| KEYNOTE LECTURES |
| The Story Behind the Red Phosphorus Mold Compound Device Failures / prof.Michael Pecht,University of Maryland,USA 1 |
| Semiconductor Integrated Circuit Packaging Technology Challenges-Next Five Years / Dr. Mario A. Bolanos, Texas Instruments Inc., USA 6 |
| Gbps Signal Transmission on Si CMOS ULSI / Prof.Kazuya Masu, Tokyo Institute of Technology,Japan 10 |
| A Study of Hygro-Thermal Deformations and Stresses in FCPBGA / Prof.Sung Yi, Portland State University,USA 15 |
| GENERAL SESSIONS |
| Quality ＆ Reliability(1) |
| Development of an Automated X-Ray Inspection Method for Microsolder Bumps / Atsushi Teramoto (Nagoya Electric Works Co., Ltd.),Takayuki Murakoshi, Masatoshi Tsuzaka (Nagoya University) and Hiroshi Fujita (Gifu University) 21 |
| Reliability Assessment of BGA Solder Joints under Cyclic Bending Loads / Ilho Kim(KAIST, Korea) and Soon-Bok Lee 27 |
| Case Studies of Reliability Analysis by Stochastic Methodology in BGA Creep Analysis / Shoji Sasaki(MSV,Software Ltd.) Motoharu Tateishi, Isamu Ishikawa and Paul Vanderwalt(MSC.Software Corporation,USA) 33 |
| Fatigue Crack Propagation Analysis for Micro Solder Joints with Void / Takeshi Terasaki(Hitachi,Ltd) and Hisashi Tanie 37 |
| Quality ＆Reliability(2) |
| Reliability Analysis of Embedded Chip Technique with Design of Experiment Methods / Xiuzhen Lu(Shanghai University,China), Liu Chen(Chalmers University of Technology,Sweden) Zhaonian Cheng and Johan Liu(Shanghai University,China/Chaimers University of Technology,Sweden) 43 |
| A Role of Ti-Sn Diffusion Layer Formed at the Interface between Pb Free Solder and TiNiAu Multi-Layer / Kimiharu Kayukawa(Denso Corporation) and Akira Tanahashi 50 |
| In Situ Observation of Interfacial Fracture in Low-Dimensional Nano Structures / Yoshimasa Takahashi(Kyoto University),Hiroyuki Hirakata and Takayuki Kitamura 55 |
| Effect of Frequency of Fatigue Crace Growth along Interface between Copper Film and Silicon Substrate / Do Van Truong(Kyoto University),Hiroyuki Hirakata and Takayuki Kitamura 61 |
| Quality ＆ Reliability(3) |
| Effect of Lead and Cadmium Free Glasses on Reliability of the Siver End Termination for MLCC Application / Masyood Akhtar(LORD Corporation,USA) 67 |
| The Study of Silicon Die Stress In Stacked Die Packages / Eiichi Yamada(Texas Instruments Japan Limited),Kenji Abe,Yutaka Suzuki and Masazumi Amagai 74 |
| A Multifunctional Test Chip for Microelectronic Packaging and Its Application on RF Property Measurements / Kun-Fu Tseng(Chin-Min Institute of Technology,Taiwan),Yi-Hsun Hsion,Ben-Je Lwo and Chin-Hsing Kao(National Defense University,Taiwan) 78 |
| Strain Measurement in the Microstructure of Advanced Electronic Packages Using Digital Image Correlation / Nobuyuki Shishido(Kyoto University),Toru Ikeda and Noriyuki Miyazaki 83 |
| Effect of Au and Ni Layer Thicknesses on the Reliability of BGA Solder Joints / M.O.Alam(City University of Hong Kong,Hong Kong), Y.C.Chan and L.Rufer(TIMA Lab,France) 88 |
| Interconnection Technologies Studies on Double-Layered Metal Bumps for Fine Pitch Flip Chip Applications / Ho-Young Son(KAIST,Korea),Yong-Woon Yeo(Nepes Corperation,Korea), Gi-Jo Jung,Jun-Kyu Lee,Joon-Young Choi,Chang-Joon Park(Hynix Semiconductor,Korea), Min-Suk Suh, Soon-Jin Cho(Samsung Electro-Mechanics,Korea),and Kyung-Wook Paik(KAIST,Korea) 95 |
| Dynamic Characterization Study of Flip Chip Ball Grid Array(FCBGA) on Periphearl Component Interconnect(PCI) Board Application / Wong Shaw Fong(Intel Technology,Malaysia), Loh Wei Keat, Lee Yung Hsiang, Yap Eng Hooi(Intel Product,Malaysia),Wong Siang Woen,Hin Tze Yang(Intel Technology,Malaysia) and Martin Tay Tiong We 101 |
| Stability of Ni3p and Its Effect on the Interfacial Reaction between Electroless Ni-P and Molten Tin / K.Chen(Loughborough University,UK),C.Liu, D.C. Whalley and D.A. Hutt 107 |
| Investigation of void-free Electroplating Method on Copper Column based Solder Bump for Flip-Chip Interconnections / Hiroshi Yamada(Toshiba Corporation) 112 |
| Optoelectronics/Photonics |
| Characterization of Au-Sn Eutectic Die Attach Process for Optoelectronics Device / Thang Tak-Seng(Lumileds Lighting(M)Sdn Bhd,Malaysia),Decai Sun,Huck-Khim Koay, Mohd-Fezley Sabudin,Jim Thompson,Paul Martin, Pradeep Rajkomar and Shatil Haque 118 |
| Propagation Loss Evaluation of Optical Transmission/Interconnect System with Grating Structure / Akiya Kimura(Osaka University),Kiyokazu Yasuda,Michiya Matsushima and Kozo Fujimoto 125 |
| A New Method of Birefringence Measurement to Obtain Stress Field Using Photoclasticity / Kenji Gomi(Tokyo Denki University),Kengo Shimizu,Hayato Suzuki, Shinichi Gohira,Yasushi Niitsu and Kensuke Ichinose 129 |
| Optimization of Epoxy Flow for Passive Alignment of Optical Fiber Arrays / Jeffery C.C.Lo(Hong Kong University of Science ＆ Technology,Hong kong), Chung Yeung Li, Chung Leung Tai and S.W.Ricky Lee 132 |
| Polymer Materials |
| Study on Long Life Large-Deflective Hinges in Molded Pantograph Mechanisms based on Cyclic Load-Bending Fatigue Test / Mikio Horie(Tokyo Institute of Technology), Yudai Okabe, Masahiro Yamamoto and Daiki Kamiya 137 |
| Warpages of ACF-bonded COG Packages Induced from Manufacturing and Thermal Cycling / M.Y.Tsai(Chang Gung University,Taiwan), C.Y.Huang,C.Y.Chiang, W.C.Chen(ERSO/ITRI,Taiwan) and S.S. Yang 143 |
| Simulation of Tensile Deformation Behavior of Polymer by Chain Network Model / Akira Shinozaki(Tokyo Institute of Technology),Kikuo Kishimoto and Hirotsugu Inoue 150 |
| Effects of the Functional Groups of Non-Conductive Films(NCFs) on Materials Properties and Reliability of NCF Flip-Chip-On-Organic Boards / Chany-kyu Chung(KAIST,Korer),Woon-Seong Kwon,Jin-Hyoung Park, Soon-Bok Lee and Kyung-Wook Paik 156 |
| Effects of Low-modulus Die Attach Adhesive on Warpage and Damage of BGA / Sung Yi(Portland State University,USA), Paresh D.Daharwal(Intel Corporation,USA), Yeong.J.Lee(Motorola,USA)and Brian R.Harkness(Dow Corning,USA) 162 |
| Thick ＆ Thin Film Materials |
| Hardness and Elastic Modulus of ZnO Deposited materials by PLD Method / Han-Ki Yoon(Dong-Eui University,Korea) and Yun-Sik Yu 169 |
| Mechanical properties of ITO/PET Thin Film Deposited by DC MG Method / Do-Hyoung Kim(Dong-Eui University,Korea),Han-ki Yoon, Do-Hoon Shin(University of Tokushima) and Riichi Murakami 174 |
| Formation and Characterization of Sputtered Thin Film for Optimizing Multilayered Interconnection Structure / Wataru Sashida(Kogakuin University) and Yuji Kimura 179 |
| Packaging(1) |
| Development of The Embedded LST Technology in PALAP / H.Kamiya(DENSO Corportion),T.Miyake, H.Kobasyashi, and K,Kondo 183 |
| Wafer-Scale BCB Resist-Processing Technologies for High density Intergration and Electronic Packaging / Rainer Pelzer(EV Group,Austria),Viorel Dragoi,Bart Swinnen(IMEC,Belgium),Philippe Soussan and Thorsten Matthias(EV Group,Austria) 187 |
| Microscale Magnetic Components for the Application of DC-DC Converters Operating in the 1-10 MHz Range / David Flynn(Heriot-Watt University,UK),Anthony Toon and Marc Desmulliez 192 |
| Low-Cost Active-Allignment of Single-Mode Fiber-Arrays / D. Weiland(Heriot Watt Universtity,UK), M.Luetzelschwab, M.P.Y.Desmulliez, A.Missoffe and C.Beck(TWI Ltd,UK) 199 |
| SAW Chemical Sensors based on AlGan/GaN Piezoelectric Material System: Acoustic Design and Packaging Considerations / L.Rufer(TIMA Lab,France), A.Torres, S.Mir, M.O.Alam(City University of Hong Kong, Hong Kong),T.Lalinsky(Slovak Academy of Sciences, Slovak Republic) and Y.C.Chan(City University of Hong Kong,Hong Kong) 204 |
| Packaging(2) |
| Evaluation of Thermal Deformation Behavior in Electronic Package using UV Moire Interferometry / Jin-Hyoung Park(KAIST,Korea)and Soon-Bok Lee 209 |
| Evaluation of Fatigue Strength for Solder Joints after Thermal Aging / Takeshi Miyazaki(Tokyo Institute of Technology), Masaki Omiya,Hirotsugu Inoue, Kikuo Kishimoto and Masazumi Amagai(Texas Instruments) 215 |
| Local Thermal Deformation and Residual Stress of a Thin Si Chip Mounted on a Substrate Using An Area-Arrayed Flip Chip Structure / Hideo Miura(Tohoku University),Nobuki Ueta and Yuhki Sato 220 |
| The Novel Flip Chip Ball Grid Array Design and Challenges to Enable Higher Routing Density and Power Requirement / Chee Wai Wong(Intel Technology,Malaysia),Chee Kheong Yoon and Seng Hooi Ong 226 |
| Fatigue Crack Growth in Lead-free Solder Joints / Masaki Omiya(Tokyo Institute of Technology), Kikuo Kishimoto and Masazumi Amagai(Texas Instrument) 232 |
| Modeling ＆ Simulation(1) |
| A Study of Hot Spot in Silicon Device for Stacked Die Packages / Jotaro Akiyama(Texas Instruments Japan Limited),Masanobu Naeshiro and Masazumi Amagagai 238 |
| Modeling the Lamination Process for Ruggedised Displays / Yek Bing Lee(University of Greenwich, UK), Chris Bailey, Hua lu, Steve Riches,Martin Bartholomew and Nigel Tebbit 243 |
| Modeling and Simulation of a Fluid-driven Microturbine / Chanwut Sriphung(Heriot-Watt University,UK) and Resh Dhariwal 247 |
| Modeling ＆ Simulation(2) |
| Stress Intensity Factors of Interface Corners / Chyanbin Hwu(National Cheng Kung University,Taiwan) and T.L.Kuo 252 |
| The Impact of Capacitors Selection and Placement to the ESL and ESR / Huang Jimmy Huat Since(Intel Microelectronic,Malaysia), Sijher Taninder S and Beh Jiun Kai 258 |
| Evaluation of Drop Impact Load for Portable Electronic Components / Takahiro Omori(Toshiba Corporation), Hirotsugu Inoue(Tokyo Institute of Technology), Noriyasu Kawamura(Toshiba Corporation), Minoru Mukai,Kikuo Kishimoto(Tokyo Institute of Technology) and Takashi Kawakami(Toshiba Corporation) 262 |
| Nonlinear Dynamic Behavior of Thin PCB Board for Solder Joint Reliability Study under Shock Loading / Loh Wei Keat(Intel Technology,Malaysia), Lee Yung Hsiang. Ajay A/I Murugayah and Tay,Tiong We 268 |
| Thermal Management |
| Turbulence Modelling for Electronic Cooling: A Review / K.Dhinsa(University of Greenwich,UK), C.Bailey and K.Pericleous 275 |
| Heat Conduction in Composites of Thermally Dissimilar Materials-A Methodology to Economize Numerical Heat Transfer Analysis of Electronic Components / Wataru Nakayama(ThermTech International) 282 |
| Critical Appraisal of Thermo-Mechanical Reliability of Medium-Power Heterojunction Bipolar Transistors for Base Station and Military Applications Mounted in SOIC-8 Leadframe Based Plastic Overmold Packages with Conductive Silver Epoxy / Satbir Madra(WJ Communications,Inc,USA) 288 |
| A Study in Establishing Flip-Chip Ball Grid Array(FCBGA) Second Level Interconnect(SLI)Reliability Requirement by CFD Simulation / Lee Eng Kwong(Intel Technology, Malaysia) and Tan wool Aun 292 |
| Electro-Themal Analysis of Device Interactions in Si CMOS Structure / Tomoyuki Hatakeyama(Tokyo institute of Technology), Kazuyoshi Fushinobu and Ken 296 |
| KEYNOTE LECTURES |
| The Story Behind the Red Phosphorus Mold Compound Device Failures / prof.Michael Pecht,University of Maryland,USA 1 |
| Semiconductor Integrated Circuit Packaging Technology Challenges-Next Five Years / Dr. Mario A. Bolanos, Texas Instruments Inc., USA 6 |
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図書
図書
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