Preface to Third Edition |
Resistivity / 1: |
Introduction / 1.1: |
Two-Point Versus Four-Point Probe / 1.2: |
Wafer Mapping / 1.3: |
Resistivity Profiling / 1.4: |
Contactless Methods / 1.5: |
Conductivity Type / 1.6: |
Strengths and Weaknesses / 1.7: |
Resistivity as a Function of Doping Density / Appendix 1.1: |
Intrinsic Carrier Density / Appendix 1.2: |
References |
Problems |
Review Questions |
Carrier and Doping Density / 2: |
Capacitance-Voltage (C-V) / 2.1: |
Current-Voltage (I-V) / 2.3: |
Measurement Errors and Precautions / 2.4: |
Hall Effect / 2.5: |
Optical Techniques / 2.6: |
Secondary Ion Mass Spectrometry (SIMS) / 2.7: |
Rutherford Backscattering (RBS) / 2.8: |
Lateral Profiling / 2.9: |
Parallel or Series Connection? / 2.10: |
Circuit Conversion / Appendix 2.2: |
Contact Resistance and Schottky Barriers / 3: |
Metal-Semiconductor Contacts / 3.1: |
Contact Resistance / 3.3: |
Measurement Techniques / 3.4: |
Schottky Barrier Height / 3.5: |
Comparison of Methods / 3.6: |
Effect of Parasitic Resistance / 3.7: |
Alloys for Contacts to Semiconductors / Appendix 3.2: |
Series Resistance, Channel Length and Width, and Threshold Voltage / 4: |
PN Junction Diodes / 4.1: |
Schottky Barrier Diodes / 4.3: |
Solar Cells / 4.4: |
Bipolar Junction Transistors / 4.5: |
MOSFETS / 4.6: |
MESFETS and MODFETS / 4.7: |
Threshold Voltage / 4.8: |
Pseudo MOSFET / 4.9: |
Schottky Diode Current-Voltage Equation / 4.10: |
Defects / 5: |
Generation-Recombination Statistics / 5.1: |
Capacitance Measurements / 5.3: |
Current Measurements / 5.4: |
Charge Measurements / 5.5: |
Deep-Level Transient Spectroscopy (DLTS) / 5.6: |
Thermally Stimulated Capacitance and Current / 5.7: |
Positron Annihilation Spectroscopy (PAS) / 5.8: |
Activation Energy and Capture Cross-Section / 5.9: |
Time Constant Extraction / Appendix 5.2: |
Si and GaAs Data / Appendix 5.3: |
Oxide and Interface Trapped Charges, Oxide Thickness / 6: |
Fixed, Oxide Trapped, and Mobile Oxide Charge / 6.1: |
Interface Trapped Charge / 6.3: |
Oxide Thickness / 6.4: |
Capacitance Measurement Techniques / 6.5: |
Effect of Chuck Capacitance and Leakage Current / Appendix 6.2: |
Carrier Lifetimes / 7: |
Recombination Lifetime/Surface Recombination Velocity / 7.1: |
Generation Lifetime/Surface Generation Velocity / 7.3: |
Recombination Lifetime-Optical Measurements / 7.4: |
Recombination Lifetime-Electrical Measurements / 7.5: |
Generation Lifetime-Electrical Measurements / 7.6: |
Optical Excitation / 7.7: |
Electrical Excitation / Appendix 7.2: |
Mobility / 8: |
Conductivity Mobility / 8.1: |
Hall Effect and Mobility / 8.3: |
Magnetoresistance Mobility / 8.4: |
Time-of-Flight Drift Mobility / 8.5: |
MOSFET Mobility / 8.6: |
Contactless Mobility / 8.7: |
Semiconductor Bulk Mobilities / 8.8: |
Semiconductor Surface Mobilities / Appendix 8.2: |
Effect of Channel Frequency Response / Appendix 8.3: |
Effect of Interface Trapped Charge / Appendix 8.4: |
Charge-based and Probe Characterization / 9: |
Background / 9.1: |
Surface Charging / 9.3: |
The Kelvin Probe / 9.4: |
Applications / 9.5: |
Scanning Probe Microscopy (SPM / 9.6: |
Optical Characterization / 9.7: |
Optical Microscopy / 10.1: |
Ellipsometry / 10.3: |
Transmission / 10.4: |
Reflection / 10.5: |
Light Scattering / 10.6: |
Modulation Spectroscopy / 10.7: |
Line Width / 10.8: |
Photoluminescence (PL / 10.9: |
Raman Spectroscopy / 10.10: |
Transmission Equations / 10.11: |
Absorption Coefficients and Refractive Indices for SelectedSemiconductors / Appendix 10.2: |
Chemical and Physical Characterization / 11: |
Electron Beam Techniques / 11.1: |
Ion Beam Techniques / 11.3: |
X-Ray and Gamma-Ray Techniques / 11.4: |
Selected Features of Some Analytical Techniques / 11.5: |
Reliability and Failure Analysis / 12: |
Failure Times and Acceleration Factors / 12.1: |
Distribution Functions / 12.3: |
Reliability Concerns / 12.4: |
Failure Analysis Characterization Techniques / 12.5: |
Gate Currents / 12.6: |
List of Symbols / Appendix 1: |
Abbreviations and Acronyms / Appendix 2: |
Index |