Directly Exposed to Ambient Vapor / 3.6:
Analysis of Transient Sensor Response using an Optical Tracer / 3.6.1:
Homogenous Sensor Array for Visualizing Gas/Odor Flow / 3.6.2:
Response of Sensor Mounted on an Odor-Source Localization System / 3.6.3:
Summary / 3.7:
Introduction to Chemosensors / 4:
Survey and Classification of Chemosensors / 4.1:
Chemoresistors / 4.3:
MOS / 4.3.1:
Organic CPs / 4.3.2:
Chemocapacitors (CAP) / 4.4:
Potentiometric Odor Sensors / 4.5:
Mosfet / 4.5.1:
Gravimetric Odor Sensors / 4.6:
QCM / 4.6.1:
SAW / 4.6.2:
Optical Odor Sensors / 4.7:
SPR / 4.7.1:
Fluorescent Odor Sensors / 4.7.2:
Other Optical Approaches / 4.7.3:
Thermal (Calorimetric) Sensors / 4.8:
Amperometric Sensors / 4.9:
Summary of Chemical Sensors / 4.10:
Signal Conditioning and Preprocessing / 5:
Interface Circuits / 5.1:
Acoustic Wave Sensors / 5.2.1:
Field-Effect Gas Sensors / 5.2.3:
Temperature Control / 5.2.4:
Signal Conditioning / 5.3:
Operational Amplifiers / 5.3.1:
Buffering / 5.3.2:
Amplification / 5.3.3:
Filtering / 5.3.4:
Compensation / 5.3.5:
Signal Preprocessing / 5.4:
Baseline Manipulation / 5.4.1:
Compression / 5.4.2:
Normalization / 5.4.3:
Noise in Sensors and Circuits / 5.5:
Outlook / 5.6:
Temperature Modulation / 5.6.1:
Conclusions / 5.7:
Acknowledgements / 5.8:
Pattern Analysis for Electronic Noses / 6:
Nature of Sensor Array Data / 6.1:
Classification of Analysis Techniques / 6.1.2:
Overview / 6.1.3:
Statistical Pattern Analysis Techniques / 6.2:
Linear Calibration Methods / 6.2.1:
Linear Discriminant Analysis (LDA) / 6.2.2:
Principal Components Analysis (PCA) / 6.2.3:
Cluster Analysis (CA) / 6.2.4:
'Intelligent' Pattern Analysis Techniques / 6.3:
Multilayer Feedforward Networks / 6.3.1:
Competitive and Feature Mapping Networks / 6.3.2:
'Fuzzy' Based Pattern Analysis / 6.3.3:
Neuro-Fuzzy Systems (NFS) / 6.3.4:
Outlook and Conclusions / 6.4:
Criteria for Comparison / 6.4.1:
Intelligent Sensor Systems / 6.4.2:
Commercial Electronic Nose Instruments / 6.4.3:
Geographical Expansion / 7.1:
Scientific and Technological Broadening / 7.1.2:
Conceptual Expansion / 7.1.3:
Commercial Availability / 7.2:
Global Market Players / 7.2.1:
Handheld Devices / 7.2.2:
Enthusiastic Sensor Developers / 7.2.3:
Non-Electronic Noses / 7.2.4:
Specific Driven Applications / 7.2.5:
Some Market Considerations / 7.3:
Optical Electronic Noses / 8:
Optical Sensors / 8.1:
Advantages and Disadvantages of Optical Transduction / 8.1.2:
Optical Vapor Sensing / 8.2:
Waveguides / 8.2.1:
Luminescent Methods / 8.2.2:
Colorimetric Methods / 8.2.3:
Surface Plasmon Resonance (SPR) / 8.2.4:
Interference and Reflection-Based Methods / 8.2.5:
Scanning Light-Pulse Technique / 8.2.6:
The Tufts Artificial Nose / 8.3:
Conclusion / 8.4:
Hand-held and Palm-Top Chemical Microsensor Systems for Gas Analysis / 9:
Conventional Hand-held Systems / 9.1:
Hardware Setup / 9.2.1:
Fundamentals of the Sensing Process / 9.2.2:
Commercially Available Instruments Based on Conventional Technology / 9.2.3:
Silicon-Based Microsensors / 9.3:
Micromachining Techniques / 9.3.1:
Microstructured Chemocapacitors / 9.3.2:
Micromachined Resonating Cantilevers / 9.3.3:
Micromachined Calorimetric Sensors / 9.3.4:
Single-Chip Multisensor System / 9.3.5:
Operation Modes for CMOS Microsystems / 9.3.6:
Summary and Outlook / 9.4:
Integrated Electronic Noses and Microsystems for Chemical Analysis / 10:
Microcomponents for Fluid Handling / 10.1:
Microchannels and Mixing Chambers / 10.2.1:
Microvalves / 10.2.2:
Micropumps / 10.2.3:
Integrated E-Nose Systems / 10.3:
Monotype Sensor Arrays / 10.3.1:
Multi-type Sensor Arrays / 10.3.2:
Microsystems for Chemical Analysis / 10.4:
Gas Chromatographs / 10.4.1:
Mass Spectrometers / 10.4.2:
Optical Spectrometers / 10.4.3:
Future Outlook / 10.5:
Electronic Tongues and Combinations of Artificial Senses / 11:
Electronic Tongues / 11.1:
Measurement Principles / 11.2.1:
Potentiometric Devices / 11.2.2:
Voltammetric Devices / 11.2.3:
Piezoelectric Devices
The Combination or Fusion of Artificial Senses / 11.3:
The Combination of an Electronic Nose and an Electronic Tongue / 11.3.1:
The Artificial Mouth and Sensor Head / 11.3.2:
Dynamic Pattern Recognition Methods and System Identification / 11.4:
Dynamic Models and System Identification / 12.1:
Linear Models / 12.2.1:
Multi-exponential Models / 12.2.2:
Non-linear Models / 12.2.3:
Identifying a Model / 12.3:
Non-Parametric Approach / 12.3.1:
Parametric Approach / 12.3.2:
Dynamic Models and Intelligent Sensor Systems / 12.4:
Dynamic Pattern Recognition for Selectivity Enhancement / 12.4.1:
Calibration Time Reduction / 12.4.2:
Building of Response Models / 12.4.3:
Drift Counteraction / 12.4.4:
Drift Compensation, Standards, and Calibration Methods / 12.5:
Physical Reasons for Drift and Sensor Poisoning / 13.1:
Examples of Sensor Drift / 13.2:
Comparison of Drift and Noise / 13.3:
Model Building Strategies / 13.4:
Calibration Transfer / 13.5:
Drift Compensation / 13.6:
Reference Gas Methods / 13.6.1:
Modeling of Sensor Behavior / 13.6.2:
Pattern-Oriented Techniques for Classification / 13.6.3:
Drift-Free Parameters / 13.6.4:
Self-Adapting Models / 13.6.5:
Chemical Sensor Array Optimization: Geometric and Information Theoretic Approaches / 13.7:
The Need for Array Performance Definition and Optimization / 14.1:
Historical Perspective / 14.2:
Geometric Interpretation / 14.3:
Linear Transformations / 14.3.1:
Noise Considerations / 14.4:
Number of Discriminable Features / 14.4.1:
Measurement Accuracy / 14.4.2:
2-Sensor 2-Odor Example / 14.4.3:
Non-linear Transformations / 14.5:
Array Performance as a Statistical Estimation Problem / 14.6:
Fisher Information Matrix and the Best Unbiased Estimator / 14.7:
FIM Calculations for Chemosensors / 14.8:
Performance Optimization / 14.8.1:
Optimization Example / 14.9.1:
Overdetermined Case / 14.10:
General Case with Gaussian Input Statistics / 14.B:
Equivalence Between the Geometric Approach and the Fisher Information Maximization / 14.C:
Correlating Electronic Nose and Sensory Panel Data / 15:
Sensory Panel Methods / 15.2:
Odor Perception / 15.2.1:
Measurement of Detectability / 15.2.2:
Transforming the Measurement of the Subject to the Subject's Measurement of an Odor / 15.2.3:
Assessor Selection / 15.2.4:
Types of Dynamic Dilution Olfactometry / 15.2.5:
Assessment of Odor Intensity / 15.2.6:
Assessment of Odor Quality / 15.2.7:
Judgment of Hedonic Tone / 15.2.8:
Applications of Electronic Noses for Correlating Sensory Data / 15.3:
Algorithms for Correlating Sensor Array Data with Sensory Panels / 15.4:
Multidimensional Scaling / 15.4.1:
Regression Methods / 15.4.2:
Principal Components Regression / 15.4.3:
Partial Least Squares Regression / 15.4.4:
Neural Networks / 15.4.5:
Fuzzy-Based Data Analysis / 15.4.6:
Correlations of Electronic Nose Data with Sensory Panel Data / 15.5:
Data from Mouldy Grain / 15.5.1:
Machine Olfaction for Mobile Robots / 15.6:
Olfactory-Guided Behavior of Animals / 16.1:
Basic Behaviors Found in Small Organisms / 16.2.1:
Plume Tracking / 16.2.2:
Trail Following by Ant / 16.2.3:
Sensors and Signal Processing in Mobile Robots / 16.3:
Chemical Sensors / 16.3.1:
Robot Platforms / 16.3.2:
Trail Following Robots / 16.4:
Odor Trails to Guide Robots / 16.4.1:
Robot Implementations / 16.4.2:
Engineering Technologies for Trail-Following Robots / 16.4.3:
Plume Tracking Robots / 16.5:
Chemotactic Robots / 16.5.1:
Olfactory Triggered Anemotaxis / 16.5.2:
Multiphase Search Algorithm / 16.5.3:
Other Technologies in Developing Plume Tracking Systems / 16.6:
Olfactory Video Camera / 16.6.1:
Odor Compass / 16.6.2:
Concluding Remarks / 16.7:
Environmental Monitoring / 17:
Water / 17.1:
Land / 17.1.2:
Air / 17.1.3:
Special Considerations for Environmental Monitoring / 17.2:
Sample Handling Problems / 17.2.1:
Signal Processing Challenges / 17.2.2:
Case Study 1: Livestock Odor Classification / 17.3:
Background / 17.3.1:
Description of the problem / 17.3.2:
Methods / 17.3.3:
Signal Processing Algorithms / 17.3.4:
Results / 17.3.5:
Discussion / 17.3.6:
Case Study 2: Swine Odor Detection Thresholds / 17.4:
Description of the Problem / 17.4.1:
Case Study 3: Biofilter Evaluation / 17.4.2:
Case Study 4: Mold Detection / 17.5.1:
The NC State E-Nose / 17.6.1:
Future Directions / 17.6.4:
Medical Diagnostics and Health Monitoring / 18:
Special Considerations in Medical/Healthcare Applications / 18.1:
Monitoring Metabolic Defects in Humans Using a Conducting Polymer Sensor Array to Measure Odor / 18.3:
Methodology / 18.3.1:
The Use of an Electronic Nose for the Detection of Bacterial Vaginosis / 18.3.3:
Recognition of Natural Products / 18.4.1:
Recent Literature Review / 19.1:
Sampling Techniques / 19.3:
Sample Containment / 19.3.1:
Sample Treatments / 19.3.2:
Instrument and Sample Conditioning / 19.3.3:
Sample Storage / 19.3.4:
Seasonal Variations / 19.3.5:
Inherent Variability of Natural Products / 19.3.6:
Case Study: The Rapid Detection of Natural Products as a Means of Identifying Plant Species / 19.4:
Wood Chip Sorting / 19.4.1:
Experimental Procedure / 19.4.2:
SPME-GC Analysis of the Sapwood of the Conifers Used in Pulp and Paper Industries / 19.4.3:
Conclusion: Wood Chip Sorting / 19.4.4:
Case Study: Differentiation of Essential Oil-Bearing Plants / 19.5:
Golden Rod Essential Oils / 19.5.1:
Essential Oils of Tansy / 19.5.2:
Conclusion: Essential Oils / 19.5.3:
Conclusion and Future Outlook / 19.6:
Process Monitoring / 20:
On-line Bioprocess Monitoring / 20.1:
At-line Food Process Monitoring / 20.1.2:
Previous Work / 20.2:
Quantitative Bioprocess Monitoring / 20.2.1:
Qualitative Bioprocess Monitoring / 20.2.2:
Special Considerations / 20.2.3:
Selected Process Monitoring Examples / 20.4:
On-line Monitoring of Bioprocesses / 20.4.1:
At-line Monitoring of a Feed Raw Material Production Process / 20.4.2:
Monitoring Setup / 20.4.3:
Signal Processing / 20.4.4:
Chemometrics / 20.4.5:
Future Prospects / 20.5:
Food and Beverage Quality Assurance / 21:
Literature Survey / 21.1:
Methodological Issues in Food Measurement with Electronic Nose / 21.3:
Selected Case / 21.4:
LibraNose / 21.4.1:
Case Study: Fish Quality / 21.4.2:
Automotive and Aerospace Applications / 21.5:
Automotive Applications / 22.1:
Aerospace Applications / 22.3:
Polymer Composite Films / 22.4:
Electronic Nose Operation in Spacecraft / 22.5:
The JPL Enose Flight Experiment / 22.5.1:
Data Analysis / 22.5.2:
Pattern Recognition Method / 22.5.3:
Method Development / 22.6:
Levenberg-Marquart Nonlinear Least Squares Method / 22.6.1:
Single gases / 22.6.2:
Mixed Gases / 22.6.3:
STS-95 Flight Data Analysis Results / 22.6.4:
Sensors / 22.7:
Data Acquisition / 22.7.2:
Detection of Explosives / 22.7.3:
State-of-the-art of Various Explosive Vapor Sensors / 23.1:
Case Study / 23.4:
Cosmetics and Fragrances / 23.5:
The Case for an Electronic Nose in Perfumery / 24.1:
Current Challenges and Limitations of Electronic Noses / 24.3:
Literature Review of Electronic Noses in Perfumery and Cosmetics / 24.4:
Special Considerations for using Electronic Noses to Classify and Judge Quality of Perfumes, PRMs, and Products / 24.5:
Case Study 1: Use in Classification of PRMs with Different Odor Character but of Similar Composition / 24.6:
The Problem / 24.6.1:
Conclusions for Case Study 1 / 24.6.2:
Case Study 2: Use in Judging the Odor Quality of a Sunscreen Product / 24.7:
Equipment and Methods / 24.7.1:
Conclusions for Case Study 2 / 24.7.4:
Introduction to Olfaction: Perception, Anatomy, Physiology, and Molecular Biology / 1:
Introduction To Olfaction
Perception, Anatomy, Physiology And Molecular Biology Chemical Sensing In Humans And Machines Odour Handling And Delivery Systems Introduction To Chemosensors Signal Conditioning And Preprocessing Pattern Analysis For Electronic Noses Commercial / 1.1:
2.

電子ブック

EB
Schroter, Kenneth A. Jackson, Wolfgang Schr?ter
出版情報: Wiley Online Library - AutoHoldings Books , John Wiley & Sons, Inc., 2000
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Band Theory Applied to Semiconductors / M. Lannoo1:
Optical Properties and Charge Transport / R. G. Ulbrich2:
Intrinsic Point Defects in Semiconductors 1999 / G. D. Watkins3:
Deep Centers in Semiconductors / H. Feichtinger4:
Point Defects, Diffusion, and Precipitation / T. Y. Tan ; U. Gosele5:
Dislocation / H. Alexander ; H. Teichler6:
Grain Boundaries in Semiconductors / J. Thibault ; J.-L. Rouviere ; A. Bourret7:
Interfaces / R. Hull ; A. Ourmazd ; W. D. Rau ; P. Schwander ; M. L. Green ; R. T. Tung8:
Material Properties of Hydrogenated Amorphous Silicon / R. A. Street ; K. Winter9:
High-Temperature Properties of Transition Elements in Silicon / W. Schroter ; M. Seibt ; D. Gilles10:
Fundamental Aspects of SiC / W. J. Choyke ; R. P. Devaty11:
New Materials: Semiconductors for Solar Cells / H. J. Moller12:
New Materials: Gallium Nitride / E. R. Weber ; J. Kruger ; C. Kisielowski13:
Index
Band Theory Applied to Semiconductors / M. Lannoo1:
Optical Properties and Charge Transport / R. G. Ulbrich2:
Intrinsic Point Defects in Semiconductors 1999 / G. D. Watkins3:
3.

電子ブック

EB
Stojmenovic, Ivan Stojmenovic
出版情報: Wiley Online Library - AutoHoldings Books , Hoboken : John Wiley & Sons, Inc., 2005
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Preface
Contributors
Introduction to Wireless Sensor Networking / Fernando Martincic ; Loren Schwiebert1:
Distributed Signal Processing Algorithms for the Physical Layer of Large-Scale Sensor Networks / An-swol Hu ; Sergio D. Servetto2:
Energy Scavenging and Non-traditional Power Sources for Wireless Sensor Networks / Shad Roundy ; Luc Frechette3:
A virtual infrastructure for wireless sensor networks / Stephan Olariu ; Ashraf Wadaa ; Qingwen Xu ; Ivan Stojmenovic4:
Broadcast authentication and key management for secure sensor networks / Peng Ning ; Donggang Liu5:
Embedded operating systems for wireless micro sensor nodes / Brian Shucker ; Jeff Rose ; Anmol Sheth ; James Carlson ; Shah Bhatti ; Hui Dai ; Jing Deng ; Richard Han6:
Time Synchronization and Calibration in Wireless Sensor Networks / Kay Roemer ; Philipp Blum ; Lennart Meier7:
The Wireless Sensor Network MAC / Edgar H. Callaway8:
Localization in sensor networks / Jonathan Bachrach ; Christopher Taylor9:
Topology construction and maintenance in wireless sensor networks / Jennifer Hou ; Ning Li10:
Energy efficient broadcasting, activity scheduling and area coverage in sensor networks / David Simplot-Ryl ; Jie Wu11:
Geographic and energy aware routing in sensor networks / Hannes Frey12:
Data-centric protocols for wireless sensor networks / 13:
Path exposure, target location, classification and tracking in sensor networks / Kousha Moaveni-Nejad ; XiangYang Li14:
Data gathering and fusion in sensor networks / Wei-Peng Chen15:
Index
Preface
Contributors
Introduction to Wireless Sensor Networking / Fernando Martincic ; Loren Schwiebert1:
4.

電子ブック

EB
Edwards
出版情報: Wiley Online Library - AutoHoldings Books , John Wiley & Sons, Inc., 2000
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Preface
Acknowledgements
Fundamentals of Signal Transmission on Interconnects / 1:
Interconnect as part of a packaging hierarchy / 1.1:
The physical basis of interconnects / 1.2:
What an interconnect is and how information is transmitted / 1.2.1:
The physics, a guided wave / 1.3:
Transmission of a pulse / 1.3.1:
Transverse ElectroMagnetic lines (TEM-lines) / 1.3.2:
Multimoding / 1.3.3:
The effect of dielectric / 1.3.4:
Frequency-dependent charge distribution / 1.3.5:
Dispersion / 1.3.6:
When an interconnect should be treated as a transmission line / 1.4:
The concept of radio frequency transmission lines / 1.5:
Primary transmission line constants / 1.6:
Secondary constants for transmission lines / 1.7:
Transmission line impedances / 1.8:
Reflection / 1.9:
Reflection and Voltage Standing-Wave Ratio (VSWR) / 1.9.1:
Forward and backward travelling pulses / 1.9.2:
Effect on signal integrity / 1.9.3:
Multiple conductors / 1.10:
Return currents / 1.11:
Common impedance coupling / 1.11.1:
Modeling of interconnects / 1.12:
Summary / 1.13:
On-Chip Interconnects for Digital Systems / 2:
Overview of on-chip interconnects / 2.1:
Types of on-chip interconnects / 2.1.1:
Experimental characterization of an on-chip interconnect / 2.2:
RC Modelling on-chip interconnects / 2.3:
Delay modelling / 2.3.1:
RC modelling / 2.3.2:
Modelling inductance / 2.4:
When are inductance effects important? / 2.4.1:
Inductance extraction / 2.4.2:
Design approaches to handling interconnect effects / 2.5:
Performance-driven routing / 2.5.1:
Transmission line return paths / 2.5.2:
Interconnect Technologies / 3:
Introductory remarks / 3.1:
Microwave frequencies and applications / 3.2:
Transmission line structures / 3.3:
Imageline / 3.3.1:
Microstrip / 3.3.2:
Finline / 3.3.3:
Inverted microstrip / 3.3.4:
Slotline / 3.3.5:
Trapped inverted microstrip / 3.3.6:
Coplanar waveguide (CPW) / 3.3.7:
Coplanar strip (CPS) and differential line / 3.3.8:
Stripline / 3.3.9:
Summary of interconnect properties / 3.3.10:
Substrates for hybrid microcircuits / 3.4:
FR4 ('printed circuit board') / 3.4.1:
Ceramic substrates / 3.4.2:
Softboard / 3.4.3:
Overall appraisal--alternative substrates and structures / 3.4.4:
Sapphire--the 'benchmark' substrate material / 3.4.5:
Thin-film modules / 3.5:
Plate-through technique / 3.5.1:
Etch-back technique / 3.5.2:
Equipment required / 3.5.3:
Thin resistive films / 3.5.4:
Thick-film modules / 3.6:
Pastes, printing and processing for thick-film modules / 3.6.1:
Monolithic technology / 3.7:
Introduction / 3.7.1:
Multilayer interconnect / 3.7.2:
Metallization / 3.7.3:
Low-k dielectrics / 3.7.4:
MIC and MMIC approaches compared / 3.7.5:
Printed circuit boards / 3.8:
Organic PCBs / 3.8.1:
Ceramic PCBs / 3.8.2:
Multichip modules / 3.9:
MCM-L substrates / 3.9.1:
MCM-C substrates / 3.9.2:
MCM-D substrates / 3.9.3:
Characterization of interconnects on an MCM: a case study / 3.9.4:
MCM Summary / 3.9.5:
Microstrip Design at Low Frequencies / 4:
The microstrip design problem / 4.1:
Digital interconnect / 4.1.1:
A transistor amplifier input network / 4.1.2:
The geometry of microstrip / 4.1.3:
The quasi-TEM mode of propagation / 4.2:
Static-TEM parameters / 4.3:
The characteristic impedance Z[subscript 0] / 4.3.1:
The effective microstrip permittivity [varepsilon subscript eff] / 4.3.2:
Synthesis: the width-to-height ratio w/h / 4.3.3:
Wavelength [lambda], and physical length l / 4.3.4:
Approximate graphically-based synthesis / 4.4:
Formulas for accurate static-TEM design calculations / 4.5:
Synthesis formulas (Z[subscript 0] and f given) / 4.5.1:
Analysis formulas (w/h and [varepsilon subscript r] given) / 4.5.2:
Overall accuracies to be expected from the previous expressions / 4.5.3:
Analysis techniques requiring substantial computer power / 4.6:
A worked example of static-TEM synthesis / 4.7:
Graphical determination / 4.7.1:
Accurately calculated results / 4.7.2:
Final dimensions of the microstrip element / 4.7.3:
Microstrip on a dielectrically anisotropic substrate / 4.8:
Microstrip on a ferrite substrate / 4.9:
Effects of strip thickness, enclosure and manufacturing tolerances / 4.10:
Effects of finite strip thickness / 4.10.1:
Effects of a metallic enclosure / 4.10.2:
Effects due to manufacturing tolerances / 4.10.3:
Pulse propagation along microstrip lines / 4.11:
Recommendations relating to the static-TEM approaches / 4.12:
The principal static-TEM synthesis formulas / 4.12.1:
Microstrip on a sapphire (anisotropic) substrate / 4.12.2:
Design corrections for non-semiconductor substrates / 4.12.3:
Microstrip and Stripline at High Frequencies / 5:
The scope of this chapter / 5.1:
Dispersion in microstrip / 5.2:
Approximate calculations accounting for dispersion / 5.3:
Accurate design formulas / 5.4:
Edwards and Owens' expressions / 5.4.1:
Expressions suitable for millimetre-wave design / 5.4.2:
Dispersion curves derived from simulations / 5.4.3:
Effects due to ferrite and to dielectrically anisotropic substrates / 5.5:
Effects of ferrite substrates / 5.5.1:
Effects of a dielectrically anisotropic substrate / 5.5.2:
Designs requiring dispersion calculations--worked examples / 5.6:
Field solutions / 5.7:
One example of a 'classic' frequency-dependent computer-based field solution / 5.7.1:
Analysis of arbitrary planar configurations / 5.7.2:
Asymmetry effects / 5.7.3:
Time-domain approaches / 5.7.4:
Frequency-dependence of the microstrip characteristic impedance / 5.8:
Different definitions and trends with increasing frequency / 5.8.1:
Use of the planar waveguide model / 5.8.2:
A further alternative expression / 5.8.3:
A design algorithm for microstrip width / 5.8.4:
An example derived from a simulation / 5.8.5:
Operating frequency limitations / 5.9:
The TM mode limitation / 5.9.1:
The lowest-order transverse microstrip resonance / 5.9.2:
Power losses and parasitic coupling / 5.10:
Q-factor and attenuation coefficient / 5.10.1:
Conductor losses / 5.10.2:
Dielectric loss / 5.10.3:
Radiation / 5.10.4:
Surface-wave propagation / 5.10.5:
Parasitic coupling / 5.10.6:
Radiation and surface-wave losses from discontinuities / 5.10.7:
Losses in microstrip on semi-insulating GaAs / 5.10.8:
Superconducting microstrips / 5.11:
Stripline design / 5.12:
Symmetrical stripline formulas / 5.12.1:
Design recommendations / 5.13:
Recommendation 1 / 5.13.1:
Recommendation 2 / 5.13.2:
Recommendation 3 / 5.13.3:
Recommendation 4 / 5.13.4:
Recommendation 5 / 5.13.5:
Characteristic impedance as a function of frequency / 5.13.6:
Computer-aided design / 5.13.7:
CPW Design Fundamentals / 6:
Introduction--properties of coplanar waveguide / 6.1:
Modelling CPWs / 6.2:
Effective permittivity / 6.2.1:
Characteristic impedance / 6.2.2:
Formulas for accurate calculations / 6.3:
Analysis and synthesis approaches / 6.3.1:
Loss mechanisms / 6.4:
Conductor loss / 6.4.1:
Radiation loss / 6.4.3:
CPW with intervening SiO[subscript 2] layer / 6.4.4:
Fundamental and theoretical considerations / 6.5:
Results from test runs using electromagnetic simulation / 6.5.2:
Experimental results / 6.5.3:
Discontinuities / 6.6:
Step changes in width and separation / 6.6.1:
Open-circuit / 6.6.2:
Symmetric series gap / 6.6.3:
Coplanar short-circuit / 6.6.4:
Right-angle bends / 6.6.5:
T-junctions / 6.6.6:
Air bridges / 6.6.7:
Cross-over junctions / 6.6.8:
Circuit elements / 6.7:
Interdigital capacitors and stubs / 6.7.1:
Filters / 6.7.2:
Couplers and baluns / 6.7.3:
Power dividers / 6.7.4:
Variants upon the basic CPW structure / 6.8:
CPW with top and bottom metal shields / 6.8.1:
Multilayer CPW / 6.8.2:
Trenched CPW on a silicon MMIC / 6.8.3:
Transitions between CPW and other media / 6.8.4:
Flip-chip realizations / 6.9:
Mixers, micromachined structures and other CPW issues / 6.10:
Mixers and frequency doubler / 6.10.1:
GaAs FET characterization and specialized resonators / 6.10.2:
Micromachined structures / 6.10.3:
Leakage suppression and 50 GHz interconnect / 6.10.4:
Light dependence of silicon FGCPW / 6.10.5:
Differential line and coplanar strip (CPS) / 6.11:
Discontinuities in Microstrip and Stripline / 6.12:
The main discontinuities / 7.1:
The foreshortened open-circuit / 7.2:
Equivalent end-effect length / 7.2.1:
Upper limit to end-effect length (quasi-static basis) / 7.2.2:
The series gap / 7.3:
Accuracy of gap capacitance calculations / 7.3.1:
Microstrip short-circuits / 7.4:
Further discontinuities / 7.5:
The right-angled bend or 'corner' / 7.6:
Mitred or 'matched' microstrip bends--compensation techniques / 7.7:
Step changes in width (impedance steps) / 7.8:
The symmetrical microstrip step / 7.8.1:
The asymmetrical step in microstrip / 7.8.2:
The narrow transverse slit / 7.9:
The microstrip T-junction / 7.10:
Compensated T-junctions / 7.11:
Cross-junctions / 7.12:
Frequency dependence of discontinuity effects / 7.13:
Open-circuits and series gaps / 7.13.1:
Other discontinuities / 7.13.2:
Cross- and T-junctions / 7.13.3:
Radial bends / 7.13.4:
Frequency dependence of shunt post parameters / 7.13.5:
Recommendations for the calculation of discontinuities / 7.14:
Foreshortened open-circuits / 7.14.1:
Series gaps / 7.14.2:
Short-circuits / 7.14.3:
Right-angled bends: mitring / 7.14.4:
Steps in width / 7.14.5:
Transverse slit / 7.14.6:
The T-junction / 7.14.7:
The asymmetric cross-junction / 7.14.8:
Stripline discontinuities / 7.15:
Bends / 7.15.1:
Vias / 7.15.2:
Junctions / 7.15.3:
Parallel-coupled Lines and Directional Couplers / 8:
Structure and applications / 8.1:
Parameters and initial specification / 8.2:
Coupled microstrip lines / 8.3:
Characteristic impedances in terms of the coupling factor (C) / 8.4:
Semi-empirical analysis formulas as a design aid / 8.5:
An approximate synthesis technique / 8.6:
A specific example: design of a 10 DB microstrip coupler / 8.7:
Use of Bryant and Weiss' curves / 8.7.1:
Synthesis using Akhtarzad's technique / 8.7.2:
Comparison of methods / 8.7.3:
Coupled-region length / 8.8:
Frequency response / 8.9:
Overall effects and Getsinger's model / 8.9.1:
More accurate design expressions, including dispersion / 8.9.2:
Complete coupling section response / 8.9.3:
Coupler directivity / 8.10:
Special coupler designs with improved performance / 8.11:
The 'Lange' coupler / 8.11.1:
The 'unfolded Lange' coupler / 8.11.2:
Shielded parallel-coupled microstrips / 8.11.3:
The use of a dielectric overlay / 8.11.4:
The incorporation of lumped capacitors / 8.11.5:
The effect of a dielectrically anisotropic substrate / 8.11.6:
Microstrip multiplexers / 8.11.7:
Multisection couplers / 8.11.8:
Re-entrant mode couplers / 8.11.9:
Patch couplers / 8.11.10:
Thickness effects, power losses and fabrication tolerances / 8.12:
Thickness effects / 8.12.1:
Power losses / 8.12.2:
Effects of fabrication tolerances / 8.12.3:
Planar combline directional couplers / 8.13:
Crosstalk and signal distortion between microstrip lines used in digital systems / 8.14:
Choice of structure and design recommendations / 8.15:
Design procedure for coupled microstrips, C [less than or equal] -3 dB / 8.15.1:
Relatively large coupling factors (typically C [greater than or equal] -3dB) / 8.15.2:
Length of the coupled region / 8.15.3:
Coupled structures with improved performance / 8.15.4:
Effects of conductor thickness, power losses and production tolerances / 8.15.6:
Crosstalk between microstrip lines used in digital systems / 8.15.7:
Post-manufacture circuit adjustment / 8.15.8:
Power Capabilities, Transitions and Measurement Techniques / 9:
Power-handling capabilities / 9.1:
Maximum average power P[subscript ma] under CW conditions / 9.1.1:
Peak (pulse) power-handling capability / 9.1.2:
Coaxial-to-microstrip transitions / 9.2:
Waveguide-to-microstrip transitions / 9.3:
Ridgeline transformer insert / 9.3.1:
Mode changer and balun / 9.3.2:
A waveguide-to-microstrip power splitter / 9.3.3:
Slot-coupled antenna waveguide-to-microstrip transition / 9.3.4:
Transitions between other media and microstrip / 9.4:
Instrumentation systems for microstrip measurements / 9.5:
Measurement of substrate properties / 9.6:
Microstrip resonator methods / 9.7:
The ring resonator / 9.7.1:
The side-coupled, open-circuit-terminated, straight resonator / 9.7.2:
Series-gap coupling of microstrips / 9.7.3:
Series-gap-coupled straight resonator pairs / 9.7.4:
The resonant technique due to Richings and Easter / 9.7.5:
The symmetrical straight resonator / 9.7.6:
Resonance methods for the determination of discontinuities other than open-circuits / 9.7.7:
Q-factor measurements / 9.8:
Measurements on parallel-coupled microstrips / 9.9:
Standing-wave indicators in microstrip / 9.10:
Time-Domain Reflectometry (TDR) Techniques / 9.11:
Interconnects and Filters in Passive RFICs and MICs / 10:
Radio-Frequency Integrated Circuits (RFICs) / 10.1:
On-chip resistors / 10.1.1:
On-chip capacitors / 10.1.2:
Planar inductors / 10.1.3:
Terminations and attenuators in MIC technology / 10.2:
Further thick and thin film passive components / 10.3:
Branch-type couplers and power dividers / 10.3.1:
Microstrip baluns / 10.3.2:
A strategy for low-pass microwave filter design / 10.3.3:
Bandpass filters / 10.3.4:
A worked numerical example of a parallel-coupled bandpass filter / 10.3.5:
CAD of parallel-coupled bandpass filters / 10.3.6:
Improvements to the basic edge-coupled filter response / 10.3.7:
Filter analysis and design including all losses / 10.3.8:
Bandpass filters with increased bandwidth (] 15%) / 10.3.9:
Further developments in bandpass filter design / 10.3.10:
Microstrip radial stubs / 10.3.11:
Dielectric resonators and filters using them / 10.3.12:
Spurline bandstop filters / 10.3.13:
Filters using synthetic periodic substrates (electromagnetic bandgap crystals) / 10.3.14:
Passive MICs with switching elements / 10.3.15:
Isolators and circulators / 10.3.16:
Active Digital and Analogue ICs / 11:
High-speed digital circuits / 11.1:
Clock distribution / 11.2:
Rotary clock distribution / 11.3:
Conceptual basis / 11.3.1:
Circuit model of a rotary clock / 11.3.2:
Case study: a 3 GHz rotary clock / 11.3.3:
Effect of copper interconnect / 11.3.4:
RF and microwave active devices / 11.3.5:
Yield and hybrid MICs / 11.5:
Amplifiers / 11.6:
Low-noise amplifier design strategy / 11.6.1:
High-gain narrowband amplifier design / 11.6.2:
Design example / 11.6.3:
Custom hybrid amplifiers / 11.7:
Standard MIC amplifier modules / 11.7.1:
Custom MIC amplifier modules / 11.7.2:
Balanced amplifiers / 11.8:
Amplifiers using MMIC technology / 11.9:
Design of a decade-bandwidth distributed amplifier / 11.9.1:
W-band MMIC LNAs / 11.9.2:
Microwave oscillators / 11.10:
Example of a Dielectric Resonator Oscillator / 11.10.1:
DRO oscillator developments / 11.10.2:
MMIC oscillator example / 11.10.3:
Active microwave filters / 11.11:
Phase shifters / 11.12:
Transmission Line Theory / Appendix A:
Half-, quarter- and eighth-wavelength lines / A.1:
Simple (narrowband) matching / A.2:
Equivalent two-port networks / A.3:
Chain (ABCD) parameters for a uniform length of loss-free transmission line / A.4:
Parallel coupled transmission lines / A.5:
Even and odd modes / A.5.1:
Overall parameters for couplers / A.5.2:
Analysis of parallel-coupled TEM-mode transmission lines / A.5.3:
Q-Factor / Appendix B:
Definition / B.1:
Loaded Q-factor / B.2:
External Q-factor of an open-circuited microstrip resonator / B.3:
Outline of Scattering Parameter Theory / Appendix C:
Network parameters / C.1:
Scattering parameters / C.3:
Scattering parameters for a two-port network / C.3.1:
Definitions of two-port S-parameters / C.3.2:
Evaluation of scattering parameters / C.3.3:
Measurement of scattering parameters / C.3.4:
S-parameter relationships in interpreting interconnect measurements / C.3.5:
Multiport S-parameters / C.3.6:
Signal-flow graph techniques and S-parameters / C.3.7:
Scattering transfer (or T) parameters / C.4:
Cascaded two-port networks: the utility of T parameters / C.4.1:
Capacitance Matrix Extraction / Appendix D:
References
Index
Preface
Acknowledgements
Fundamentals of Signal Transmission on Interconnects / 1:
5.

電子ブック

EB
Radomir S. Stankovic, Jaakko Astola, Claudio Moraga
出版情報: Wiley Online Library - AutoHoldings Books , Hoboken : John Wiley & Sons, Inc., 2005
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Preface
Acknowledgments
Acronyms
Signals and Their Mathematical Models / 1:
Systems / 1.1:
Signals / 1.2:
Mathematical Models of Signals / 1.3:
References
Fourier Analysis / 2:
Representations of Groups / 2.1:
Complete Reducibility / 2.1.1:
Fourier Transform on Finite Groups / 2.2:
Properties of the Fourier Transform / 2.3:
Matrix Interpretation of the Fourier Transform on Finite Non-Abelian Groups / 2.4:
Complete reducibility
Fast Fourier Transform on Finite Non-Abelian Groups / 2.5:
Matrix Interpretation of the FFT / 3:
Properties of the Fourier transform / 3.1:
Matrix Interpretation of FFT on Finite Non-Abelian Groups
Illustrative Examples / 3.2:
Matrix interpretation of the Fourier transform on finite non-Abelian groups
Complexity of the FFT / 3.3:
Fast Fourier transform on finite non-Abelian groups / 3.3.1:
Complexity of Calculations of the FFT
Remarks on Programming Implememtation of FFT / 3.3.2:
FFT Through Decision Diagrams / 3.4:
Decision Diagrams / 3.4.1:
Matrix interpretation of FFT on finite non-Abelian groups / 3.4.2:
FFT on Finite Non-Abelian Groups Through DDs
MMTDs for the Fourier Spectrum / 3.4.3:
Illustrative examples
Complexity of DDs Calculation Methods / 3.4.4:
Optimization of Decision Diagrams / 4:
Complexity of calculations of the FFT / 4.1:
Reduction Possibilities in Decision Diagrams
Group-Theoretic Interpretation of DD / 4.2:
Remarks on programming implementation of FFT
Fourier Decision Diagrams / 4.3:
FFT through decision diagrams / 4.3.1:
Fourier Decision Trees
Decision diagrams / 4.3.2:
Discussion of Different Decompositions / 4.4:
FFT on finite non-Abelian groups through DDs / 4.4.1:
Algorithm for Optimization of DDs
Representation of Two-Variable Function Generator / 4.5:
MTDDs for the Fourier spectrum
Representation of Adders by Fourier DD / 4.6:
Complexity of DDs calculation methods / 4.7:
Representation of Multipliers by Fourier DD
Complexity of NADD / 4.8:
Fourier DDs with Preprocessing / 4.9:
Matrix-valued Functions / 4.9.1:
Fourier Transform for Matrix-Valued Functions / 4.9.2:
Fourier Decision Trees with Preprocessing / 4.10:
Group-theoretic Interpretation of DD
Fourier Decision Diagrams with Preprocessing / 4.11:
Construction of FNAPDD / 4.12:
Algorithm for Construction of FNAPDD / 4.13:
Fourier decision trees
Algorithm for Representation / 4.13.1:
Fourier decision diagrams / 4.14:
Optimization of FNAPDD
Functional Expressions on Quaternion Groups / 5:
Fourier Expressions on Finite Dyadic Groups / 5.1:
Algorithm for optimization of DDs
Finite Dyadic Groups / 5.1.1:
Representation of adders by Fourier DD / 5.2:
Arithmetic Expressions / 5.3:
Representation of multipliers by Fourier DD / 5.4:
Arithmetic Expressions from Walsh Expansions
Complexity of FNADD / 5.5:
Arithmetic Expressions and Arithmetic-Haar Expressions / 5.5.1:
Arithmetic-Haar Expressions and Kronecker Expressions / 5.5.2:
Matrix-valued functions
Different Polarity Polynomials Expressions / 5.6:
Fourier transform for matrix-valued functions / 5.6.1:
Fixed-Polarity Arithmetic-HaarExpressions / 5.6.2:
Calculation of the Arithmetic-Haar Coefficients / 5.7:
FFT-like Algorithm / 5.7.1:
Calculation of Arithmetic-Haar Coefficients Through Decision Diagrams / 5.7.2:
Gibbs Derivatives on Finite Groups / 6:
Definition and Properties of Gibbs Derivatives on Finite Non-Abelian Groups / 6.1:
Algorithm for representation
Gibbs Anti-Derivative / 6.2:
Partial Gibbs Derivatives / 6.3:
Gibbs Differential Equations / 6.4:
Matrix Interpretation of Gibbs Derivatives / 6.5:
Fast Algorithms for Calculation of Gibbs Derivatives on Finite Groups / 6.6:
Fourier expressions on finite dyadic groups / 6.6.1:
Complexity of Calculation of Gibbs Derivatives
Calculation of Gibbs Derivatives Through DDs / 6.7:
Finite dyadic groups
Calculation of Partial Gibbs Derivatives / 6.7.1:
Fourier Expressions on Q[subscript 2]
Linear Systems on Finite Non-Abelian Groups / 7:
Linear Shift-Invariant Systems on Groups / 7.1:
Linear Shift-Invariant Systems on Finite Non-Abelian Groups / 7.2:
Arithmetic expressions from Walsh expansions
Gibbs Derivatives and Linear Systems / 7.3:
Arithmetic expressions on Q[subscript 2] / 7.3.1:
Discussion
Arithmetic expressions and arithmetic-Haar expressions / 8:
Hilbert Transform on Finite Groups
Some Results of Fourier Analysis on Finite Non-Abelian Groups / 8.1:
Arithmetic-Haar expressions and Kronecker expressions
Hilbert Transform on Finite Non-Abelian Groups / 8.2:
Different Polarity Polynomial Expressions / 8.3:
Hilbert Transform in Finite Fields
Index
Fixed-polarity Fourier expansions in C(Q[subscript 2])
Fixed-polarity arithmetic-Haar expressions
Calculation of the arithmetic-Haar coefficients
FFT-like algorithm
Calculation of arithmetic-Haar coefficients through decision diagrams
Definition and properties of Gibbs derivatives on finite non-Abelian groups
Gibbs anti-derivative
Partial Gibbs derivatives
Gibbs differential equations
Matrix interpretation of Gibbs derivatives
Fast algorithms for calculation of Gibbs derivatives on finite groups
Calculation of Gibbs derivatives through DDs
Calculation of partial Gibbs derivatives
Linear shift-invariant systems on groups
Linear shift-invariant systems on finite non-Abelian groups
Gibbs derivatives and linear systems
Some results of Fourier analysis on finite non-Abelian groups
Hilbert transform on finite non-Abelian groups
Hilbert transform in finite fields
Preface
Acknowledgments
Acronyms
6.

電子ブック

EB
Gary S. May, Costas J. Spanos
出版情報: Wiley Online Library - AutoHoldings Books , Hoboken : John Wiley & Sons, Inc., 2006
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Preface
Acknowledgments
Introduction to Semiconductor Manufacturing / 1:
Objectives
Introduction
Historical Evolution / 1.1:
Modern Semiconductor Manufacturing / 1.2:
Goals of Manufacturing / 1.3:
Manufacturing Systems / 1.4:
Outline for Remainder of the Book / 1.5:
Summary
Problems
References
Technology Overview / 2:
Unit Processes / 2.1:
Process Integration / 2.2:
Process Monitoring / 3:
Process Flow and Key Measurement Points / 3.1:
Wafer State Measurements / 3.2:
Equipment State Measurements / 3.3:
Statistical Fundamentals / 4:
Probability Distributions / 4.1:
Sampling from a Normal Distribution / 4.2:
Estimation / 4.3:
Hypothesis Testing / 4.4:
Reference
Yield Modeling / 5:
Definitions of Yield Components / 5.1:
Functional Yield Models / 5.2:
Functional Yield Model Components / 5.3:
Parametric Yield / 5.4:
Yield Simulation / 5.5:
Design Centering / 5.6:
Process Introduction and Time-to-Yield / 5.7:
Statistical Process Control / 6:
Control Chart Basics / 6.1:
Patterns in Control Charts / 6.2:
Control Charts for Attributes / 6.3:
Control Charts for Variables / 6.4:
Multivariate Control / 6.5:
SPC with Correlated Process Data / 6.6:
Statistical Experimental Design / 7:
Comparing Distributions / 7.1:
Analysis of Variance / 7.2:
Factorial Designs / 7.3:
Taguchi Method / 7.4:
Process Modeling / 8:
Regression Modeling / 8.1:
Response Surface Methods / 8.2:
Evolutionary Operation / 8.3:
Principal-Component Analysis / 8.4:
Intelligent Modeling Techniques / 8.5:
Process Optimization / 8.6:
Advanced Process Control / 9:
Run-by-Run Control with Constant Term Adaptation / 9.1:
Multivariate Control with Complete Model Adaptation / 9.2:
Supervisory Control / 9.3:
Process and Equipment Diagnosis / 10:
Algorithmic Methods / 10.11:
Expert Systems / 10.l2:
Neural Network Approaches / 10.l3:
Hybrid Methods / 10.l4:
Some Properties of the Error Function / Appendix A:
Cumulative Standard Normal Distribution / Appendix B:
Percentage Points of the C2 Distribution / Appendix C:
Percentage Points of the t Distribution / Appendix D:
Percentage Points of the F Distribution / Appendix E:
Factors for Constructing Variables Control Charts / Appendix F:
Index
Preface
Acknowledgments
Introduction to Semiconductor Manufacturing / 1:
7.

電子ブック

EB
Brian R. Eggins
出版情報: Wiley Online Library - AutoHoldings Books , John Wiley & Sons, Incorporated, 2002
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Series Preface
Preface
Acronyms, Abbreviations and Symbols
About the Author
Introduction / 1:
Introduction to Sensors / 1.1:
What are Sensors? / 1.1.1:
The Nose as a Sensor / 1.1.2:
Sensors and Biosensors--Definitions / 1.2:
Aspects of Sensors / 1.3:
Recognition Elements / 1.3.1:
Transducers--the Detector Device / 1.3.2:
Methods of Immobilization / 1.3.3:
Performance Factors / 1.3.4:
Areas of Application / 1.3.5:
Transduction Elements / 2:
Electrochemical Transducers--Introduction / 2.1:
Potentiometry and Ion-Selective Electrodes: The Nernst Equation / 2.2:
Cells and Electrodes / 2.2.1:
Reference Electrodes / 2.2.2:
Quantitative Relationships: The Nernst Equation / 2.2.3:
Practical Aspects of Ion-Selective Electrodes / 2.2.4:
Measurement and Calibration / 2.2.5:
Voltammetry and Amperometry / 2.3:
Linear-Sweep Voltammetry / 2.3.1:
Cyclic Voltammetry / 2.3.2:
Chronoamperometry / 2.3.3:
Amperometry / 2.3.4:
Kinetic and Catalytic Effects / 2.3.5:
Conductivity / 2.4:
Field-Effect Transistors / 2.5:
Semiconductors--Introduction / 2.5.1:
Semiconductor--Solution Contact / 2.5.2:
Field-Effect Transistor / 2.5.3:
Modified Electrodes, Thin-Film Electrodes and Screen-Printed Electrodes / 2.6:
Thick-Film--Screen-Printed Electrodes / 2.6.1:
Microelectrodes / 2.6.2:
Thin-Film Electrodes / 2.6.3:
Photometric Sensors / 2.7:
Optical Techniques / 2.7.1:
Ultraviolet and Visible Absorption Spectroscopy / 2.7.3:
Fluorescence Spectroscopy / 2.7.4:
Luminescence / 2.7.5:
Optical Transducers / 2.7.6:
Device Construction / 2.7.7:
Solid-Phase Absorption Label Sensors / 2.7.8:
Applications / 2.7.9:
Further Reading
Sensing Elements / 3:
Ionic Recognition / 3.1:
Ion-Selective Electrodes--Introduction / 3.2.1:
Interferences / 3.2.2:
Conducting Devices / 3.2.3:
Modified Electrodes and Screen-Printed Electrodes / 3.2.4:
Molecular Recognition--Chemical Recognition Agents / 3.3:
Thermodynamic--Complex Formation / 3.3.1:
Kinetic--Catalytic Effects: Kinetic Selectivity / 3.3.2:
Molecular Size / 3.3.3:
Molecular Recognition--Spectroscopic Recognition / 3.4:
Infrared Spectroscopy--Molecular / 3.4.1:
Ultraviolet Spectroscopy--Less Selective / 3.4.3:
Nuclear Magnetic Resonance Spectroscopy--Needs Interpretation / 3.4.4:
Mass Spectrometry / 3.4.5:
Molecular Recognition--Biological Recognition Agents / 3.5:
Enzymes / 3.5.1:
Tissue Materials / 3.5.3:
Micro-Organisms / 3.5.4:
Mitochondria / 3.5.5:
Antibodies / 3.5.6:
Nucleic Acids / 3.5.7:
Receptors / 3.5.8:
Immobilization of Biological Components / 3.6:
Adsorption / 3.6.1:
Microencapsulation / 3.6.3:
Entrapment / 3.6.4:
Cross-Linking / 3.6.5:
Covalent Bonding / 3.6.6:
Selectivity / 4:
Ion-Selective Electrodes / 4.2.1:
Others / 4.2.2:
Sensitivity / 4.3:
Range, Linear Range and Detection Limits / 4.3.1:
Time Factors / 4.4:
Response Times / 4.4.1:
Recovery Times / 4.4.2:
Lifetimes / 4.4.3:
Precision, Accuracy and Repeatability / 4.5:
Different Biomaterials / 4.6:
Different Transducers / 4.7:
Urea Biosensors / 4.7.1:
Amino Acid Biosensors / 4.7.2:
Glucose Biosensors / 4.7.3:
Uric Acid / 4.7.4:
Some Factors Affecting the Performance of Sensors / 4.8:
Amount of Enzyme / 4.8.1:
Immobilization Method / 4.8.2:
pH of Buffer / 4.8.3:
Electrochemical Sensors and Biosensors / 5:
Potentiometric Sensors--Ion-Selective Electrodes / 5.1:
Concentrations and Activities / 5.1.1:
Calibration Graphs / 5.1.2:
Examples of Ion-Selective Electrodes / 5.1.3:
Gas Sensors--Gas-Sensing Electrodes / 5.1.4:
Potentiometric Biosensors / 5.2:
pH-Linked / 5.2.1:
Ammonia-Linked / 5.2.2:
Carbon Dioxide-Linked / 5.2.3:
Iodine-Selective / 5.2.4:
Silver Sulfide-Linked / 5.2.5:
Amperometric Sensors / 5.3:
Direct Electrolytic Methods / 5.3.1:
The Three Generations of Biosensors / 5.3.2:
First Generation--The Oxygen Electrode / 5.3.3:
Second Generation--Mediators / 5.3.4:
Third Generation--Directly Coupled Enzyme Electrodes / 5.3.5:
NADH/NAD[superscript +] / 5.3.6:
Examples of Amperometric Biosensors / 5.3.7:
Amperometric Gas Sensors / 5.3.8:
Conductometric Sensors and Biosensors / 5.4:
Chemiresistors / 5.4.1:
Biosensors Based on Chemiresistors / 5.4.2:
Semiconducting Oxide Sensors / 5.4.3:
Applications of Field-Effect Transistor Sensors / 5.5:
Chemically Sensitive Field-Effect Transistors (CHEMFETs) / 5.5.1:
Ion-Selective Field-Effect Transistors (ISFETs) / 5.5.2:
FET-Based Biosensors (ENFETs) / 5.5.3:
Photometric Applications / 6:
Techniques for Optical Sensors / 6.1:
Modes of Operation of Waveguides in Sensors / 6.1.1:
Immobilized Reagents / 6.1.2:
Visible Absorption Spectroscopy / 6.2:
Measurement of pH / 6.2.1:
Measurement of Carbon Dioxide / 6.2.2:
Measurement of Ammonia / 6.2.3:
Examples That Have Been Used in Biosensors / 6.2.4:
Fluorescent Reagents / 6.3:
Fluorescent Reagents for pH Measurements / 6.3.1:
Halides / 6.3.2:
Sodium / 6.3.3:
Potassium / 6.3.4:
Gas Sensors / 6.3.5:
Indirect Methods Using Competitive Binding / 6.4:
Reflectance Methods--Internal Reflectance Spectroscopy / 6.5:
Evanescent Waves / 6.5.1:
Reflectance Methods / 6.5.2:
Attenuated Total Reflectance / 6.5.3:
Total Internal Reflection Fluorescence / 6.5.4:
Surface Plasmon Resonance / 6.5.5:
Light Scattering Techniques / 6.6:
Types of Light Scattering / 6.6.1:
Quasi-Elastic Light Scattering Spectroscopy / 6.6.2:
Photon Correlation Spectroscopy / 6.6.3:
Laser Doppler Velocimetry / 6.6.4:
Mass-Sensitive and Thermal Sensors / 7:
The Piezo-Electric Effect / 7.1:
Principles / 7.1.1:
Gas Sensor Applications / 7.1.2:
Biosensor Applications / 7.1.3:
The Quartz Crystal Microbalance / 7.1.4:
Surface Acoustic Waves / 7.2:
Plate Wave Mode / 7.2.1:
Evanescent Wave Mode / 7.2.2:
Lamb Mode / 7.2.3:
Thickness Shear Mode / 7.2.4:
Thermal Sensors / 7.3:
Thermistors / 7.3.1:
Catalytic Gas Sensors / 7.3.2:
Thermal Conductivity Devices / 7.3.3:
Specific Applications / 8:
Determination of Glucose in Blood--Amperometric Biosensor / 8.1:
Survey of Biosensor Methods for the Determination of Glucose / 8.1.1:
Aim / 8.1.2:
Determination of Nanogram Levels of Copper(I) in Water Using Anodic Stripping Voltammetry, Employing an Electrode Modified with a Complexing Agent / 8.2:
Background to Stripping Voltammetry--Anodic and Cathodic / 8.2.1:
Determination of Several Ions Simultaneously--'The Laboratory on a Chip' / 8.2.2:
Sensor Arrays and 'Smart' Sensors / 8.3.1:
Background to Ion-Selective Field-Effect Transistors / 8.3.3:
Determination of Attomole Levels of a Trinitrotoluene--Antibody Complex with a Luminescent Transducer / 8.3.4:
Background to Immuno--Luminescent Assays / 8.4.1:
Determination of Flavanols in Beers / 8.4.2:
Background / 8.5.1:
Responses to Self-Assessment Questions / 8.5.2:
Bibliography
Glossary of Terms
SI Units and Physical Constants
Periodic Table
Index
Series Preface
Preface
Acronyms, Abbreviations and Symbols
8.

電子ブック

EB
Chen, Zhi Ning Chen
出版情報: Wiley Online Library - AutoHoldings Books , Chichester : John Wiley & Sons, Inc., 2007
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Foreword
Acknowledgements
List of Contributors
Introduction / Zhi Ning Chen1:
References
Handset Antennas / Brian S. Collins2:
Performance Requirements / 2.1:
Electrically Small Antennas / 2.3:
Classes of Handset Antennas / 2.4:
The Quest for Efficiency and Extended Bandwidth / 2.5:
Handset Geometries / 2.5.1:
Antenna Position in the Handset / 2.5.2:
The Effect of the User / 2.5.3:
Antenna Volume / 2.5.4:
Impedance Behavior of a Typical Antenna in the Low Band / 2.5.5:
Fields and Currents on Handsets / 2.5.6:
Managing the Length-Bandwidth Relationship / 2.5.7:
The Effect on RF Efficiency of Other Components of the Handset / 2.5.8:
Specific Absorption Rate / 2.5.9:
Hearing Aid Compliance / 2.5.10:
Economic Considerations / 2.5.11:
Practical Design / 2.6:
Simulations / 2.6.1:
Materials and Construction / 2.6.2:
Recycling / 2.6.3:
Building the Prototype / 2.6.4:
Measurement / 2.6.5:
Design Optimization / 2.6.6:
Starting Points for Design and Optimization / 2.7:
External Antennas / 2.7.1:
Balanced Antennas / 2.7.2:
Antennas for Other Services / 2.7.3:
Dual-Antenna Interference Cancellation / 2.7.4:
Multiple Input, Multiple Output / 2.7.5:
Antennas for Lower-Frequency Bands - TV and Radio Services / 2.7.6:
The RF Performance of Typical Handsets / 2.8:
Conclusion / 2.9:
RFID Tag Antennas / Xianming Qing3:
RFID Fundamentals / 3.1:
RFID System Configuration / 3.2.1:
Classification of RFID Systems / 3.2.2:
Principles of Operation / 3.2.3:
Frequencies, Regulations and Standardization / 3.2.4:
Design Considerations for RFID Tag Antennas / 3.3:
Near-field RFID Tag Antennas / 3.3.1:
Far-field RFID Tag Antennas / 3.3.2:
Effect of Environment on RFID Tag Antennas / 3.4:
Near-field Tags / 3.4.1:
Far-field Tags / 3.4.2:
Case Study / 3.4.3:
Summary / 3.5:
Laptop Antenna Design and Evaluation / Duixian Liu ; Brian Gaucher4:
Laptop-Related Antenna Issues / 4.1:
Typical Laptop Display Construction / 4.2.1:
Possible Antennas for Laptop Applications / 4.2.2:
Mechanical and Industrial Design Restrictions / 4.2.3:
LCD Surface Treatment in Simulations / 4.2.4:
Antenna Orientation in Display / 4.2.5:
The Difference between Laptop and Cellphone Antennas / 4.2.6:
Antenna Location Evaluations / 4.2.7:
Antenna Design Methodology / 4.3:
Modeling / 4.3.1:
Cut-and-Try / 4.3.2:
Measurements / 4.3.3:
PC Card Antenna Performance and Evaluation / 4.4:
Link Budget Model / 4.5:
An INF Antenna Implementation / 4.6:
Integrated and PC Card Solutions Comparison / 4.7:
Dualband Examples / 4.8:
An Inverted-F Antenna with Coupled Elements / 4.8.1:
A Dualband PCB Antenna with Coupled Floating Elements / 4.8.2:
A Loop Related Dualband Antenna / 4.8.3:
Remarks on WLAN Antenna Design and Evaluations / 4.9:
Antennas for Wireless Wide Area Network Applications / 4.10:
INF Antenna Height Effects on Bandwidth / 4.10.1:
A WWAN Dualband Example / 4.10.2:
Ultra-Wide Band Antennas / 4.11:
Description of the UWB Antenna / 4.11.1:
UWB Antenna Measurement Results / 4.11.2:
Antenna Issues in Microwave Thermal Therapies / Koichi Ito ; Kazuyuki Saito5:
Microwave Thermal Therapies / 5.1:
Classification by Therapeutic Temperature / 5.1.1:
Heating Schemes / 5.1.3:
Interstitial Microwave Hyperthermia / 5.2:
Introduction and Requirements / 5.2.1:
Coaxial-Slot Antenna / 5.2.2:
Numerical Calculation / 5.2.3:
Performance of the Coaxial-Slot Antenna / 5.2.4:
Temperature Distributions Around the Antennas / 5.2.5:
Clinical Trials / 5.3:
Equipment / 5.3.1:
Treatment by Use of a Single Antenna / 5.3.2:
Treatment by Use of an Array Applicator / 5.3.3:
Results of the Treatment / 5.3.4:
Other Applications / 5.4:
Treatment of Brain Tumors / 5.4.1:
Intracavitary Microwave Hyperthermia for Bile Duct Carcinoma / 5.4.2:
Antennas for Wearable Devices / Akram Alomainy ; Yang Hao ; Frank Pasveer5.5:
Wireless Body Area Networks / 6.1:
Antenna Design Requirements for Wireless BAN/PAN / 6.1.2:
Modelling and Characterization of Wearable Antennas / 6.2:
Wearable Antennas for BANs/PANs / 6.2.1:
UWB Wearable Antennas / 6.2.2:
WBAN Radio Channel Characterization and Effect of Wearable Antennas / 6.3:
Radio Propagation Measurement for WBANs / 6.3.1:
Propagation Channel Characteristics / 6.3.2:
Case Study: A Compact Wearable Antenna for Healthcare Sensors / 6.4:
Application Requirements / 6.4.1:
Theoretical Antenna Considerations / 6.4.2:
Sensor Antenna Modelling and Characterization / 6.4.3:
Propagation Channel Characterization / 6.4.4:
Antennas for UWB Applications / Terence S.P. See6.5:
UWB Wireless Systems / 7.1:
Challenges in UWB Antenna Design / 7.2:
State-of-the-Art Solutions / 7.3:
Frequency-Independent Designs / 7.3.1:
Planar Broadband Designs / 7.3.2:
Crossed and Rolled Planar Broadband Designs / 7.3.3:
Planar Printed PCB Designs / 7.3.4:
Planar Antipodal Vivaldi Designs / 7.3.5:
Small Printed Antenna with Reduced Ground-Plane Effect / 7.4:
Wireless USB / 7.4.2:
Index / 7.5:
Foreword
Acknowledgements
List of Contributors
9.

電子ブック

EB
Kirianaki, Nikolay V. Kirianaki
出版情報: Wiley Online Library - AutoHoldings Books , John Wiley & Sons, Inc., 2002
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Preface
List of Abbreviations and Symbols
Introduction
Smart Sensors for Electrical and Non-Electrical, Physical and Chemical Variables: Tendencies and Perspectives / 1:
Temperature IC and Smart Sensors / 1.1:
Pressure IC and Smart Sensors and Accelerometers / 1.2:
Rotation Speed Sensors / 1.3:
Intelligent Opto Sensors / 1.4:
Humidity Frequency Output Sensors / 1.5:
Chemical and Gas Smart Sensors / 1.6:
Summary
Converters for Different Variables to Frequency-Time Parameters of the Electric Signal / 2:
Voltage-to-Frequency Converters (VFCs) / 2.1:
Capacitance-to-Period (or Duty-Cycle) Converters / 2.2:
Data Acquisition Methods for Multichannel Sensor Systems / 3:
Data Acquisition Method with Time-Division Channelling / 3.1:
Data Acquisition Method with Space-Division Channelling / 3.2:
Smart Sensor Architectures and Data Acquisition / 3.3:
Main Errors of Multichannel Data-Acquisition Systems / 3.4:
Data Transmission and Error Protection / 3.5:
Essence of quasi-ternary coding / 3.5.1:
Coding algorithm and examples / 3.5.2:
Quasi-ternary code decoding / 3.5.3:
Methods of Frequency-to-Code Conversion / 4:
Standard Direct Counting Method (Frequency Measurement) / 4.1:
Indirect Counting Method (Period Measurement) / 4.2:
Combined Counting Method / 4.3:
Method for Frequency-to-Code Conversion Based on Discrete Fourier Transformation / 4.4:
Methods for Phase-Shift-to-Code Conversion / 4.5:
Advanced and Self-Adapting Methods of Frequency-to-Code Conversion / 5:
Ratiometric Counting Method / 5.1:
Reciprocal Counting Method / 5.2:
M/T Counting Method / 5.3:
Constant Elapsed Time (CET) Method / 5.4:
Single- and Double-Buffered Methods / 5.5:
DMA Transfer Method / 5.6:
Method of Dependent Count / 5.7:
Method of conversion for absolute values / 5.7.1:
Methods of conversion for relative values / 5.7.2:
Methods of conversion for frequency deviation / 5.7.3:
Universal method of dependent count / 5.7.4:
Example of realization / 5.7.5:
Metrological characteristics and capabilities / 5.7.6:
Absolute quantization error [Delta subscript q] / 5.7.7:
Relative quantization error [delta subscript q] / 5.7.8:
Dynamic range / 5.7.9:
Accuracy of frequency-to-code converters based on MDC / 5.7.10:
Calculation error / 5.7.11:
Quantization error (error of method) / 5.7.12:
Reference frequency error / 5.7.13:
Trigger error / 5.7.14:
Simulation results / 5.7.15:
Examples / 5.7.16:
Method with Non-Redundant Reference Frequency / 5.8:
Comparison of Methods / 5.9:
Advanced Method for Phase-Shift-to-Code Conversion / 5.10:
Signal Processing in Quasi-Digital Smart Sensors / 6:
Main Operations in Signal Processing / 6.1:
Adding and subtraction / 6.1.1:
Multiplication and division / 6.1.2:
Frequency signal unification / 6.1.3:
Derivation and integration / 6.1.4:
Weight Functions, Reducing Quantization Error / 6.2:
Digital Output Smart Sensors with Software-Controlled Performances and Functional Capabilities / 7:
Program-Oriented Conversion Methods Based on Ratiometric Counting Technique / 7.1:
Design Methodology for Program-Oriented Conversion Methods / 7.2:
Example / 7.2.1:
Adaptive PCM with Increased Speed / 7.3:
Error Analysis of PCM / 7.4:
Reference error / 7.4.1:
Error of T[subscript 02] forming / 7.4.2:
Correction of PCM's Systematic Errors / 7.5:
Modified Method of Algorithm Merging for PCMs / 7.6:
Multichannel Intelligent and Virtual Sensor Systems / 8:
One-Channel Sensor Interfacing / 8.1:
Multichannel Sensor Interfacing / 8.2:
Smart rotation speed sensor / 8.2.1:
Encoder / 8.2.2:
Self-adaptive method for rotation speed measurements / 8.2.3:
Sensor interfacing / 8.2.4:
Multichannel Adaptive Sensor System with Space-Division Channelling / 8.3:
Multichannel Sensor Systems with Time-Division Channelling / 8.4:
Multiparameters Sensors / 8.5:
Virtual Instrumentation for Smart Sensors / 8.6:
Set of the basic models for measuring instruments / 8.6.1:
Estimation of Uncertainty for Virtual Instruments / 8.7:
Smart Sensor Design at Software Level / 9:
Microcontroller Core for Smart Sensors / 9.1:
Low-Power Design Technique for Embedded Microcontrollers / 9.2:
Instruction selection and ordering / 9.2.1:
Code size and speed optimizations / 9.2.2:
Jump and call optimizations / 9.2.3:
Cycle optimization / 9.2.4:
Minimizing memory access cost / 9.2.5:
Exploiting low-power features of the hardware / 9.2.6:
Compiler optimization for low power / 9.2.7:
Smart Sensor Buses and Interface Circuits / 10:
Sensor Buses and Network Protocols / 10.1:
Sensor Interface Circuits / 10.2:
Universal transducer interface (UTI) / 10.2.1:
Time-to-digital converter (TDC) / 10.2.2:
Future Directions
References
What is on the Sensors Web Portal? / Appendix A:
Glossary
Index
Preface
List of Abbreviations and Symbols
Introduction
10.

電子ブック

EB
Inigo Gutierrez, Erik Hernandez, Juan Melendez
出版情報: Wiley Online Library - AutoHoldings Books , Chichester : John Wiley & Sons, Inc., 2007
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List of Figures
List of Tables
Preface
Acknowledgements
Introduction / Chapter 1:
PN-junction Varactors / Chapter 2:
MOS Varactors / Chapter 3:
Measurement Techniques for Integrated Varactors / Chapter 4:
Modeling Varactors / Chapter 5:
Design Rules for Integrated Varactors / Chapter 6:
Design of a Demonstrator: Integrated VCO / Chapter 7:
Geometric Characteristics of Varactors / Appendix 1:
Validation of the Predictions Provided by Equations of Chapter 5 / Appendix 2:
Measurement of Oscillatora??s Performance / Appendix 3:
Glossary
Index
List of Figures
List of Tables
Preface
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