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1.

図書

図書
editors, P. C. Andricacos ...[et al.] ; sponsoring divisions, Electrodeposition, Dielectric Science and Technology, Electronics
出版情報: Pennington, N.J. : Electrochemical Society, c2002  viii, 258 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2000-8
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2.

図書

図書
editors, M.T. Swihart, M.D. Allendorf, M. Meyyappan
出版情報: Pennington, N.J. : Electrochemical Society, c2001  ix, 508 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-13
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3.

図書

図書
editors, M. Cahay ...[et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  ix, 398 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-19
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4.

図書

図書
editor, G.S. Mathad ; assistant editors, M. Engelhardt ...[et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  viii, 216 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-24
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5.

図書

図書
editors, M.J. Deen, D. Misra, J. Ruzyllo ; sponsoring divisions, Electronics, Dielectric Science and Technology
出版情報: Pennington, N.J. : Electrochemical Society, c2002  viii, 436 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-28
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6.

図書

図書
editors, Mark J. Lododa, R. Singh, Simon S. Ang, Hazara S. Rathore ; [sponsord by] Dielectric Science and Technology, Electronics, and High Temperature Materials Divisions [of the Electrochemical Society]
出版情報: Pennington, N.J. : Electrochemical Society, c2000  viii, 244 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; Pv. 2000-5
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7.

図書

図書
editors, Mark D. Allendorf, Michael L. Hitchman
出版情報: Pennington, N.J. : Electrochemical Society, c2000  xi, 810 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2000-13
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目次情報: 続きを見る
Fundamental Chemistry and Mechanisms
Atomistic Modeling of Chemical Vapor Deposition: NO on the Si (001) (2x1) Reconstructed Surface / N. Tanpipat ; J. Andzelm ; B. Delley ; A. Korkin ; A. Demkov
Simulation of Surface Diffusion of Silicon and Hydrogen on Single Crystal Silicon Surfaces / S. Somasi ; B. Khomami ; R. Lovett
Activation Energy Study for the Nucleation and Growth Stages of Cu(TMVS)(HFAC) Sourced Copper CVD / D. Yang ; J. Hong ; D. Richards ; T. Cale
Development of Gas Phase and Surface Kinetic Schemes for the MOCVD of CdTe, ZnS and ZnSe / C. Cavallotti ; V. Bertani ; M. Masi ; S. Carra
Determination of Energy Transfer Effects for Molecular Decomposition / W. Tsang ; V. Mokrushin
Gas-Phase Chemistry in the CVD of Silicon Carbide: Theoretical Study of the Reactions SiH[subscript 2]+CH[subscript 4], SiH[subscript 2]+C[subscript 2]H[subscript 4], and SiH[subscript 2]+C[subscript 2]H[subscript 2] / C. Raffy ; M.D. Allendorf ; E. Blanquet ; C.F. Melius
SiH[subscript 4] Reaction Mechanism Research Using a Fast Wafer-Rotating Reactor / Y. Sato ; N. T. Tamaoki ; T. Ohmine
Modeling Particle Nucleation during Thermal CVD of Silicon from Silane using Kinetic Monte Carlo Simulation / X. Li ; M. Swihart
Measurement of the Kinetics of the High Temperature Oxidation of TiCl[subscript 4] / R. Raghavan ; D. Lee ; D. Conrad ; P. Morrison, Jr.
Influence of Carbon Precursor on the Gas-Phase Chemistry of the Ti-C-Cl-H System / S. de Persis ; F. Teyssandier ; A. McDaniel
Molecular Beam Mass Spectrometry Studies of the Thermal Decomposition of Tetrakis(Dimethylamino)Titanium / C.C. Amato-Wierda ; E.T. Norton, Jr.
Kinetic and Mechanistic Studies of the Chemical Vapor Deposition of Ti-Si-N Thin Films with Ti(NMe[subscript 2])[subscript 4](TDMAT), NH[subscript 3], and Si H[subscript 4] / E.T. Norton ; C. Amato-Wierda
Evaluation of Gas Phase Reaction Rate Constant by Deposition Profile Analysis for In Situ Counter Diffusion CVD / Y. Egashira ; H. Tanaka ; T. Mina ; N. Mori ; K. Ueyama
Integration of a Quadrupole Mass Spectrometer and a Quartz Crystal Microbalance for In Situ Characterization of Atomic Layer Deposition Processes in Flow Type Reactors / A. Rahtu ; M. Ritala
Nanostructures and Quantum Dots
Nanostructures by CVD Assisted Methods Using Inorganic Precursors / P. Doppelt ; R. Even ; F. Marchi ; V. Bouchiat ; H. Dallaporta ; S. Safarov ; D. Tonneau ; P. Hoffmann ; F. Cicoira ; I. Utke ; B. Dwir ; K. Leifer ; E. Kapon
Effect of Carbon Predeposition Nucleation of Quantum Dots / Q. Zhao ; D. Greve
Plasma-Enhanced MOCVD of Smooth Nanometersized Metal/Silicon Single- and Multilayerfilms / F. Hamelmann ; G. Haindl ; A. Aschentrup ; A. Klipp ; U. Kleineberg ; P. Jutzi ; U. Heinzmann
Modeling, Reactor Design, and Process Control
Multicomponent Transport and Mixed Convection Flows in CVD Reactors / A. Ern
A Benchmark Solution for Multi-Dimensional Thermal CVD Modeling with Detailed Chemistry / C.R. Kleijn
On the Occurrence of Non-Symmetric Flows in Axisymmetric CVD Reactors / H. van Santen ; H.E.A. van den Akker
The Dynamics of Thin Film Growth: A Modeling Study / M. Gallivan ; R. Murray ; D. Goodwin
Improvement of Temperature Uniformity in Rapid Thermal CVD Systems Using Multivariable Control / F. van Bilsen ; R. De Keyser
Systematic Approach to Controlling Abnormal Structures Growth in CVD - Simulation of Nodule Structure Evolution
A Two-Dimensional Simulation Model for Oxy-Acetylene Flame CVD of Diamond Films / M. Okkerse ; C. Kleijn ; H. van den Akker ; M.H.J.M. de Croon ; G.B. Marin
Silicon Films Morphology Design Through Multiscale CVD Modeling
Numerical Simulation of Silicon Carbide Deposition in a Cold Wall CVD Reactor / G. Chaix ; A. Dolle t ; M. Matecki ; Y. Wang
Effect of Gas Phase Nucleation on Silicon Carbide Chemical Vapor Deposition / A.N. Vorob'ev ; A.E. Komissarov ; M.V. Bogdanov ; S. Yu. Karpov ; A.A. Lovtsus ; Yu.N. Makarov ; S.A. Lowry
CVD of SiC from CH[subscript 3]SiCl[subscript 3] in a Hot-Wall-Reactor System: Transport Pheonomena and Kinetic Aspects / V.K. Wunder ; N. Popovska ; H. Gerhard ; G. Emig ; P. Kaufmann ; L. Kadinski ; F. Durst
Modeling and System Design for Atmospheric Pressure CVD of YSZ / T. Besmann ; V. Varanasi ; T. Starr ; T. Anderson
A Stagnation-Flow MOCVD Reactor for Intelligent Deposition of YBCO Thin Films / A. Tripathi ; D. Boyd ; H. Atwater ; L. R. Raja ; R. J. Kee ; J. Musolf
Metalorganic Chemical Vapor Deposition
New Liquid Precursors for CVD of Metal-Containing Materials / R. Gordon
Novel MOCVD Process for the Low Temperature Deposition of the Chromium Nitride Phases / F. Maury ; D. Duminica ; F. Senocq
MOCVD of WN[subscript x] Thin Films Using Novel Imido Precursors / S. Johnston ; C. Ortiz ; O. Bchir ; Y. Zhang
Vapor Phase Epitaxy of Magnesium Oxide on Silicon Using Methylmagnesium Alkoxides / S.S. Lee ; S.Y. Lee ; C. Kim ; Y. Kim
Use of Ti(dpm)[subscript 2](Opr[superscript i])[subscript 2] Precursor to Obtain TiO[subscript 2] Film / V. Krisyuk ; A.E. Turgambaeva ; I.K. Igumenov ; V.G. Bessergenev ; I.V. Khmelinskii ; R.J.F. Pereira
Monitoring of MOCVD Fabrication of LaF[subscript 3] Films Using the Novel La(hfac)[subscript 3] - Diglyme Adducts and In Situ Synthesized La(hfac)[subscript 3] Anhydrous Precursor / G.G. Condorelli ; I.L. Fragala
Ceramics, Composites, and Hard Materials
Chemical Vapor Deposition of Aluminum on Silicon Carbide for the Investigation of the Interfacial Microstructure in Discontinuously Reinforced Aluminum / P. Oritz ; D. Oquab ; C. Vahlas ; I. Hall
Development of CVD Mullite Coatings / S.N. Basu ; V.K. Sarin
Evaluation of Various Hypotheses on the Influence of Nitrogen on Diamond Growth in an Oxy-Acetylene Torch Reactor
MOCVD of Aluminosilicate Corrosion Protection Coatings / S.M. Zemskova ; J.A. Haynes ; T.M. Besmann
Chemical Vapor Deposition of MoS[subscript 2] on and in TiN Coatings / H. Keune ; G. Wahl ; W. Lacom
Measurement of the Retarding Effect of HCl on the Rate of CVD of Titaniumdiboride / Ch.-Ho Yu ; E. Zimmermann ; D. Neuschutz
Factors Affecting the Amount of Carbon in Titanium Carbide Films Made by CVD / C. C. Amato-Wierda ; K. E. Versprille ; P. Ramsey
Characterization of Ti-W-C Thin Films Deposited by CVD / C.C Amato-Wierda ; H. X. Ji
MOCVD of Chromium Carbide from Bis-Ethyl-Benzene-Chromium / M. Satschko
Effect of H[subscript 2]S on the Microstructure and Deposition Characteristics of Chemically Vapor Deposited Al[subscript 2]O[subscript 3] / S. Ruppi ; A. Larsson
Cosmo-Mimetic Carbon Micro-Coils / D. Motojima ; X. Chen ; W. In-Hwang ; T. Kuzuya ; M. Kohda ; Y. Hishikawa
Morphology of Carbon Micro-coils Grown by Catalytic Decomposition of Hydrocarbons / W.-In Hwang ; S. Motojima
Silicon and Silicon Germanium Materials
Chemical Vapor Deposition of Low Trap Density SiGe Quantum Well Layers on Silicon / S. Kar ; P. Zaumseil
Loading Effects during Non-Selective Epitaxial Growth of Si and SiGe / J. Pejnefors ; S.-L. Zhang ; J.V. Grahn ; M. Ostling
Thermodynamic Analysis of Selective Epitaxial Growth of Silicon / W.-S. Cheong ; J.H. Joung ; J.W. Park ; D.J. Ahn
Nanocrystals Formation and Microstructure Evolution of Amorphous Si and Si[subscript 0].7Ge[subscript 0.3] by Using Low Pressure Chemical Vapor Deposition / T.-S. Yoon ; D.-H. Lee ; J.-Y Koon ; K.B. Kim
The Profile Control of n-type Doping in Low and High Temperature Si Epitaxy for High Frequency Bipolar Transistors / H.H. Radamson ; B. Mohadjeri ; B.G. Malm ; G. Landgren
CVD-Epitaxial Growth on Porous Si for ELTRAN SOI-Epi Wafers / N. Sato ; S. Ishii ; T. Yonehara
Dislocation Generation in Selective and Non Selective SiGe Epitaxy / C. Fellous ; F. Romagna ; D. Dutartre
MOSFET Evaluation of Ultraclean-CVD Si and SiGe Grown at 550[degree]C on SIMOX / K. Fujinaga
Global Model of Silicon Chemical Vapor Deposition in Centura Reactors / A.S. Segal ; A.V. Kondratyev ; A.O. Galyukov ; S.Yu. Karpov ; W. Siebert ; P. Storck ; S. Lowry
A Comparison of Commonalities and Differences of Silicon-Based Thin Films CVD Processes for ULSI Device Technologies / V. Vassiliev
Metals, Metallization, and Diffusion Barriers
Selective Nucleation and Area Selective OMCVD of Gold on Patterned Self-Assembled Organic Monolayers: A Comparison of OMCVD and PVD / R.A. Fischer ; C. Winter ; U. Weckenmann ; J. Klashammer ; V. Scheumann ; S. Mittler
Surface Analysis of Al Film Prepared from Dimethyl-Aluminum-Hydride / M. Sugiyama ; H. Ogawa ; H. Itoh ; J. Aoyama ; Y. Horiike ; H. Komiyama ; Y. Shimogaki
Chemical Vapor Deposition of Titanium Nitride and Titanium Silicon Nitride Thin Films from Tetrakis-(dimethylamido) Titanium and Hydrazine as a Co-Reactant / D.A. Wierda
Chemical Vapor Deposition of Copper Using hfacCu[superscript (1)]DMB(3,3-dimethyl-1-butene) Liquid Precursor / K.- K. Choi ; S.-W. Rhee
Reaction of Bis-(2,4-Pentanedionato) M(II) (M= Ni, Cu) Under Low Pressure CVD Conditions / C.R. Vestal ; H.M. Sturgill ; T.C. DeVore
Metalorganic Chemical Vapor Deposition of Nickel Films: Investigation of a New Precursor, [Ni(tmen)([mu]-tfa) subscript 2]([mu]H[subscript 2]O) / J.-K. Kuang ; A. Gleizes
Platinum Thin Films Obtained via MOCVD on Quartz and CaF[subscript 2] Windows as Electrode Surfaces for In Situ Spectroelectrochemistry / S. Santi ; G. Carta ; S. Garon ; L. Rizzo ; G. Rossetto ; P. Zanella ; D. Barreca ; E. Tondello
Surface Adsorption of WF[subscript 6] on Si and SiO[subscript 2] in Selective W-CVD / Y. Yamamoto ; T. Matsuura ; J. Murota
CVD Tungsten Via Void Minimization for Sub 0.25 [mu]m Technology / A.M. Haider ; D.J. Rose ; J.R.D. Debord ; S.P. Zuhoski
Three-Dimensional Computer Simulation of WSi[subscript x] CVD VLSI Processing-Effect of Outlet Position / K. Sugawara ; M. Kunishige ; T. Muranushi ; Y.K. Chae
Processing of Tungsten Single Crystals by Chemical Vapor Deposition / R. Zee ; Z. Xiao ; H.S. Gale ; B.A. Chin ; L.L. Begg
Simplified CMP Planarization Process Module for Shallow Trench Isolation Applications / K. Kapkin ; M. Mogaard ; T. Curtis ; J. deRuiter
Dielectric Materials
Reactor Scale Simulation of Metal Oxide Deposition from an Inorganic Precursor / J.V. Cole ; A. Nangia ; T. Mihopoulas ; R. Hegde
Atomic Layer Deposition of High-k Oxides / K. Kukli ; M. Vehkamaki ; T. Hanninen ; T. Hatanpaa ; P.I. Raisanen ; M. Leskela
Quality Improvement of SiO[subscript 2]-Films by Adding Foreign Gases in Photo-Chemical Vapor Deposition / Y. Motoyama ; J.-i. Miyano ; T. Yokoyama ; K. Toshikawa ; T. Mori ; H. Mutou ; K. Kurosawa ; A. Yokotani ; W. Sasaki
SiO[subscript 2] Deposition Mechanism in Photo-Chemical Vapor Deposition Using Vacuum Ultraviolet Excimer Lamp / J. Miyano
Kinetic Growth of Al[subscript 2]O[subscript 3] Thin Films Using Aluminium Dimethylisopropoxide as Precursor / G. A. Battison ; R. Gerbasi
Atomic Layer Deposition of Metal Oxide Films by using Metal Alkoxides as an Oxygen Source
Optimization of LPCVD Nitride Deposition Conditions for Non-Volatile Memory Inter Poly Dielectric Applications / M.J. Teepen ; M.A.A.M. van Wijck ; H. Sprey
Ultra Thin TiO[subscript 2] Films Deposited by Atomic Layer Chemical Vapor Deposition / M. Schuisky ; A. Aidla ; J. Aarik ; M. Ludvigsson ; A. Harsta
Characterization of Ta[subscript 2]O[subscript 5] Films Prepared by ALCVD / K. Forsgren ; J. Sundqvist
In-Situ Preparation of Ti-Containing Ta[subscript 2]O[subscript 5] Films by Halide CVD
CVD of Zr-Sn-Ti-O for Capacitor Applications / Y. Senzaki ; G. Alers ; A. Hochberg ; D. Roberts ; J. Norman ; R. Fleming ; H. Krautter
Gallium Nitride and Other III-V Materials
Investigations of Chemical Vapor Deposition of GaN Using Synchrotron Radiation / C. Thompson ; G.B. Stephenson ; J.A. Eastman ; A. Munkholm ; O. Auciello ; M.V. Ramana Murty ; P. Fini ; S.P. DenBaars ; J.S. Speck
Reaction-Transport Models of the Metalorganic Vapor Phase Epitaxy of Gallium Nitride / R.P. Pawlowski ; C. Theodoropoulos ; A.G. Salinger ; H.K. Moffat ; T.J. Mountziaris ; J.N. Shadid ; E.J. Thrush
Growth of Hexagonal GaN Films by MOCVD Using Novel Single Precursors / C.G. Kim ; S.H. Yoo ; J.H. Lee ; Y.K. Lee ; M.M. Sung
In Situ Measurement of the Decomposition on GaN OMVPE Precursors by Raman Spectroscopy / C. Park ; S. Lee ; J. Seo ; M. Huang ; T.J. Anderson
Growth Kinetics and Mechanistic Studies of GaN Thin Films Grown by OMVPE Using (N[subscript 3])[subscript 2]Ga[(CH[subscript 2])[subscript 3]NMe subscript 2] as Single Source Precursor / A. Wohlfart ; A. Devi ; W. Rogge ; J. Schafer ; J. Wolfrum
Experimental and Numerical Study of InGaAsP Materials Growth Kinetics and Composition / O. Feron ; Y. Nakano
Ruthenium Doped Indium Phosphide Growth by Low Pressure Hydride Vapor Phase Epitaxy / D. Soderstrom ; S. Lourdudoss ; M. Wallnas ; A. Dadgar ; O. Stenzel ; D. Bimberg ; H. Schumann
Quasi-Thermodynamic Models of Surface Chemistry: Application to MOVPE of III-V Ternary Compounds / E.V. Yakovlev ; R.A. Talalaev ; Yu.A. Shopolyanskiy ; Y.N. Makarov
Electronic, Optical, and Magnetic Materials
Chemical Vapor Deposition and Magnetoresistance of Granular Cu-Co Films / I.S. Chuprakov ; K.-H. Dahmen
Diagnostics of Metalorganic Chemical Vapor Deposition of (Ba, Sr)TiO[subscript 3] Films by Microdischarge Optical Emission Spectroscopy / S. Momose ; T. Nakamura ; K. Tachibana
Bismuth Titanate Thin Films Deposited by Halide Chemical Vapor Deposition / S. Khartsev ; A. Grishin
LPCVD of Optical Interference Coatings for Micro-Optical Applications / M. George ; D.Z. Rogers
Evaluation of Precursors for the Chemical Vapour Deposition of Tin Oxide / A.M.B. van Mol ; G.R. Alcott ; C.I.M.A. Spee ; J.C. Schouten
Characteristics of Silicon Oxy-Nitride Thin Films Deposited by Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor Deposition / C. Simionescu ; F. Bounasri ; S.G. Wallace ; H.K. Haugen ; J.A. Davies ; P. Mascher
CVD of Molecule-based Conductors and Magnets / L. Valade ; D. deCaro ; H. Casellas ; M. Basso-Bert ; C. Faulmann ; J.-P. Legros ; P. Cassoux ; L. Aries
Stability of RuO[subscript 2] Bottom Electrode and Its Effect on the Ba-Sr-Ti Oxide Film Quality / Y.-J. Oh ; S.H. Moon ; C.-H. Chung
Multilayers for the Growth of HTc Superconducting Tape: A Full MOCVD Approach / R. Lo Nigro ; G. Malandrino
Fundamental Chemistry and Mechanisms
Atomistic Modeling of Chemical Vapor Deposition: NO on the Si (001) (2x1) Reconstructed Surface / N. Tanpipat ; J. Andzelm ; B. Delley ; A. Korkin ; A. Demkov
Simulation of Surface Diffusion of Silicon and Hydrogen on Single Crystal Silicon Surfaces / S. Somasi ; B. Khomami ; R. Lovett
8.

図書

図書
editors, Hisham Z. Massoud ... [et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c2000  xiv, 539 p. ; 27 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2000-2
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9.

図書

図書
editor, L. Mendicino ; [jointly sponsored by the Dielectric Science and Technology Division]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  vii, 212 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-6
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10.

図書

図書
editor, Y. Kuo ; [sponsored by] Electronics and Dielectric Science and Technology Divisions [of the Electrochemical Society]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  xi, 340 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; 2000-31
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目次情報: 続きを見る
Preface
Reviews of TFT Research Activities
Advances in Printed Liquid Crystal Displays with Plastic Substrates / E. Lueder
A Brief Review of Thin-Film Transistor Research Done in Tokyo Institute of Technology / M. Matsumura
Amorphous and Microcrystalline Silicon TFTs
ECR-PECVD of Silicon Nitride and Hydrogenated Amorphous Silicon at 80[degree]C For TFTs / A. J. Flewitt ; A. P. Dyson ; J. Robertson ; W. I. Milne
Amorphous Silicon Thin Film Transistor Fabricated with a New Copper Dry Etching Method / S. Lee ; Y. Kuo ; J. P. Donnely ; J.-Y. Tewg ; H. Lee
Microcrystalline Silicon TFTs For AMLCDs / I. D. French ; P. Roca i Cabarrocas ; S. C. Deane ; R. B. Wehrspohn ; M. J. Powell
Use of 120[degree]C n[superscript +] [mu]c-Si:H in Low Temperature TFT Fabrication / T. Charania ; A. Sazonov ; A. Nathan
Process Considerations for Small Area a-Si:H Vertical Thin Film Transistors / I. Chan ; B. Park
Polycrystalline Silicon TFTs
Future Trends in Low Temperature Poly-Si TFT-LCD by Excimer Laser Anneal / S. Uchikoga
Low Temperature Process Technologies and "Process Integration" for High Performance Polycrystalline Silicon Thin-Film Transistors / S. Higashi
Top-Gate Amorphous Si Air-Gap Transistors with Poly-Si Contacts / P. Mei ; J. Ho ; R. Lau ; J. P. Lu ; B. Street ; J. Boyce
Full Optimized Process of Polysilicon TFT's Using Very Large Excimer Laser / Y. Helen ; G. Gautier ; K. Mourgues ; T. Mohammed-Brahim ; F. Raoult ; O. Bonnaud ; C. Prat ; D. Zahorski ; D. Lemoine
Polycrystalline Silicon Thin Film Transistors Free from Large Angle Grain Boundaries / M. Maekawa ; Y. Nakamura ; Y. Umenaka ; J. Takagi ; M. Hijikigawa
Low Temperature Poly-Si TFT-LCDs Using P-type Technology / K.-J. Kim ; Y.-M. Ha ; J.-C. Yeo ; B.-K. Kim ; H.-S. Choi ; D.-G. Kim
High Performance Low Temperature Polysilicon TFT'S with Ultra-thin Liquidphase Deposited Gate Oxide and N[subscript 2]O Plasma Treatment / C.-F. Yeh ; S.-C. Wang ; J.-N. Jeng ; C.-Y. Lu
Crystallization, Etching, Deposition, Hydrogenation, and Metallization
Silicide Mediated Crystallization of Patterned Amorphous Silicon in the Electric Field / S. J. Park ; K. H. Kim ; B. R. Cho ; A. Y. Kim ; S. Y. Yoon ; J. Jang
Two-Dimensionally Position-Controlled Ultra-Large Grain Growth Based on Phase-Modulated Excimer-Laser Annealing Method / M. Nakata
The Lateral Grain Growth of ELA Poly-Si by Employing Selective Melting and Lateral Heat Sink / J.-H. Jeon ; M.-C. Lee ; J.-W. Park ; M.-K. Han
Novel Wet Taper Etching of Interconnects on Large Area Substrates Using Galvanic Reaction / T. Kaneko ; Y. Hashimoto ; K. Ono ; K. Fujii ; K. Onisawa
High Quality Silicon Oxide Deposited with A Multipolar Electron Cyclotron Resonance Plasma Source / G. Isai ; A. Kovalgin ; J. Holleman ; P. Woerlee ; H. Wallinga
Effects of NH[subscript 3]/N[subscript 2] Plasma Treatment on Very-Low-Temperature (100[degree]C) Oxides / C.-H. Kim ; S.-H. Jung ; W.-J. Nam
Electroless Deposition of Ni-P Alloy in Electronics / T.N. Khoperia
Devices and Modeling
Mechanisms Underlying the Off Characteristics of a-Si:H Thin Film Transistors / P. Servati
Analysis of the Leakage Current of Poly-Si TFT Using Counter-Doping Process / J. Y. Yang ; S. H. Yu ; J. H. Kim
Low Temperature Poly-Si TFT with Lateral Body Terminal for Stability Improvement / J. S. Yoo ; M. C. Lee ; I. H. Song ; M. K. Han
Low Frequency Noise in CdSe Thin-Film Transistors / M. J. Deen ; S. L. Rumyantsev ; I. Glick ; A. Smozh ; M. Westcott ; D. Waechter
Materials
Defect Reduction Technologies Used to Improve Characteristics of Polycrystalline Silicon Thin Film Transistors / Y. Tsunoda ; T. Sameshima
Polysilicon Thin Film Transistors on Glass-Ceramic Substrates / S. M. Krasulya ; N. I. Nemchuk ; D. G. Ast ; J. G. Couillard
Structural Differences between Deuterated and Hydrogenated Hydrogenated Silicon Nitride/Oxynitride / A. Shih ; S.-C. Lee ; T. R. Yang ; C. C. Lu
Highly Packed and Ultra-Large Si Grains Grown by a Single-Shot Irradiation of Excimer-Laser Light Pulse / Y. Sano ; W-C. Yeh
Low-Pressure CVD of Germanium-Silicon Films Using Silane and Germane Sources / C. Salm
Unhydrogenated Polycrystalline Silicon-Germanium Thin Film Transistors by LPCVD / D. Guillet ; R. Rogel ; M. Sarret
New and Novel Applications
Flat Panel X-Ray Image Detectors for Medical Imaging Applications / Y. Izumi ; Y. Yamane ; F. Funada ; S. Adachi ; S. Yamada
Analog Addressed Microdisplays / A. Van Calster
Polysilicon Thin Film Transistor Development for Smart Power Applications / Y. Wu ; F. Robb ; J. Shen ; S. Robb ; K. Kamekona
Polysilicon Thin Film Transistor and EEPROM Characteristics for Three Dimensional Memory / J. R. Lindsey ; T. S. Kalkur
Active Pixel TFT Array for Digital Imaging Applications / K.S. Karim
Author Index
Subject Index
Preface
Reviews of TFT Research Activities
Advances in Printed Liquid Crystal Displays with Plastic Substrates / E. Lueder
11.

図書

図書
editors, M. Cahay ... [et. al] ; [sponsored by] Dielectric Science and Technology, Electronics, and Luminescence and Display Materials Divisions [of the Electrochemical Society]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  viii, 280 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2000-28
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目次情報: 続きを見る
Preface
Field Emitter Arrays
Tip Self-Heating to Enhance Microfabricated Cold Cathode Operation Lifetime / P.R. Schwoebel ; C.A. Spindt ; C.E. Holland ; J.A. Panitz
Laser Assisted Fabrication of Single Crystalline Tungsten Rods for use as Field Emitting Cathodes / K. Larsson Bjorklund ; C. Ribbing ; H. Norde ; M. Boman
Theory of H Induced Enhancement of Field Emission from and O Covered Mo(110) Surface / P. von Allmen ; R. Ramprasad ; L.R.C. Fonseca ; P. Ordejon
Process Simulation of a Silicon Field Electron Emitter with Integrated Double-gated Beam Focusing Lens / G. Oleszek ; M. Rodriquez
Carbon Nanotubes
Carbon Nanotube Cold Cathodes Fabrication and Properties / C. Bower ; W. Zhu
Calculating the Field Emission Current from a Carbon Nanotube
Scanning Anode Field Emission Microscopy on Carbon Nanotube Thin Film Emitters / L.O. Nilsson ; O. Groenig ; P. Groenig ; L. Schlapbach
Template Based Carbon Nanotubes as A Field Emitter / S.-H. Jeong ; H.-Y. Hwang ; K.-H. Lee ; W.-K. Cho ; K.-Y. Kim ; H.-S. Jeong
Field Emission Cathode from Aligned Arrays of Carbon Nanotubes / A. Govyadinov ; P. Mardilovich ; D. Routkevich
Electron Emission Cooling
Cooling by Field Emission into the Vacuum with Resonant Tunneling: Design Parameters / R. Tsu
New Results on Microelectronic Cooling Using the Inverse Nottingham Effect: Low Temperature Operation and Efficiency / P.H Cutler ; N.M. Miskovsky ; N. Kumar ; M.S. Chung
Theory and Simulation
The Semiconductor Statistical Hyperbolic-Ellipsoidal Model For Evaluation of Current From Microstructures / K.L. Jensen
Non Equilibrium Field Emission from Wide Bandgap Semiconductors / G.L. Bilbro
Onset of Current Self-Quenching in an InP/CdS/LaS Cold Cathode / Y. Modukuru ; M. Cahay ; P.D. Mumford
Negative Electron Affinity/ Low Electron Affinity
Novel Electron Sources / V.T. Binh ; V. Semet ; J.P. Dupin
Effect of Surface Properties on Electron Energy Distribution from C(111) and C(100) Surfaces / J. Yater ; A. Shih
Synthesis and Work Function Measurement of LaS and NdS Bulk Samples / J. Thachery ; H. Tang ; P. Boolchand
Carbons, Diamond, and a-Silicon
Electron Emission from Carbon Films / R.J. Nemanich ; F.A.M. Kock ; J.M. Garguilo
Fabrication and Characterization of Cathodoluminescent Devices made Using Porous Silicon as a Cold-Cathode Field Emitter / D. Heyde Elqaq ; M.-A. Hasan
Monolithic Thin Film Edge Emission Diodes / H.R. Kim ; L. Karpov ; V. Bhatia ; M. Weichold
Electron Emission Characteristics of Diamond / B. Pate
Conditioning of Amorphous Cathodes via Current Stressing / S.R.P. Silva ; J.D. Carey ; C.H. Poa ; J.M. Shannon
Field Emission Display Development at Motorola / A.A Talin ; B.F.Coll. Yi Wei ; K.A. Dean ; J.E. Jaskie
Rehybridization of Atomic Orbitals and Field Emission Properties of Nanostructured Graphite-like Materials / A.N. Obraztsov ; A.P. Volkov ; A.I. Boronin ; S.V. Kosheev
Author Index
Subject Index
Preface
Field Emitter Arrays
Tip Self-Heating to Enhance Microfabricated Cold Cathode Operation Lifetime / P.R. Schwoebel ; C.A. Spindt ; C.E. Holland ; J.A. Panitz
12.

図書

図書
editors, P.J. Hesketh ... [et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c2000  viii, 258 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2000-19
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目次情報: 続きを見る
Preface
Micromachining
The Microfactory System using Electrochemical Machining / Masayuki Suda ; Kazuyoshi Furuta ; Toshihiko Sakuhara ; Tatsuaki Ataka
Electroplated Nanocrystalline Nickel-Iron Alloys as a New Powerful Material for Microstructured Molding Tools / A. Fath ; W. Leskopf ; K. Bade ; W. Bacher
Lateral Etch Study of Thin Films Using Hydrofluroric Acid Chemistries for MEMS Devices / G. Matamis ; Chuan-Che Wang ; B. Gogoi
Low Surface Tension Etching Solutions for Silicon Dioxide Removal in Microelectromechanical Systems / M. J. Parent ; L. Zazzera ; P. Rajtar ; F. E. Behr
Hybrid Micromachining and Surface Microstructuring of Alumina Ceramic / P. Mardilovich ; D. Routkevitch ; A. Govyadinov
Microfluidics
Micro Scale Purification Systems for Biological Sample Preparation / A. B. Frazier
Challenges and Solutions for Packaging MEMS and Microsystems / J. Neysmith ; D. F. Baldwin
Fabrication and Characterization of Plastic Microfluidic Devices Modified with Polyelectrolyte Multilayers / L. E. Loscascio ; S. L. R. Barker ; D. Ross ; Jay Xu ; S. Roberson ; M. Tarlov ; M. Gaitan
Bulk-Etched Integrated Mesoscopic Fluidic Interconnects for Fluidic Microdevices / J. A. Scalf ; D. Liepmann ; A. P. Pisano
Electro-Magnetically Actuated Diverting Valve Using LTCC Tapes / J. R. Gillman ; P. Espinoza-Vallejos ; L. Sola-Laguna ; J. J. Santiago-Aviles
Design of a MEMS Magnetic Bi-Stable Valve / D. Creyts IV ; P. J. Hesketh ; G. C. Frye-Mason
Room Temperature, Adhesive Bonding for Wafer Scale Packaging of Fluidic Microsystems / X. Ma ; B. Gierhart ; S. D. Collins ; R. L. Smith
Physical Sensors
Inertial Sensors: The Drive for Aspect Ratio / P. L. Bergstrom
Residual Stress Effect and Improvement Method on the Performance of Diaphragm-Based Piezoelectric Microphones / Mengnian Niu ; Sok Kim
A Post-Processing Method for Suppressing the Residual Mechanical Stress in CMOS Layers, for MEMS Applications / B. Ghodsian ; V. Milanovic
Chemical Sensors
Chemical Microsensors for Aerospace Applications / G. W. Hunter ; P. G. Neudeck ; G. Fralick ; C. C. Liu ; Q. H. Wu ; M. S. Sawayda ; Z. Jin ; J. Hammond ; D. Makel ; W. A. Rauch ; M. Liu ; G. Hall
A MEMS Based Hybrid Preconcentrator/Chemiresistor Chemical Sensor / R. C. Hughes ; S. V. Patel ; R. P. Manginell
Micro-Hotplate, an Useful Concept for Gas Sensing, Fluidics and Space Applications / D. Briand ; O. Guenat ; B. van der Schoot ; T. Hirata ; N. F. de Rooij
Detection of Trace Silver and Copper at an Array of Boron-Doped Diamond Microdisk Electrodes / C. Madore ; A. Duret ; W. Haenni ; A. Perret
FET Based pH and Nitrate Checkers for Acid-Rain Monitoring / S. Wakida ; M. Yamane ; S. Takeda ; Z. Siroma ; Y. Tsujimura ; J. Liu
Biosensors
Microfabricated PMMA Structure for DNA Preconcentration and Electrophoresis / Yu-Cheng Lin ; Chien-Kai Tseng ; Shao-Qin Hou
Soluble Sensors of Telephonic Signals / M. Garnett ; J. L. Remo
Selective Deposition of Octasubstituted Phthalocyanine Materials Based on Hydrophobic / Hydrophilic Surface Interactions / R. A. P. Zangmeister ; N. R. Armstrong
Nanomechanical Detection of Biomolecular Interactions / K. M. Hansen ; Guanghua Wu ; Hai-Feng Ji ; T. Thundat ; R. Datar ; R. Cote ; A. Majumdar
Ultra-Sensative Resonant Frequency Based Mass Detector / B. Ilic ; D. Czaplewski ; H. G. Craighead ; P. Neuzi ; C. Campagnolo ; C. Batt
Microfabrication Processes
Developing a [mu]-Fabrication Course: A Study in Multidisciplinary MEMS Curriculum Development / R. S. Evans
Microstructures for Monitoring Wafer Uniformity of Reactive Ion Etching / R. Leung ; D. W. Howard
Water Dispersible Silanes for Wettability Modification of Polysilicon / A. M. Almanza-Workman ; S. Raghavan ; P. Deymier ; D. J. Monk ; R. Roop
Correlation of Metal Film Grain Size to Optical Measurement Results / T. Robinson ; C. Narayan ; J. Sledziewski ; G. Ready ; S. Alie
Preface
Micromachining
The Microfactory System using Electrochemical Machining / Masayuki Suda ; Kazuyoshi Furuta ; Toshihiko Sakuhara ; Tatsuaki Ataka
13.

図書

図書
editors, R. Singh ... [et al.] ; [sponsord by] Dielectric Science and Technology and Electronics Divisions
出版情報: Pennington, N.J. : Electrochemical Society, c2000  viii, 226 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 99-7
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図書

図書
editors, K.B. Sundaram ... [et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  x, 286 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-7
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目次情報: 続きを見る
Preface
Organizers
Oxide Wear-Out, Reliability, Stress and Interfaces / I:
A Review of Oxide Wearout, Breakdown, and Reliability / D. Dumin
Surface And Interface Study Of Ion Beam Deposited Silicon oxide Thin films / Heinz D. Wazenboeck ; Emmerich Bertagnolli ; Bernhard Basnar ; Juergen Smoliner ; Martin Gritsch ; Herbert Hutter ; Josef Brenner ; C. Tomastik ; Herbert Storri
Study of Inversion Layer Hole Mobility In p-Mosfet During High-field Stressing / R. Jarawal ; D. Misra
Two Limiting Thinnesses Of The Ultrathin Gate Oxide / Samares Kar
SiO[subscript 2] Stress and Interfaces / II:
The Connection Between oxide leakage currents and Si/SiO[subscript 2] Interface Trap Generation / P. M. Lenahan
Charging Damage During Plasma Enhanced Dielectric Deposition / K. Cheung
Kinetics and Mechanisms of Organic Contaminant Interactions at Silicon Surfaces in High Temperature Processes / N. Rana ; P. Raghu ; F. Shadman
SiO[subscript 2] Films and Properties / III:
Remote Plasma Deposited Gate Dielectrics on Si and SiGe Mosfets / T. Ngai ; R. Sharma ; J. Fretwell ; X. Chen ; J. Chen ; W. Brookover ; S. Banerjee
Rapid Thermal Processes of High Permittivity Films on Silicon for ULSI Gate Dielectrics Applications / S. P. Tay ; R. Sharangpani ; Y. Z. Hu
Processing of Thick Thermal Gate Oxides in Trenchs / C. T. Wu ; R. Ridley ; G. Dolny ; T. Grebs ; J. Hao ; S. Suliman ; B. Venkataraman ; O. Awadelkarim ; R. Williams ; P. Roman ; J. Ruzyllo
Electrical Properties of SiO[subscript 2]-Films Prepared by VUV Chemical Vapor Deposition / Y. Motoyama ; J. Miyano ; K. Tosikawa ; Y. Yagi ; K. Kurosawa ; A. Yokotani ; W. Sasaki
SiO[subscript 2] Film Deposition on Different Substrate Materials by Photo- CVD Using Vacuum Ultraviolet Radiation / K. Toshikawa
Silicon Nitrides/ Oxynitrides / IV:
Low Energy Ion Irradiation of Silicon: Compound Formation and Segregation of Impurities / M. Petravic ; J. S. Williams ; P. N. K. Deenapanray
Characteristics of Silicon Oxynitrides Made By ECR Plasmas / J. A. Diniz ; P. J. Tatsch ; J. Swart
Radiation Hardening of Oxynitrides Formed By Low Nitrogen Implantation into Silicon Prior to Oxidation / J. Godoy Fo
Silicon Nitrides/ Oxynitrides II / V:
Material and Process Considerations of Ultra thin Silicon (Oxy) Nitride Films Grown on Silicon and SiO[subscript 2] Surfaces / C. P. D'Emic ; E. P. Gusev ; K. K. Chan ; T. Zabel ; M. Copel ; R. Murphy ; P. Kozolowski ; J. Newbury
Silicon OxyNitride: A Versatile Material for Integrated Optics Application / K. Worhoff ; A. Driessen ; P. V. Lambeck
Characterization of Silicon Oxynitride Thin Films Deposited By ECR-PECVD / C. Simionescu ; J. Wojcik ; H. K. Haugen ; J. A. Davies ; P. Mascher
Silicon Nitrides/ Oxynitrides III / VI:
Characterization of Low- Temperature Magnetoplasma- Grown Si Oxynitride and Si Oxide / H. Ikoma
Advances in Single Wafer Chemical Deposition of Oxide and Nitride films / W. Palmer ; Z. Gabric
High Integrity Direct Oxidation/Nitridation at Low Temperatures Using Radicals / T. Ohmi ; S. Sugawa ; M. Hirayama
Silicon Nitride
Thermally Induced Stress Changes in High Density Plasma Deposited Silicon Nitride Films / R. E. Shah ; H. Baumann ; D. Serries ; M. Mikulla ; R. Keiffer
Effect of Oxygen in Deposited Ultra Thin Silicon Nitride Film on Electrical Properties / K. Muraoka ; K. Kurihara
Influence of Low- energy argon Ion Bombardment and Vacuum Annealing on the Silicon Nitride Surface Properties / I. P. Petrenko ; V. A. Gritsenko ; L. M. Logvinsky ; H. Wong
Authors Index
Subject Index
Preface
Organizers
Oxide Wear-Out, Reliability, Stress and Interfaces / I:
15.

図書

図書
editor, Y. Kuo ; sponsoring divisions, Electronics, Dielectric Science and Technology
出版情報: Pennington, N.J. : Electrochemical Society, c2005  ix, 326 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; 2004-15
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16.

図書

図書
editors, Evgeni P. Gusev ... [et al.] ; sponsoring divisions, Electronics, Dielectric Science and Technology, and High Temperature Materials
出版情報: Pennington, NJ : Electrochemical Society, c2005  xv, 634 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2005-05
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17.

図書

図書
editors, Anjana Devi ... [et al.] ; sponsoring divisions, High Temperature Materials, Dielectric Science and Technology, and Electronics and Photonics
出版情報: Pennington, NJ : Electrochemical Society, c2005  xviii, 1106 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2005-09
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18.

図書

図書
editors, S. Kar ... [et al.] ; sponsoring divisions: Dielectric Science and Technology, Electronics
出版情報: Pennington, NJ : Electrochemical Society, c2003-c2004  2 v. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2002-28, 2003-22
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目次情報: 続きを見る
Symposium Chairs
Preface
Table of Contents
Facts about the Electrochemical Society
High-K Gate Dielectrics - General / Chapter 1:
Challenges for the Integration of High-K Gate Dielectrics / M. Quevedo-Lopez ; B. E. Gnade ; R. M. Wallace
Correlation between the Material Constants and a Figure of Merit for the High-K Gate Dielectrics / S. Kar ; R. Singh
Binary Oxide High-K Gate Dielectrics / Chapter 2:
High Dielectric Constant Gate Insulator Technology using Rare Earth Oxides / H. Iwai ; S. Ohmi ; S. Akama ; C. Ohshima ; I. Kashiwagi ; A. Kikuchi ; J. Taguchi ; H. Yamamoto ; I. Ueda ; A. Kuriyama ; J. Tonotani ; Y. Kim ; Y. Yoshihara ; H. Ishiwara
High Quality ZrO[subscript 2] Thin Films on [left angle bracket]100[right angle bracket] Si Substrates as a Gate Dielectric Material: Processing and Characterization / M. Fakhruddin ; K. F. Poole ; S. V. Kondapi
HfO[subscript 2] Gate Dielectrics Deposited via Tetrakis Diethylamido Hafnium / J. Schaeffer ; N. V. Edwards ; R. Liu ; D. Roan ; B. Hradsky ; R. Gregory ; J. Kulik ; E. Duda ; L. Contreras ; J. Christiansen ; S. Zollner ; P. Tobin ; B.-Y. Nguyen ; R. Nieh ; M. Ramon ; R. Rao ; R. Hegde ; R. Rai ; J. Baker ; S. Voight
Electrical Characteristics Improvement of Dy[subscript 2]O[subscript 3] Thin Films by In-Situ Vacuum Anneal
Electrical and Physical Characterization of Zirconium-Doped Tantalum Oxide Films / J.-Y. Tewg ; J. Lu ; Y. Kuo ; B. Schueler
Effect of Deposition Sequence and Plasma Treatment on ALCVD HfO[subscript 2] n-MOSFET Properties / C. Lim ; A. Hou ; J. Gutt ; S. Marcus ; C. Pomarede ; E. Shero ; H. de Waard ; C. Werkhoven ; L. Chen ; J. Tamim ; N. Chaudhary ; G. Bersuker ; J. Barnett ; C. Young ; P. Zeitzoff ; G. A. Brown ; M. Gardner ; R. W. Murto ; H. R. Huff
Characteristics of High-K Gd[subscript 2]O[subscript 3] Films Deposited on Different Orientation of Si Substrate
Hafnium-Doped Tantalum Oxide High-K Dielectrics / P. C. Liu
Silicate/Aluminate High-K Dielectrics and Reliability / Chapter 3:
Defect Generation in High-K Dielectric Stacks: Characterization and Modelling / M. Houssa ; J. L. Autran ; V. V. Afanas'ev ; A. Stesmans ; M. M. Heyns
Ultra-Thin Zirconium and Hafnium Silicate Films Deposited by MOCVD on Si(100) / D. Landheer ; X. Wu ; H.-W. Chen ; M.-S. Lee ; S. Moisa ; T.-Y. Huang ; T.-S. Chao ; Z.-H. Lu ; W. N. Lennard
Effect of Post-Annealing on the Electrical Properties of ZrO[subscript 2] and ZrAlO / M. Mansouri ; Y.-L. Chiou ; Y. Ono ; S. T. Hsu
Improved Scalability of High-K Gate Dielectrics by using Hf-Aluminates / T. H. Hou ; H. de Warrd
Reliability and Plasma-Induced Degradation of High-K Gate Dielectrics in MOS Devices / K.-S. Chang-Liao ; P.-J. Tzeng
Stability of High-K Thin Films for Wet Process
High-K Gate Dielectric Interfaces / Chapter 4:
Nitrogen Incorporation and High Temperature Forming Gas Anneal For High-K Gate Dielectrics / J. C. Lee ; R. Choi ; K. Onishi ; H. Cho ; C. Kang ; S. Krishnan
Integrity of Hafnium Silicate/Silicon Dioxide Ultrathin Films on Silicon / J. Morais ; L. Miotti ; G. V. Soares ; R. Pezzi ; K. P. Bastos ; M. C. M. Alves ; I. J. R. Baumvol ; A. L. P. Rotondaro ; J. J. Chambers ; M. R. Visokay ; L. Colombo
Suppression of Silicidation for Zirconia, Hafnia, and Silicate on Silicon by Helium Annealing / K. Muraoka
Analysis of Electrically Active Defects at Si(100)-HfO[subscript 2] Interface / B. J. O'Sullivan ; E. O'Connor ; P. K. Hurley ; M. Modreanu ; F. Roussel ; H. Roussel ; M. A. Audier ; J. P. Senateur ; Q. Fang ; I. W. Boyd ; C. Jimenez ; T. Leedham
Thermal Stability of the HfO[subscript 2]/SiO[subscript x]N[subscript y]-Si Interface / R. P. Pezzi ; H. Boudivov ; R. I. Hegde ; H. H. Tseng ; P. J. Tobin
Non-Contact Electrical Characterization of High-Dielectric-Constant (High-K) Materials / P. Y. Hung ; B. Foran ; A. Diebold ; X. Zhang ; C. Oroshiba
High-K Capacitor Dielectrics / Chapter 5:
Ruthenium Bottom Electrode Prepared by Electroplating for High-K DRAM Capacitor / J. J. Kim ; O. J. Kwon ; M. S. Kang
Regional Charge Transport Characteristics of Integrated Metal-Oxide MIM Capacitors / D. R. Roberts ; S. Kalpat ; T. P. Remmel ; M. A. Said ; M. V. Raymond ; R. Ramprasad ; E. D. Luckowski ; M. Miller
High Capacitance and Low Leakage Ta[subscript 2]O[subscript 5] MIM Capacitor for DRAM / W. Li ; G. S. Sandhu
High Dielectric Constant Metal Oxide Films via Photochemical Metal Organic Deposition (PMOD) Process / S. P. Mukherjee ; P. J. Roman, Jr. ; H. O. Madsen ; L. G. Svendsen ; M. A. Fury ; S. J. Barstow ; A. Jeykumar ; C. L. Henderson
Seed Layer Free Ruthenium Precursor for MOCVD / N. Oshima ; T. Shibutami ; K. Kawano ; S. Yokoyama ; H. Funakubo
Low-Leakage Tantalum Oxide MIM Capacitor Module for Cu-Interconnected RF BiCMOS Technology / C. C. Barron ; M. Sadd ; P. Zurcher
Author Index
Subject Index
Interface Issues
Tailoring High-K/Silicon Interface for Nanoelectronics Applications / R. Puthenkovilakam ; J. Chang
Reducing the Interfacial Formation of SiO[subscript x] in HfO[subscript 2] MOS Structures: A Study in Pre-Deposition Cleaning and Surface Oxidation, and Post-Deposition Annealing / H. Harris ; K. Choi ; N. Biswas ; I. Chary ; L. Xie ; N. Mehta ; G. Kipshidze ; M. White ; H. Temkin ; S. Gangopadhyay
Influence of the 5 A TaN[subscript x] Interface Layer on Dielectric Properties of the Zr-Doped TaO[subscript x] High-K Film
Plasma Modification of Hf Based High-K Dielectrics: Effect of Nitridation and Silicon Nitride Deposition / W. Tsai ; J. W. Maes ; H. De Witte ; J. Chen ; A. Delabie ; R. Carter ; O. Richard ; M. Caymax ; T. Conrad ; E. Young ; S. DeGendt
Method for Determining the Effectiveness of Silicon Nitride as a Barrier Layer for HfO[subscript 2] / H. Kraus ; J. Snow ; P. van Doorne ; W. Fyen ; P. W. Mertens ; F. Kovacs
Effect of Surface Preparation on High-K Gate Stack Device Performance / N. Moumen ; B. H. Lee ; J. Peterson
Deposition Methods and Processing - I
Some Recent Developments in the Metalorganic Chemical Vapor Deposition of High-K Dielectric Oxides / P. R. Chalker ; A. C. Jones
A Comparative Study of Erbium Oxide and Gadolinium Oxide High-K Dielectric Thin Films Grown by Low-Pressure Metalorganic Chemical Vapour Deposition (MOCVD) using [beta]-Diketonates as Precursors / M. P. Singh ; C. S. Thakur ; K. Shalini ; T. Shripathi ; N. Bhat ; S. A. Shivashankar
HfO[subscript x]N[subscript y] and HfSi[subscript x]O[subscript y]N[subscript z] High-K Layers Deposited by MOCVD in Mixed Gas Flows of N[subscript 2]O and O[subscript 2] / C. Zhao ; S. Van Elshocht ; T. Conard ; Z. Xu ; S. DeGendt|cM. Heyns
Electrical Characterization - I
Internal Photoemission over High-K Insulating Barriers / V. V. Afanas'ev
Leakage Current Behavior of HfO[subscript 2] Thin Films / M. N. Jones ; Y. W. Kwon ; D. P. Norton
Experimental Values of a Quantization Index of the Accumulation Layers of Different High-K Gate Dielectrics / T. Kachru ; M. Bhagat
Deposition Methods and Processing - II
Tensile Strain in Si due to Expansion of Lattice Spacings in CeO[subscript 2] Epitaxially Grown on Si (111) / Y. Nishikawa ; D. Matsushita ; N. Satou ; M. Yoshiki ; T. Schimizu ; T. Yamaguchi ; H. Satake ; N. Fukushima
Selective Wet Etching of Hf-based Layers / M. Claes ; V. Paraschiv ; H. Boutkabout ; T. Witters ; E. Rohr ; B. Coenegrachts ; J. Vertommen ; R. Lindsay ; W. Boullart ; M. Heyns
Alternating Pulse Deposition of High-K Metal Oxide Thin Films using Hf(NO[subscript 3])[subscript 4] as a Metal and an Oxygen Source with Multiple In-Situ Annealing / J.F. Conley, Jr. ; D. Tweet ; G. Stecker ; R. Solanki ; W.W. Zhuang
Improvement of Electrical Properties of Alumina Films by Nitrogen Added Plasma Enhanced Atomic Layer Deposition / J.W. Lim ; S.J. Yun ; J.H. Lee
The Role of TXRF in the Introduction of High-K Materials into IC Processing / D. Hellin ; B. Onsia ; C. Vinckier
Metal Gates
Characterization of Resistivity and Work Function of Sputtered-TaN Film for Gate Electrode Applications / C. S. Kang ; H.-J. Cho ; Y. H. Kim ; C. Y. Kang ; A. Shahriar ; C. H. Choi ; S. J. Rhee
NbO as a Gate Electrode for NMOSFETs / W. Gao ; J. F. Conley
A Novel Iridium Precursor for MOCVD / M. Takamori ; T. Yamakawa ; S. Watari ; H. Fujisawa ; M. Shimizu ; H. Niu
Advanced Ruthenium Precursors for Thin Film Deposition / C. A. Hoover ; M. M. Litwin ; J. Peck ; G. B. Piotrowski ; D. M. Thompson
Silicates and Effects of Post-Deposition Treatments / Chapter 6:
Effects of NH[subscript 3] Annealing on High-K HfSiON/HfO[subscript 2] Gate Stack Dielectrics
Nitridation of Hafnium Silicate Thin Films Deposited by Atomic Layer Deposition / Y. Senzaki ; H. Chatham ; R. Higuchi ; C. Bercaw ; J. DeDontney
Thermal Stability and Compatibility with Cmos Processing / Chapter 7:
Scaling of Hf-Based Gate Dielectrics--Integration with Polysilicon Gates / W. Deweerd ; V. Kaushik ; A. Kerber ; S. Kubicek ; M. Niwa ; L. Pantisano ; R. Puurunen ; L. Ragnarsson ; T. Schram ; Y. Shimamoto ; W. Vandervorst
Suppression of Silicidation in Poly-Si/High-K Insulator/SiO[subscript 2]/Si Structure by Helium Through Process
Effect of Post Metallization Annealing for La[subscript 2]O[subscript 3] Gate Thin Films on Electrical Characteristics / S.-I. Ohmi ; K. Tsutsui
Defect Characterization and Reliability / Chapter 8:
Photoelectron Spectroscopy Investigation of High K Dielectrics / K. Demirkan ; A. Mathew ; R. L. Opila
Soft Breakdown Phenomena in High-K Gate Dielectrics
Low Frequency Noise Study of n-MOSFETs with HfO[subscript 2] Gate Dielectric / E. Simoen ; A. Mercha ; C. Claeys
Simulations of Bias Temperature Instabilities in p-MOSFETs with Hf[subscript x]SiO[subscript y]-Based Gate Dielectrics / C. Bizzari
The Effects of Forming Gas Anneal Temperature and Dielectric Leakage Current on TDDB Properties of HfO[subscript 2] Devices / Y.-H. Kim
Charge Trapping and Electron Mobility Degradation in MOCVD Hafnium Silicate Gate Dielectric Stack Structures / C. D. Young ; T.H. Hou ; E. Cartier ; P. Lysaght ; J. Bennett ; C.-H. Lee ; S. Gopalan ; G. Groeseneken
Electrical Characterization - II / Chapter 9:
High Hole Mobility of Al[subscript 2]O[subscript 3] MOSFETs on Dislocation Free Ge-on-Insulator Wafers / A. Chin ; D.S. Yu ; C.H. Wu ; C.H. Huang ; W.J. Chen
Extraction of the High-K Gate Dielectric Parameters from the Capacitance Data
Characteristics of Thermally Evaporated HfO[subscript 2] / R. Garg ; N. A. Chowdhury ; R. K. Jarwal ; D. Misra ; P. K. Swain ; M. Bhaskaran
Characterization of High-K Dielectric Stacks for Flash Memory Applications / Y.L. Chiou
Electrical Characteristics of High-K Stack Gate Dielectric Thin Films with La[subscript 2]O[subscript 3] as a Buffer Layer
Low-frequency Noise Characteristics of MISFETs with La[subscript 2]O[subscript 3] Gate Dielectrics / H. Sauddin
Investigation of High-K Dielectric Properties with the Non-Contact SASS Technique / M. Wilson ; J. Lagowski ; J. D'Amico ; P. Edelman ; A. Savtchouk
Electrical Characteristics of High-K La[subscript 2]O[subscript 3] Thin Film Deposited by E-Beam Evaporation Method
Ferroelectric Layers and Memory Devices / Chapter 10:
Reduction in Programming Voltage of Non-Volatile Flash Memory Using High-K Dielectric Stacks / Y. L. Chiou
Reaction Mechanism of a Titanium Source, Ti(MPD)(METHD)[subscript 2], in Metalorganic Chemical Vapor Deposition of (Ba,Sr)TiO[subscript 3] Films / T. Nishimura ; T. Nakamura ; K. Tachibana
Characteristics of (Pb, Sr)TiO[subscript 3] Films Post Treated by Low Temperature Technologies / J.-L. Wang ; C.-K. Jan ; D.-C. Shye ; M.-W. Kuo ; H.-C. Cheng
Symposium Chairs
Preface
Table of Contents
19.

図書

図書
editors, J. Ruzyllo ... [et al.] ; sponsoring divisions: Electronics, Dielectric Science and Technology
出版情報: Pennington, NJ : Electrochemical Society, c2004  xi, 436 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2003-26
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目次情報: 続きを見る
Preface
The Science and Technology of the Functional Water / M. Toda ; S. Uryuu
Single Wafer Cleaning
Effective Post-Etch Residue Removal on Low-k Films Using Single Wafer Processing / E. Kesters ; J. Ghekiere ; P. Van Doorne ; G. Vereecke ; P.W. Mertens ; M.M. Heyns
Aqueous Single Pass Single Wafer Al/Via Cleaning / S. Verhaverbeke ; C. Beaudry ; P. Boelen
Improved Rinsing Efficiency on Post-Etch Residue Wet Clean for Cu/Low-k Damascene Structures / C.K. Chang ; C.F. Tsang ; V. Nguyen ; Q. Zhang ; T.H. Foo
Single Wafer Wet Cleaning Based on Short Cycle Time, Ambient Temperature and a Small Amount of Chemical / K.-I. Sano ; A. Izumi
Innovative Surface Preparation Solutions for Sub-90 nm Ic Devices / E. Baiya ; J. Rosato ; R. Yalamanchili
Predictive Model-Based Control of Critical Oxide Etches for Sub-100 nm Processes in a Single Wafer Wet Processing System / Y. Lu ; M.R. Yalamanchili
Non-IPA Wafer Drying Technology for Single-Spin Wet Cleaning / K. Miya ; T. Kishimoto
Front End of the Line Cleaning
Integration of High-k Gate Dielectrics--Wet Etch Cleaning and Surface Conditioning / S. De Gendt ; S. Beckx ; M. Caymax ; M. Claes ; T. Conard ; A. Delabie ; W. Deweerd ; D. Hellin ; H. Kraus ; B. Onsia ; V. Parishev ; R. Puurunen ; E. Rohr ; J. Snow ; W. Tsai ; S. Van Elshocht ; J. Vertommen ; T. Witters ; M. Heyns
Study of the Effect of Silicon Surfce Treatment on Eot in High-k Dielectric Mos Gate Stack / K. Chang ; K. Shanmugasundaram ; D.-O. Lee ; P. Roman J. Shallenberger ; F.-M. Chang ; J. Wang ; R. Beck P. Mumbauer ; R. Grant ; J. Ruzyllo
Atomic Layer Deposition of Silicon Nitride Barrier Layer for Self-Aligned Gate Stack / C. Finstad ; A. Muscat
Sub-Nanometer High -k Gate Stack Scaling Using the Hf-Last/NH[subscript 3] Anneal Interface / J. Peterson ; J. Barnett ; C. Young ; A. Hou ; J. Gutt ; S. Gopalan ; C.H. Lee ; H.J. Li ; N. Moumen ; N. Chaudhary ; B.H. Lee ; G. Bersuker ; P. Zietzoff ; G.A. Brown ; P. Lysaght ; M. Gardner ; R.W. Murto ; H. Huff
Improvements in Advanced Gate Oxide Electrical Performance by the Use of an Ozonated Water Clean Rpocess / D. Riley
Effect of Rie Sequence and Post-Rie Surface Processing on the Reliability of Gate Oxide in a Trench / T. Grebs ; R. Ridley ; C.-T. Wu ; R. Agarwal ; J. Mytych ; W. Dimachkie ; G. Dolny ; J. Michalowicz
Minimizing Oxide Loss in Immersion SC-1 Process / J. Butterbaugh ; S. Loper ; T. Wagener
Performance of an Advanced Front of the Line Clean Compared to the Process of Record Clean in a Manufacturing Environment / R. Novak ; I. Kashkoush ; J. Nolan ; J. Hunter ; J. Straight
The Mechanism of Poly-Si Etching During Poly/W Gate Cleaning by Fluorine Based Cleaning Solution / S.Y. Kim ; S.J. Choi ; C.K. Hong ; W.S. Han ; J.T. Moon
Physical and Chemical Methods of Particle Removal
Mechanisms of Particle Removal During Brush Scrubber Cleaning / K. Xu ; R. Vos ; P. Mertens ; C. Vinckier ; J. Fransaer
Evaluation of Megasonic Cleaning Systems for Particle Removal Efficiency and Damaging / F. Holsteyns ; J. Veltens ; M. Lux ; S. Arnatus ; K. Kenis
Mechanical Resistance of Fine Microstructures Related to Particle Cleaning Mechanisms / F. Tardif ; O. Raccurt ; J.C. Barbe ; F. De Crecy ; P. Besson ; A. Danel
Evaluation of Megasonic Cleaning Processes / A. Riskin ; A. Maes
Study of the Cleaning Control Using a Megahertz Nozzle Sound Pressure Monitor System for Single-Plate Spin Cleaners / H. Fujita ; N. Hayamizu ; T. Goshizono ; N. Sakurai
Experimental Validation of a Science-Based Undercut Removal Model for the Cleaning of Micron-Scale Particles from Surfaces / G. Kumar ; S. Beaudoin
Resonance Damage of Semiconductors by Acoustic Excitation / K. Christenson
Substrate Damage-Free Laser Shock Cleaning of Particles / J.G. Park ; A. Busnaina ; J.M. Lee ; S.Y. You
Effect of Surfactants on Particle Contamination of Silicon Surface in HF Solutions / T. Vehmas ; H. Ritala ; O. Anttila
Supercritical, Cryogenic, and Dry Cleaning
In Situ Process for Periodic Cleaning of Low Temperature Nitride Furnaces / D. Foster ; R. Herring ; J. Ellenberg ; A. Johnson ; C. Hartz
Making Supercritical Co[subscript 2] Cleaning Work: Proper Selection of Co-Solvents and Other Issues / A. Sehgal
Chemical Additive Formulations for Silicon Surface Cleaning in Supercritical Carbon Dioxide / M. Korzenski ; C. Xu ; T. Baum ; K. Saga ; H. Kuniyasu ; T. Hattori
Surfactant Enabled Supercritical Co[subscript 2] Cleaning Processes for Beol Applications: Post-Barrier Breakthrough / J. DeYoung ; S. Gross ; M. Wagner ; Z. Hatcher ; C. Ma
Co[subscript 2]--Expanded Liquids as Alternatives to Conventional Solvents for Resist and Residue Removal / M. Spuller ; D. Hess
Photoresist Stripping Using Supercritical Co[subscript 2]--Based Processes / V. Perrut ; C. Millet ; J. Daviot ; M. Rignon
Post-Etch Cleaning of 300 mm Dual Damascene Low-k Dielectric Structures Using Supercritical Co[subscript 2] / R.B. Turkot, Jr. ; V.S. RamachandraRao ; S.A. Iyer ; S.C. Clark
Impact of Phase Behavior on Photresist Removal Using Co[subscript 2] Based Mixtures / G. Levitin ; S. Myneni
Copper Low-k Contaminantion and Post Etch Residues Removal Using Supercritical Co[subscript 2]-Based Processes / L. Broussous ; O. Renault
Water Removal and Repair of Porous Ultra-Low k Films Using Supercritical Co[subscript 2] / B. Xie
Cleaning of Fragile Fine Structurers With Cryogenic Nitrogen Aerosols / H. Saito ; A. Munakata ; D. Ichishima ; T. Yamanishi ; A. Okamoto
Post-CMP Cleaning
Advanced Front end of the Line Clean for Post-CMP Processes / T. Nolan ; D. Nemeth
Low Carbon Contamination and Water Mark Free Post-CMP Cleaning of Hydrophobic Osg Dielectrics / K. Bartosh ; E. Brown ; S. Naghshineh ; D. Peters ; E. Walker
Adhesion and Removal of Silica and Alumina Slurry Particles During Cu CMP Process / J. Park ; A.A. Busnaina
Post-Copper CMP Cleaning Galvanic Phenomenon Investigated by Eis / C. Gabrielli ; E. Ostermann ; H. Perrot ; S. Mege
Aqueous Cryogenically Enhanced Post-Copper CMP Cleaning / S. Banerjee ; A. Via ; S. Joshi ; J. Eklund
Organic and Metal Contaminant Removal
Characterizing Etch Residue Removal From Low-k Ild Structures Using Aqueous and Non-Aqueous Chemistries / J. Moore ; C. Meuchel
Reversing of Silicon Surface Aging by Lamp Cleaning / J. Shallenberger
Advanced Photo Resist Removal Using O[subscript 3] and Moist Upw in Semiconductor Production / G. Philit ; L. von Aswege ; M. Madore ; K. Wolke ; M.-C. Clech ; E. Asselin-Degrange ; A. Chabli ; D. Louis
Cleaning Chemistry with Complexing Agents (CAs): Ca Degradation Monitoring by UV/VIS Spectroscopy / O. Doll ; B. Kolbesen
Additive Technologies for Sub 100 nm Device Cleaning / H. Morinaga ; A. Itou ; H. Mochizuki ; M. Ikemoto
Degradation of Oxide Properties Caused by Low-Level Metallic Contamination / A. Hoff ; E. Oborina ; S. Aravamudhan ; A. Isti
Cleaning Chemistry with Complexing Agents (CAs): Decomposition of CAs in Hydrogen Peroxide and Apm Studied with Hplc / S. Metzger ; B.O. Kolbesen
Cleaning of Metal Gate Stacks for the Sub 90 nm Technology Node / K. Vermeyen ; W. Fyen ; F. Kovacs
Passivation of Aluminum and Aluminum Copper Alloys in Aqueous Acid / I. Rink ; M. Knotter
Behaviour of Aluminum in Ozonated Water, optical and Electrochemical Study / A. Pehkonen ; K. Solehmainen ; L. Gronberg
Influence of Aluminum Bond Pad Suraface Condition on Probe Ability / K. Gunturu ; C. Hatcher ; K. Burnside ; T. Corsetti ; R. Lappan ; J. Prasad
Open Circuit and Galvanostatic Behavior of Copper Oxidized and Reduced in Various Solutions / M. Hughes
Author Index
Subject Index
Preface
The Science and Technology of the Functional Water / M. Toda ; S. Uryuu
Single Wafer Cleaning
20.

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図書
editors, T. D. Moustakas, S. E. Mohney, S. J. Pearton ; [sponsored by] Dielectric Science and Technology, Electronics, and High Temperature Materials Divisions
出版情報: Pennington, NJ : Electrochemical Society, c1999  vii, 230 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 98-18
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21.

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図書
editors, M. Cahay ... [et al.]
出版情報: Pennington, NJ : Electrochemical Society, c1999  xi, 690 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 98-19
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22.

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図書
edited by S. S. Li ... [et al.]
出版情報: Pennington, NJ : Electrochemical Society, c1999  vii, 242 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 98-21
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23.

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図書
editor, Yue Kuo
出版情報: Pennington, NJ : Electrochemical Society, c1999  xi, 428 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; 98-22
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24.

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図書
editors, M. D. Allendorf ... [et al.]
出版情報: Pennington, NJ : Electrochemical Society, c1999  xi, 486 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 98-23
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25.

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図書
editors, J. L. Davidson ... [et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c1998  xii, 696 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 97-32
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26.

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図書
editors, D. K. Schroder ... [et al.]. ; sponsoring divisions, Electronics and Photonics, Dielectric Science & Technology
出版情報: Pennington, N.J. : Electrochemical Society, c2007  viii, 394 p. ; 23 cm
シリーズ名: ECS transactions ; vol. 11, no. 3
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図書
editors, L. Cook ... [et al.] ; sponsoring divisions, Electronics and Photonics, Dielectric Science and Technology, High Temperature Materials
出版情報: Pennington, NJ : Electrochemical Society, c2006  ix, 334 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2003-31
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28.

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図書
editors: D. Misra, H. Iwai ; sponsoring division, Dielectric Science and Technology
出版情報: Pennington, N.J. : The Electrochemical Society, c2006  viii, 340 p. ; 23 cm
シリーズ名: ECS transactions ; vol. 2, no. 1
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図書
[editors, G. S. Mathad ... [et al.]]
出版情報: Pennington, N.J. : Electrochemical Society, c2006  186 p. ; 24 cm
シリーズ名: ECS transactions ; vol. 1, no. 11
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editors, H. Z. Massoud ... [et al.]; sponsoring divisions, Electronics and Photonics, Dielectrics Science and Technology
出版情報: Pennington, N.J. : Electrochemical Society, c2005  ix, 304 p. ; 24 cm
シリーズ名: ECS transactions ; vol. 1, no. 1
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editors, J. Ruzyllo ... [et al.] ; sponsoring divisions, Electronics and Photonics, Dielectric Science and Technology
出版情報: Pennington, NJ : Electrochemical Society, c2005  xi, 379 p. ; 24 cm
シリーズ名: ECS transactions ; vol. 1, no. 3
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図書
editors, K. Kondo ... [et al.] ; sponsoring divisions, Electrodeposition, Dielectric Science and Technology, Electronics
出版情報: Pennington, N.J. : Electrochemical Society, c2005  ix, 406 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-08
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editors, C. L. Claeys, W. Wong-Ng, K. M. Nair
出版情報: Pennington, NJ : Electrochemical Society, c2004  x, 318 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2003-27
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目次情報: 続きを見る
Preface
Low Temperature Electronics
HALO Effects on 0.13 [mu]m Floating-Body Partially Depleted SOI n-MOSFETs in Low Temperature Operation / J.A. Martino ; M. A. Pavanello ; E. Simoen ; C. Claeys
Emerging Double-gate MOS Device Technology / E. Suzuki ; Y. Liu ; M. Mashara ; K. Ishii
New Insights on the Cryogenic Self-Heating of Silicon MOSFETs: Thermal resistance of the Ceramic Package / F. J. De la Hidalga-W ; F. J. Cortes-P ; M. J. Deen
High Speed Conversion of Picosecond, Millivolt Pulse Signals to CMOS Voltage Levels / T. Van Duzer ; S. R. Whiteley ; X. Meng ; Q. Liu ; N. Yoshikawa
Operation of Double Gate Graded-Channel Transistors at Low Temperatures / J. A. Martino ; T. M. Chung ; A. Kranti ; J.-P. Raskin ; D. Flandre
Electrical Properties of a Boron Doped Amorphous Silicon Bolometer Operating at Low Temperatures / A. Heredia-J ; W. A. Torres-J ; A. Jaramillo-N
Cryogenic Operation of High-Voltage IGBTs / E. K. Mueller ; O. M. Mueller ; M. J. Henessy
Ge Semiconductor Devices for Cryogenic Power Electronics--IV / R. R. Ward ; W. J. Dawson ; L. Zhu ; R.K. Kirschman ; R. L. Patterson ; J. E. Dickman ; A. Hammoud
Analog Power and Digital Circuits at Cryogenic Temperatures for Space / V.J. Kapoor ; A. J. Menezes ; A. Vijh ; R.L. Patterson
SiGe Semiconductor Devices for Cryogenic Power Electronics / R. K. Kirschman ; O. Mueller
Liquid Helium Temperature Irradiation Effects on the Operation of 0.7 [mu]m CMOS Devices for Cryogenic Space Applications / A. Mercha ; Y. Creten ; J. Putzeys ; P. Mercken ; P. De Moor ; C. Van Hoof ; A. Mohammazadeh ; R. Nickson
Silicon Based Electronics: From Physical Curiosity to Quantum Computing
Low-Temperature Performance of Ultimate Si-Based MOSFETS / J. Jomaah ; G. Ghibaudo ; S. Cristoloveanu ; A. Vandooren ; F. Dieudonne ; J. Pretet ; F. Lime ; K. Oshima ; B. Guillaumot ; F. Balestra
Room-Temperature Synthesis and Characterization of Pure and Co-Doped ZnO / A. Manivannan ; G. Glaspell ; L. Riggs ; S. Underwood ; M.S. Seehra
Low Temperature Cofired Ceramic (LTCC) Based Electronic Devices
Processing and Reliability
Process and Material Challenges Associated with the Next Generation of LTCC Based Products / E. Elvey ; V. Wang ; M. Folk ; C. Tan ; F. Barlow ; A. Elshabini
Novel LTCC Fabrication Techniques Applied to a Rolled Micro Ion Mobility Spectrometer / K. Peterson ; S. Rhode ; K. Pfeifer ; T. Turner
Design of Integrated Modules for Wireless and RF Applications Using Multi-Mix Microtechnology and Green Tape LTCC Materials / J. J. Logothetis ; D. I. Amey ; T. P. Mobley
Plating to LTCC / T. Bloom ; F. Lautzenhiser ; M. Rine
Robocast High Zirconia Content (Pb,La,Zr,Ti)O[subscript 3] Dielectrics / D. Williams ; B. Tuttle ; J. Cesarano ; M. Rodriguez
Thermal Management Using Low Temperature Cofire Ceramic (LTCC) / W. K. Jones ; M. Zampino
Thermomechanical Reliability of LTCC Solder Attachments / Chia-Yu Fu
Interfacial Reactions in LTCC Materials / L. P. Cook ; W. Wong-Ng ; J. Suh
Thermoelectric Materials
Thermoelectric Measurements / T. P. Hogan ; S. Y. Loo ; F. Guo
High Temperature Power Factor Measurement System for Thermoelectric Materials / K.-F. Hsu ; M. G. Kanatzidis
Overview of Properties of "Metallic" Na[subscript x]Co[subscript 2]O[subscript 4] Thermoelectric Materials / T. M. Tritt ; X. Tang ; E. Abbott ; J. K. Kolis
Transport and Optical Properties of the Type II Clathrates Cs[subscript 8]Na[subscript 16]Si[subscript 136] and Si[subscript 136] / M. Beekman ; G. S. Nolas ; J. Gryko ; G. A. Lamberton, Jr. ; C. A. Kendziora
Devices and Applications
Lead Free Dielectric and Magnetic Materials for Integrated Passives / R. L. Wahlers ; M. Heinz ; A. H. Feingold
MEMs in Low Temperature Co-Fired Ceramics / A. Moll ; D. Plumlee
Miniaturized Single/Multi-level Bandpass Filters for LTCC Applications / R. K. Settaluri
Authors Index
Subject Index
Preface
Low Temperature Electronics
HALO Effects on 0.13 [mu]m Floating-Body Partially Depleted SOI n-MOSFETs in Low Temperature Operation / J.A. Martino ; M. A. Pavanello ; E. Simoen ; C. Claeys
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図書
editors, A. Goyal ... [et al.] ; sponsoring divisions, Electronics, and Dielectric Science and Technology
出版情報: Pennington, N.J. : Electrochemical Society, c2005  viii, 422 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2003-29
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35.

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図書
editors, J. L. Davidson ... [et al.] ; sponsoring divisions, Electronics, Sensor, Dielectric Science and Technology
出版情報: Pennington, N.J. : Electrochemical Society, c2004  viii, 339 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2004-09
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36.

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図書
editors, R.E. Sah ... [et al.] ; sponsoring divisions, Dielecric Scoeice and Technology, Electronics
出版情報: Pennington, N.J. : Electrochemical Society, c2005  xiii, 588 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2005-01
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37.

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図書
editors, M. Cahay ... [et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics, High Temperature Materials, and New Technologies Subcommittee
出版情報: Pennington, NJ : Electrochemical Society, c2005  xi, 662 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2004-13
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38.

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図書
editors: D. Misra ... [et al.] ; sponsoring division, Dielectric Science and Technology
出版情報: Pennington, N.J. : The Electrochemical Society, c2008  ix, 405 p. ; 23 cm
シリーズ名: ECS transactions ; vol. 13, no. 2
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図書
editor, L. Mendicino ; assistant editor, L. Simpson
出版情報: Pennington, NJ : Electrochemical Society, c1999  viii, 246 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 99-8
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図書
editors, K. B. Sundaram ... [et al.] ; Dielectric Science and Technology and Electronics Divisions, and High Temperature Materials Divisions [of the Electrochemical Society]
出版情報: Pennington, New Jersey : Electrochemical Society, c1999  xi, 284 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 99-6
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図書
editors, P. C. Andricacos ...[et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c1999  ix, 400 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 99-9
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目次情報: 続きを見る
Superconformal Electrodeposition of Copper / T.P. Moffat ; J.E. Bonevich ; W.H. Huber ; A. Stanishevshky ; D.R. Kelly ; G.R. Stafford ; D. Josell
Magnetic Nanowire Arrays Obtained by Electrodeposition In Ordered Alumina Templates / K. Nielsch ; F. Muller ; G. Liu ; R.B. Wehrspohn ; U. Gosele ; S.F. Fischer ; H. Kronmuller
Mapping Alloy Electrodeposition Conditions Onto Deposit Characteristics for Microelectrode Arrays / Jason Thomas ; Daniel A. Buttry ; John Pope ; Donald Montgomery
Experimental Conditions for CdSe Layer - by - Layer Growth / F. Loglio ; M. Innocenti ; G. Pezzatini ; F. Forni ; M.L. Foresti
Potential Dependence of InAs Formation by ECALE at Room Temperature / Raman Vaidyanathan ; Travis L. Wade ; Uwe Happek ; John L. Stickney
A Study of Electrochemically Deposited Copper on PVD Copper and TiN Using a Cu-EDTA Complexed Bath / Lyndon Graham ; Christoph Steinbruchel ; David J. Duquette
Analysis of Copper Plating Baths - New Developments / Edward Kaiser ; Beverly Newton ; Robert Joyce ; Jeffrey Rohrer ; Kshama B. Jirage ; Chin Chang Cheng ; Richard Hurtubise
Role of Damascene Via Filling Additives - Morphology Evolution / Kazuo Kondo ; Katsuhiko Hayashi ; Zennosuke Tanaka ; Norihiro Yamakawa
Copper Electrodeposition for On - Chip Interconnection - The Role Of Different Additives / P.L. Cavallotti ; R. Vallauri ; A. Vicenzo
Monitoring of SPS - Based Additives in Cu Plating / Jean Horkans ; John Dukovic
Trends in Properties of Electroplated Cu with Plating Conditions and Chemistry / Cyril Cabral, Jr. ; Kenneth P. Rodbell ; Christopher Parks ; Michael A. Gribelyuk ; Sandra Malhotra ; Panayotis C. Andricacos
Contact Resistance in Copper Plating on Wafers - Analysis and Design Criteria / Yezdi Dordi ; Uziel Landau ; Jayant Lakshmikanthan ; Joe Stevens ; Peter Hey ; Andrew Lipin
Shape Evolution of Copper Electrodeposition: Numerical and Experimental Investigation / M. Georgiadou ; D. Papapanayiotou ; D. Veyret ; R.L. Sani ; R.C. Alkire
Model of Superfilling in Damascene Electroplating: Comparison of Experimental Feature Filling with Model Predictions / H. Deligianni ; J. Horkans ; K. Kwietniak ; J.O. Dukovic ; P.C. Andricacos ; S. Boettcher ; S.-C. Seo ; P. Locke ; A. Simon ; S. Seymour ; S. Malhotra
Feature Scale Simulation of Copper Deposition for IC Interconnection / Bang-Hao Wu ; Yung-Yun Wang ; Chi-Chao Wan
The Electrochemistry of the Active State of Copper / L.D. Burke ; J.A. Collins ; M.A. Murphy ; A.M. O'Connell
The Effects of Process Conditions on the Residual Stress and Composition of Electroless Nickel Films for MEMS / Seung Hwan Yi ; F.J. Von Preissig ; Euk Sok Kim
Novel Porous Silicon Formation Technology Using Internal Current Generation / A. Splinter ; J. Sturmann ; W. Benecke
Surface in Fluoride Solution Studied by Attenyated Total Reflection Fourier Transform Infrared and X-Ray Photoelectron Spectroscopy / Shen Ye ; Taro Ishihara ; Kohei Uosaki
Cathodic Reactions in Copper Chemical Mechanical Polishing: The Cu/Fe[superscript 3+] and Cu/H[subscript 2]O[subscript 2] Systems / Ashraf T. Al-Hinai ; Kwadwo Osseo-Asare
Novel STI CMP Process Using Highly Selective Ceria Slurry with Thin Nitride Stopper / Jung-Yup Kim ; Jung Hun Park ; Bo Un Yoon ; Sangrok Hah ; Joo-Tae Moon
Oxidation and Dissolution Characteristics of Tungsten: Application To Chemical Mechanical Polishing / M. Anik ; K. Osseo-Asare
Electrodeposition of Copper Onto Silicon Surfaces from Copper Sulfate Solutions / Chunxin Ji ; Gerko Oskam ; Peter C. Searson
Author Index
Subject Index
Superconformal Electrodeposition of Copper / T.P. Moffat ; J.E. Bonevich ; W.H. Huber ; A. Stanishevshky ; D.R. Kelly ; G.R. Stafford ; D. Josell
Magnetic Nanowire Arrays Obtained by Electrodeposition In Ordered Alumina Templates / K. Nielsch ; F. Muller ; G. Liu ; R.B. Wehrspohn ; U. Gosele ; S.F. Fischer ; H. Kronmuller
Mapping Alloy Electrodeposition Conditions Onto Deposit Characteristics for Microelectrode Arrays / Jason Thomas ; Daniel A. Buttry ; John Pope ; Donald Montgomery
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editors, M. Meyyappan, D.J. Economou, S.W. Butler ; [sponsored by] Dielectric Science and Technology and Electronics Divisions
出版情報: Pennington, NJ : Electrochemical Society, c1997  ix, 347 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 97-9
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図書
editors, Hazara S. Rathore ... [et al.]
出版情報: Pennington, NJ : Electrochemical Society, c1997  viii, 262 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 97-8
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図書
editors M. Jamal Deen ... [et al.] ; Dielectric Science and Technology and Electronics Divisions [of the Electrochemical Society]
出版情報: Pennington, New Jersey : Electrochemical Society, c1997  xiii, 588 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 97-10
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図書
editors, M. Cahay ... [et al.]
出版情報: Pennington, NJ : Electrochemical Society, c1997  x, 494 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 97-11
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図書
editors, Mark D. Allendorf, Claude Bernard
出版情報: Pennington, NJ : Electrochemical Society, c1997  xxii, 1652 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 97-25
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editors, G.S. Mathad, M. Meyyappan, M. Engelhardt ; Dielectric Science & Technology, Electronics, and Electrodeposition Divisions
出版情報: Pennington, NJ : Electrochemical Society, c1998  ix, 370 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 97-30
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図書
editor, Hazara S. Rathore ... [et al.]
出版情報: Pennington, NJ : Electrochemical Society, c1998  viii, 276 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 97-31
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図書
edited by Sheng S. Li, H. C. Liu, M.Z. Tidrow
出版情報: Pennington, NJ : Electrochemical Society, c1997  vii, 280 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 97-33
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図書
editors, C.R. Abernathy ... [et al.] ; Dielectric Science & Technology, Electronics, and High Temperature Material[s] Divisions of the Electrochemical Society [and] European III-V Nitride Community
出版情報: Pennington, NJ : Electrochemical Society, c1998  viii, 294 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 97-34
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51.

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図書
editors W.D. Brown ... [et al.] ; Dielectric Science and Technology, and Electronics Divisions [of the Electrochemical Society]
出版情報: Pennington, NJ : Electrochemical Society, c1998  x, 366 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 98-3
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図書
editor, G.S. Mathad ; [sponsored by] Dielectric Science & Technology and electronics Divisions
出版情報: Pennington, NJ : the Electrochemical Society, Inc., c1998  viii, 292 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 98-4
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53.

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editors, S. Raghavan, R.L. Opila, L. Zhang ; Electronics and Dielectric Science and Technology Divisions [of the Electrochemical Society]
出版情報: Pennington, N. J. : Electrochemical Society, c1998  viii, 274 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 98-7
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54.

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図書
editors, P. C. Andricacos ...[et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c1999  viii, 274 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 98-6
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editors, Peter J. Hesketh, Henry Hughes, Wayne E. Bailey
出版情報: Pennington, NJ : Electrochemical Society, c1998  viii, 270 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 98-14
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56.

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図書
editors, M. Cahay ... [et al.]
出版情報: Pennington, NJ : Electrochemical Society, Inc., c1999  ix, 504 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; 99-22
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57.

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図書
editors, P. Vanƴsek ... [et al.] ; sponsoring divisions, Electrodeposition, Dielectric Science and Technology, Physical Electrochemistry, and Corrosion
出版情報: Pennington, N.J. : Electrochemical Society, c2002  xii, 228 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; 2000-30
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58.

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図書
editor, Y. Kuo ; sponsoring divisions, Electronics, Dielectric Science and Technology
出版情報: Pennington, N.J. : Electrochemical Society, c2003  ix, 306 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; 2002-23
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59.

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図書
editors, E.J. Brandon ... [et al.] ; sponsoring divisions, Energy Technology, Battery, Dielectri Science and Technology, Electronics
出版情報: Pennington, N.J. : Electrochemical Society, c2003  vii, 228 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; 2002-25
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60.

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図書
editor, G.S. Mathad ; assistant editors, T. S. Cale ...[et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics
出版情報: Pennington, N.J. : Electrochemical Society, c2003  x, 424 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2003-13
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目次情報: 続きを見る
Preface
Plasma Processing for the 100 nm Node / Part I:
Plasma Processes
Kinetic Modeling for Multi-Component Thin Film Growth in Plasma-Enhanced Atomic Layer Deposition / J-H. Kim ; J-Y. Kim ; P-K. Park ; S-W. Kang
Incidence of Deposition Parameters on the Structural Properties of Y[subscript 2]O[subscript 3] Grown by Pulsed Injection PE-MOCVD / C. Durand ; C. Vallee ; O. Salicio ; V. Loup ; M. Bonavalot ; O. Joubert ; C. Dubourdieu
Copper-Barrier and Hard-Mask Elaboration by Plasma-Enhanced Chemical Vapor Deposition Using Organosilane Precursors / B. Remiat ; F. Fusalba ; P. Maury ; V. Jousseaume ; C. Lecornec ; F. Gaillard ; J. Durand
Gas-Phase and Surface Reactions in Plasma Enhanced Chemical Etching of High-k Dielectrics / L. Sha ; J.P. Chang
A Comparative Study of the Etching Behavior of Thin AlN and Al[subscript 2]O[subscript 3] Films / M. Engelhardt
Etching of Low-k Interconnect Materials for Next Generation Devices / T. Chevolleau ; N. Posseme ; L. Vallier ; I. Thomas-Boutherin
Resist Transformation during Etching Steps Involved in Patterning Low-k Dielectric Materials: Impact on Process Control / E. Pargon
Adhesion of Copper and Sulfur-Modified SiLK / D.-L. Bae ; J.J. Senkevich ; C. Kezewski ; Y. Kwon ; T.S. Cale
Porous SiOCH Modification Studies Induced by Ashing Processes / Thomas-Boutherin
Modeling Investigation of Plasma Clean Processes / D. Zhang ; D. Denning
Copper Interconnects with Low-k Inter Level Dielectric Films / Part II:
Copper Deposition
Preparation of Cu Films on Polymer Substrate by ECR-MOCVD Coupled with DC Bias at Room Temperature / J-K. Lee ; B-W. Cho
Effect of Novel Plasma Treatment on Superfilling Behavior in Chemically Enhanced CVD (CECVD) Cu Process / S-G. Pyo ; W-S, Min ; D-W. Lee ; S. Kim ; J-G. Lee
A Model of Copper Deposition for the Damascene Process / C. Gabrielli ; J. Kittel ; P. Mocoteguy ; H. Perrot ; A. Zdunek ; P. Bouard ; M. Haddix ; L. Doyen ; M.C. Clech
AFM Observation of Microstructural Evolution at Room Temperature in Electrodeposited Copper Metallization / S. Ahmed ; D.N. Buckley ; A. Arshak ; A.M. O'Connell ; L.D. Burke
"Seedless" Electrochemical Deposition of Copper on Liner-Materials for ULSI Devices / D.J. Duquette ; S.J. Kim ; M.J. Shaw
Electroless Metallization of Hydrogen-Terminated Si[left angle bracket]100[right angle bracket] Surface Functionalized by Viologen / W.H. Yu ; E.T. Kang ; K.G. Neoh
Barrier and Low-k Films
TiZrN as a Copper Barrier for 0.13 [mu]m and 0.09 [mu]mTechnology Nodes / L. Swedberg ; C. Prindle
Nanostructured Ta-Si-N Thin Films as Diffusion Barriers between Cu and SiO[subscript 2] / L.W. Lai ; C.C. Chang ; J.S. Chen ; Y.K. Lin
Selectivity Studies on Tantalum Barrier Layer for Copper Chemical Mechanical Planarization / A. Vijayakumar ; T. Du ; K.B. Sundaram ; V. Desai
Investigation of Barrier Layers for Cu-Ultra Low-k Porous Polymer Integration / L.Y. Yang ; D.H. Zhang ; C.Y. Li ; P.D. Foo ; K. Prasad ; C.M. Tan
Atomic Layer Deposition of Ruthenium Glue Layer for Copper Damascene Interconnect / O-K. Kwon
Introducing Advanced ULK Dielectric Mateials in Interconnects: Performance and Integration Challenges / C. Le Cornec ; K. Haxaire ; T. Mourier ; P.H. Haumesser ; S. Maitrejean ; J. Simon ; A. Chabli ; G. Passemard
Surface Modification of Porous Low-k Dielectrics / Q.T. Le ; C.M. Whelan ; H. Struyf ; S.H. Brongersma ; T. Conard ; W. Boullart ; S. Vanhaelemeersch ; K. Maex
Structural and Electrical Characteristics of Low Dielectric Constant Porous Hydrogen Silsesquioxane for Cu Metallization / J.H. Wang ; P.T. Liu ; T.C. Chang ; W.J. Chen ; S.L. Cheng ; J.Y. Lin ; L.J. Chen
Nanoporous Low-k Polyimide Films Prepared from Poly(Amic Acid) with Grafted Poly(Acrylic Acid)/Poly (Ethylene Glycol) Side Chains / W.C. Wang ; C.K. Ong ; L.F. Chen
X-Ray Photoelectron Spectroscopic Study of Surface Modification of SiLK under UV-Irradiation / Y. Uchida ; T. Fukuda ; H. Yanazawa
Characteristics of Low-k Methyl-Silsesquiazane (MSZ) for CMP Process Using Oxygen Plasma Treatment / T.M. Tsai ; S.T. Yan ; Y.C. Chang ; H. Aoki ; T.Y. Tseng
Copper CMP and Reliability
Electrochemical Planarization of Copper
A Multiscale Mechanical CMP Model for Patterned Wafers / J. Seok ; C.P. Sukam ; A.T. Kim ; J.A. Tichy
The Roles of Complexing Agents on Copper CMP / G. Lim ; T.E. Kim ; J.-H. Lee ; J. Kim ; H.-W. Lee
The Effect of Inhibitor and Complexing Agents on Cu CMP / Y. Luo
Role of Oxidizer and Inhibitor on Chemical Mechanical Planarization of Copper / S.C. Kuiry ; S. Seal
Effect of Abrasive Particles on Chemical Mechanical Polishing Performance / D. Tamboli ; G. Banerjee ; S. Chang ; M. Waddell ; I. Butcher ; Q. Arefeen ; S. Hymes
Chemical Mechanical Planarization of Ruthenium for Capacitor Bottom Electrode in DRAM Technology / S-H. Lee ; Y-J. Kang ; J-G. Park ; S-I. Lee
Industry Challenges in Post-Etch Cleaning Chemistries for Advanced Copper/Low-k Applications / M.A. Fury
Cleaning of Copper Surface Using Vapor-Phase Organic Acids / T. Yagishita ; K. Ishikawa ; M. Nakamura
Time-Zero Failure Current Measurement for Early Monitoring of Defective Cu Lines at Wafer Level / J-H. Park ; B-T. Ahn
Annealing Characteristics of Copper Films for Power Device Applications / L. Castoldi ; S. Morin ; G. Visalli ; T. Fukada ; M. Ouaknine ; E.H. Roh ; W.S. Yoo
The Stability of Carbon-Doped Silicon Oxide Low Dielectric Constant Thin Films / Y.H. Wang ; R. Kumar
Nickel Silicide Formation Using a Stacked Hotplate-Based Low Temperature Annealing System / T. Murakami ; B. Froment ; V. Carron ; W-S. Yoo
3-D Interconnects
3-D Electromigration Modeling and Simulation in Aluminum-Silicon Dioxide and Copper-Low-k Multilevel Interconnects / V. Sukharev ; R. Choudhary ; C.W. Park
Transient Thermal and Mechanical Modeling of 3D-IC Structures / J. Zhang ; J.-Q. Lu ; R.J. Gutmann
3D System-on-a-Chip Using Dielectric Glue Bonding and Cu Damascene Inter-Wafer Interconnects / A. Jindal ; J.J. McMahon ; K.-W. Lee ; R.P. Craft ; B. Altemus ; D. Cheng ; E. Eisenbraum
The Impact of Wafer-Level Layer Transfer on High Performance Devices and Circuits for 3D IC Fabrication / K.W. Guarini ; A.W. Topol ; M. Ieong ; K. Bernstein ; K. Xiu ; R.V. Joshi ; R. Yu ; L. Shi ; M.R. Newport ; D.V. Singh ; G.M. Cohen ; H.B. Pogge ; S. Purushothaman ; W.E. Haensch
Wafer Bonding and Thinning Integrity for 3D-IC Fabrication
Author Index
Subject Index
Preface
Plasma Processing for the 100 nm Node / Part I:
Plasma Processes
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図書
editors, M. Cahay ... [et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics, and Luminescene an Display Materials
出版情報: Pennington, NJ : Electrochemical Society, Inc., c2002  viii, 218 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2002-9
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図書
editors, P.J. Timans ... [et al.] ; sponsoring deivisions, Electronics, Dielectric Science and Technology, and High Temperature Materials
出版情報: Pennington, NJ : Electrochemical Society, c2002  xiii, 478 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2002-11
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図書
editor, L. Mendicino ; sponsoring divisions, Dielectric Science and Technology and Electroncis
出版情報: Pennington, N.J. : Electrochemical Society, c2002  viii, 262 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2002-15
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目次情報: 続きを見る
Process Emissions Characterization and Treatment / A.:
Emissions Characterization of Advanced CVD Processes and Abatement Performance / V. Vartanian ; B. Goolsby ; C. Reddy ; V. Arunachalam ; L. Mendicino
Effective Management of Process Exhaust from Low-K CVD Processes / S. Carss ; A. Seeley ; J. Van Gompel
Development and Evaluation of the ATMI CDO 865 for Abatement of Low-K Process Effluent / B. Flippo ; R. Vermeulen
Managing Fluorine Emissions at Semiconductor Fabrication Facilities / M. Smylie
Characterization of Plasma-Etched RuO[subscript 2] Substrates / S. Samavedam ; L Mendicino ; J.J. Lee ; T. Guenther ; S. Dakshina-Murthy ; C. Sparks
Evaluation of Ozone Emissions Destruction Units for SACVD Process Tools / C. Nauert ; R. Camacho ; B. Day ; R. Lathrop ; H. Kwong ; J. Fox
Potential Cost of Ownership Reduction for a Nitride Furnace Point of Use Abatement Device / B. Davis ; M. Rossow
Electrochemical Removal of Hydrogen Sulfide from Geothermal Brines / B.G. Ateya ; F.M. AlKharafi
PFC Emissions Reduction / B.:
The Evaluation of Hexafluoro-1,3-Butadiene as an Environmentally Benign Dielectric Etch Chemistry in a Medium Density Etch Chamber / R. Chatterjee ; R. Reif ; T. Sparks
Post-Pump PFC Abatement by Atmospheric Microwave Plasmas: Completion of Metal Etch Beta Test / J.C. Rostaing ; D. Guerin ; C. Larquet ; A. El-Krid ; C.H. Ly ; J. Bruat ; E. Coffre ; M. Moisan ; H. Dulphy ; P. Moine ; J. Wiechers
Characterization of NF[subscript 3] Chamber Cleans on Multiple CVD Platforms / J. Rivers ; J. Vires ; A. Soyemi ; S.P. Sun ; M. Turner ; C. Esber
Reduction of PFC Emissions Through Process Advances in CVD Chamber Cleaning / S. Hsu ; C. Allgood ; M. Mocella
PFC Emissions Reduction and Process Improvements with Remote Plasma CVD Chamber Cleans / P.T. Brown ; S. Filipiak ; H. Estep ; M. Fletcher
Thermal Reductive Destruction of Perfluorocarbons into Safe Products Through In-situ Generation of Alkali Metals in Heated Solid Mixtures / M.C. Lee ; W. Choi
Alternative Cleans Technologies and Emerging Issues / C.:
Post Oxide Etching Cleaning Process Using Integrated Ashing and HF Vapor Process / O. Kwon ; H. Sawin
Fluorocarbon Film and Residue Removal Using Supercritical CO[subscript 2] Mixtures / S. Myneni ; D. Hess
A Summary of Recent Motorola Water Conservation Efforts from Source Reduction of Process Equipment / B. Raley ; T. Dietrich
Partnerships to Address EHS Aspects of Chemical Management in the Semiconductor Industry: Lessons from the PFAS Experience / M. Bowden ; L. Beu ; S. Pawsat
PFAS: Treatment Options and Sampling Methods / K. Barbee ; L. Lovejoy
EHS Risk Assessment and Management / D.:
Concepts and Application of Risk Management of Address Business Needs / S. Trammell ; J. Heironimus
Emergency Preparedness and Response for Semiconductor Manufacturing / S. Harris
Environmental Health and Safety (EHS) Investigation of CVD Exhaust System: Identification and Mitigation of Potential Release of Process Gases and By-products / L. Chandna ; A. Reynoso ; K. Hendricksen
Point of Use Abatement Unit By-Pass for NF[subscript 3]-Based CVD Chamber Clean Applications / D. Babbitt
Process Emissions Characterization and Treatment / A.:
Emissions Characterization of Advanced CVD Processes and Abatement Performance / V. Vartanian ; B. Goolsby ; C. Reddy ; V. Arunachalam ; L. Mendicino
Effective Management of Process Exhaust from Low-K CVD Processes / S. Carss ; A. Seeley ; J. Van Gompel
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図書
editor, G.S. Mathad ; assistant editors, M.D. Allendorf, R.E. Sah, M. Yang ; sponsoring divisions, Dielectric Science and Technology and Electronics
出版情報: Pennington, N.J. : Electrochemical Society, c2002  ix, 324 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2002-17
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目次情報: 続きを見る
Preface
Plasma Enhanced Deposition
Process and Material Properties of PECVD Boron-doped Amorphous Silicon Films / H. Nominanda ; Y. Kuo
Properties of Boron-doped Amorphous Silicon Films Obtained with a Low Frequency Plasma / A. Heredia-J ; A. Torres-J ; A. Jaramillo-N ; F.J. De la Hidalga-W ; C. Zuniga-I ; A. Munguia-C
Si Epitaxial Growth on Atomic-Order Nitrided Si (100) using an ECR Plasma / M. Mori ; T. Seino ; D. Muto ; M. Sakuraba ; J. Murota
Optimizing Pulse Protocols in Plasma-Enhanced Atomic Layer Deposition / V. Prasad ; M.K. Gobbert ; T.S. Cale
High Density Plasma Deposited Silicon Nitride Films for Coating InGaAlAs High-Power Lasers / R.E. Sah ; F. Rinner ; R. Keifer ; M. Mikulla ; G. Weimann
High Productivity 300 mm HDP-CVD for Next-Generation Gap Fill Processes / B. Geoffrion ; N. Dubey ; P. Krishnaraj
Modeling & Mechanisms
Plasma Hydrogenation of a Buried Trap Layer in Silicon: Formation of a Platelet Layer / A.Y. Usenko ; W.N. Carr ; B. Chen
Integrated Modeling Investigation of Plasma Dielectric Etching Processes / D. Zhang ; S. Rauf ; T.G. Sparks ; P.L.G. Ventzek
Plasma-Surface Kinetics and Feature Profile Evolution in Cl[subscript 2] + HBr Etching of Poly-silicon / W. Jin ; S.A. Vitale ; H.H. Sawin
Surface Treatment of SiC using NF[subscript 3]/O[subscript 2] Plasmas / T. Kai ; W. Shimizu ; A. Hibi ; T. Iwase ; T. Abe ; M. Inaba ; Z. Ogumi ; T. Tojo ; A. Taska
Quantitative Analysis and Comparison of Endpoint Detection Based on Multiple Wavelength Analysis - Part I: Multi-Wavelength Method / B.E. Goodlin ; D.S. Boning
Quantitative Analysis and Comparison of Endpoint Detection Based on Multiple Wavelength Analysis - Part II: Noise Analysis of Multi-Wavelength OES
Equipment / Plasma Etching II:
Investigations of 300 mm Wafer Tool Set Progress and Performance / K. Mautz
Simultaneous Fault Detection and Classification for Semiconductor Manufacturing Tools / B.M. Wise
Effects of Showerhead Face Chemistry on Capacitively Coupled Plasma Discharges / B. Devulapalli ; G.I. Font
Gate Dielectrics and Silicon / Plasma Etching III:
Differential Surface Charging of the Dielectric during Plasma Etching and Surface Charge Leakage Kinetic / M.K. Abatchev ; B.J. Howard ; D.S. Becker ; R.L. Stocks ; J. Chapman
Thickness Scaling of Gate Dielectric on Plasma Charging Damage in MOS Devices / K-S. Chang-Liao ; P-J. Tzeng
Gate Oxide Integrity and Micro-loading Characterization of 300 mm Process Tools
Measurement of Device Charging Damage in a Dielectric Etch 300 mm Chamber with a Bias Voltage Diagnostic Cathode / M.C. Kutney ; S. Ma ; K. Horioka ; R. Lindley ; S. Kats ; T. Kropewnicki ; K. Doan ; H. Shan
Etching of High-k Gate Dielectrics and Gate Metal Candidates / S.K. Han ; I. Kim ; H. Zhong ; G.P. Heuss ; J.H. Lee ; D. Wicaksana ; J.P. Maria ; V. Misra ; C.M. Osburn
Etching High Aspect Ratio Silicon Trenches / S. Panda ; R. Ranade ; G.S. Mathad
Inverse Micro-loading Effect in Reactive Ion Etching of Silicon / S. Jensen ; O. Hansen
Plasma Etched Micro-machined Silicon Stampers for Plastic Bio-Technology Applications / D. Weston ; W.J. Dauksher ; D. Rhine ; T. Smekal ; P.J. Stout
Silicon Dioxide / Plasma Etching IV:
Radical Control in a Hole to Break an Etch-Stop Barrier in Highly Selective HAC Etching / N. Negishi ; K. Yokogawa ; T. Yoshida ; M. Izawa
Etching vs Deposition: The Effect on Profiles and Etching Yield Curves for Oxide Etching / O. Kwon
Dual Damascene, Low-k / Plasma Etching V:
Effect of Oxygen and Nitrogen Additions on Silicon Nitride Reactive Ion Etching in Fluorine Containing Plasmas / C. Reyes-Betanzo ; S.A. Moshkalyov ; A.C.S. Ramos ; M.A. Cotta ; J.W. Swart
A Novel Approach to Reduce Via Corner Faceting in the Via-First, No Middle Stop Layer Dual Damascene Trench Etch / Y-S. Kim ; K.L. Doan ; C. Bjorkman ; A. Paterson ; Z. Sui
Patterning 180 nm Copper Oxide Dual Damascene Baseline with 193 nm Resists / V. Bakshi ; G. Smith
Copper Fine Patterns Etched with HBr Plasma Based Processes / S. Lee
Intellectual Property Creation from Semiconductor Process and Equipment Development
Author Index
Subject Index
Preface
Plasma Enhanced Deposition
Process and Material Properties of PECVD Boron-doped Amorphous Silicon Films / H. Nominanda ; Y. Kuo
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図書
editors, M. Cahay ... [et. al] ; sponsoring divisions, Dielectric Science and Technology, Electronics, and Luminescence and Display Materials
出版情報: Pennington, N.J. : Electrochemical Society, c2002  viii, 416 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2002-18
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目次情報: 続きを見る
Preface
Carbon Nanotubes
Quantum Interference Effects in the Nanotriode / S. Johnson ; A. Blackburn ; A. Driskill-Smith ; D. Hasko ; H. Ahmed
Microgated In-Situ Grown Carbon Nanotube Field Emitter Arrays / D. Hsu ; J. Shaw
A Micromachined On-chip Vacuum Microtriode Using a Carbon Nanotube Cold Cathode / W. Zhu ; L.H. Chen ; C. Bower ; D. Shalom ; D. Lopez
Electron Emission Microscopy Measurements of Nitrogen and Sulfer Doped Carbon Films / F. Koeck ; S. Gupta ; B.R. Weiner ; G. Morell ; J.M. Garguilo ; B. Brown ; R.J. Nemanich
Carbon Nanotubes for Future Field Electron Emission Devices / O. Groning ; R. Clergeraux ; L. Nilsson ; P. Ruffieux ; L. Schlapbach ; P. Groning
Saturated Emmision from Carbon Nanotubes
Fabrication and Characterization of Field Emission Devices Based on Single Vertically Aligned Carbon Nanofibers / M.A. Guillorn ; V.I. Merkulov ; A.V. Melechko ; E.D. Ellis ; L.R. Baylor ; D.K. Hensley ; R.J. Kasica ; T.R. Subich ; D. Lowndes ; M.L. Simpson
Atom-by-atom Analysis of Field Emission Sources by the Scanning Atom Probe / O. Nishikawa ; T. Yagyu ; T. Murakami ; M. Watanabe ; M. Taniguchi ; T. Kuzumaki ; S. Kondo
Field Emitter Arrays
Microfabricated Field Emitter Performance Enhancement by High Current Processing / P.R. Schwoebel ; C.A. Spindt ; C.E. Holland
Study of Emitter Materials for use in Hostile Environments / W.A. Mackie ; C. Dandeneau ; L.A. Southall ; F.M. Charbonnier
Intelligent Silicon Field Emission Arrays / C.Y. Hong ; A.I. Akinwande
Field Emission Array Cathode Material Selection for Compatibility with Electric Propulsion Applications / C.M. Marrese-Reading ; J. Polk ; B. Koel ; M. Quinlan
Field Induced Thickening of Au-coated Nanosize Si-tip and Field Emission from PR-coated Si-tip / S.S. Choi ; M.Y. Jung ; D.W. Kim ; M.S. Joo
Field Emission Study of Ti-Silicide Array / S.B. Kim ; H.T. Jeon
Theory and Simulation
Emissive and Cooling Properties of Carbon Based Materials for Microelectronics / N.M Miskovsky ; P.H. Cutler ; A. Mayer ; P.B. Lerner
Modeling Device Performance and Feature Variation in Microtip Field Emitters / J. Zuber ; K.L. Jensen
Simulations of Transport and Field-Emission Properties of Multi-wall Carbon Nanotubes / N.M. Miskovsky
Equilibrium Theory of Nanotips / G. Bilbro
An Analysis of FEA Noise Mechanisms / M. Cahay
Sub-Poissonian and Super-Poissonian Shot Noise in Planar Cold Cathodes / R. Krishnan
Electrostatic Factors Affecting Emission From Discrete Isolated Diamond Nanodots / D.L. Jaeger ; T. Tyler ; A.K. Kvit ; J.J. Hren ; V.V. Zhirnov
Current Density Evaluation At The Barrier Maximum / P. O'Shea ; D. Feldman
Tunnel Charcateristics of the Metal Tip-Cathodes with the Superthin Diamond Coatings Using Non-Local Considerations / L. Il'chenko ; V. Il'chenko ; R.M. Novosad ; Y.V. Kryuchenko
About Theoretical Calculation of Semiconductor's Surface Images for Closely Spaced Semiconductor and Metal in STM
Thin films and Nanostructures
Emission from GaN p-n Junction Cold Cathodes / R. Treece ; D. Patel ; C. Menoni ; J. Smith ; J. Pankove
Effect of Film Thickness on Low-Energy Electron Transmission in Thin CVD Diamond Films / J. Yater ; A. Shih ; J. Butler ; P. Pehrsson
Growth and Characterization of LaS and NdS Thin Films on Si, GaAs, and InP Substrates / Y. Modukuru ; J. Thachery ; P. Boolchand ; J. Grant
Surface-Emitting Ballistic Cold Cathodes Based on Nanocrystalline Silicon Diodes / N. Koshida ; K. Kojima ; Y. Nakajima ; T. Ichihara ; Y. Watabe ; T. Komoda
Microwave-Tube Experiments Utilizing Ferroelectric Electron-Gun / M. Einat ; E. Jerby ; G. Rosenman
Author Index
Subject Index
Preface
Carbon Nanotubes
Quantum Interference Effects in the Nanotriode / S. Johnson ; A. Blackburn ; A. Driskill-Smith ; D. Hasko ; H. Ahmed
66.

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図書
editors, G.M. Swain ... [et al.] ; sponsoring divisions, Dielectric Science and Technology, High Temperature Materials, and Electronics
出版情報: Pennington, N.J. : Electrochemical Society, c2002  ix, 290 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-25
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67.

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図書
editor, G.S. Mathad ; assistant editors, B.C. Baker ... [et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics, Electrodeposition
出版情報: Pennington, N.J. : Electrochemical Society, c2003  ix, 346 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2002-22
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図書
editors, D. misra, K. Wörhoff, P. Mascher ; sponsoring divisions, Dielectric Science and Technology, Electronics
出版情報: Pennington, N.J. : Electrochemical Society, c2003  ix, 436 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2003-1
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目次情報: 続きを見る
Preface
Biosystems and Microsystems / I.:
Ion Track Nanostructuring of Dielectrics / K. Hjort ; E. Balanzat ; C. Trautmann ; M. Toulemonde ; A. Weidinger
Design, Integration and Performance Evaluation of Optical Detection Elements for Miniaturized Biochemical Devices / K.B. Mogensen ; A.M. Jorgensen ; N.J. Petersen ; O. Geschke ; J.P. Kutter
Silicon-Based Field-Effect Structures - From Dielectrics to Bioelectronics / M.J. Schoening
Neurotransistors for Biomedical Nanotechnology / A.J. Menezes ; V.J. Kapoor
Biosensors Based On Standard Dielectric Materials / J. Bausells ; A. Errachid ; N. Zine
Barrier Films on Paper and Cellulose using Fluorocarbon Plasmas / S. Vaswani ; J. Koskinen ; S. Zauscher ; D. Hess
Controlled Filling of Silicon Trenches with Doped Oxide for MEMS / A. Agarwal ; R. N.
Integrated Optics and Optical Applications / II.:
Optical and Electronic Properties of Nanostructured Silicon / D.J. Lockwood
MOCVD-Deposited Dielectric Films for Integrated Optical and Microelectronic Circuits / J. Mueller
Optical Characaterization of LPCVD SiOxNy Thin Films / M. Modreanu ; M. Gartner ; N. Tomozeiu
Material Consideration for Integrated Optics in Silica-on-Silicon Technology / L. Wosinski ; M. Dainese ; H. Fernando
Nanoscale characterization and local electromechanical properties of ferroelectric films for MEMS / A. Kholkin ; V. Shvartsman ; A. Emelyanov ; A. Safari
Optical MEMS devices based on wet anisotropic etching of silicon / M. Hoffmann ; D. Nusse ; E. Voges
Progress in the fabrication of complex optical coatings / D. Poitras
Silicon Nitride Coatings for Si Solar Cells: Control of Optical Reflection and Surface/Bulk Passivation / B. Sopori
Materials Processing / III.:
Temporal Pulse Shaping and Optimization in Ultrafast Laser Ablation of Materials / R. Stoian ; S. Winkler ; M. Hildebrand ; M. Boyle ; A. Thoss ; A. Rosenfeld ; I.V. Hertel
Development and Characterization of KOH Resistant PECVD Silicon Nitride for Microsystems Applications / F.E. Rasmussen ; B. Geilman ; M. Heschel ; O. Hansen
Ferroelectric properties of Pb-excess PZT thin films prepared by Zirconium oxyacetate-based sol-gel process / K. Nakano ; G. Sakai ; K. Shimanoe ; N. Yamazoe
Progress in Electronics / IV.:
Structural and Electronic Properties of Nanocrystalline Silicon / Silicon Dioxide Superlattices ; L. Tsybeskov ; B. V. Kamenev ; D. J. Lockwood
Properties of Gallium Nitride Nanorods by Hydride Vapor Phase Epitaxy / T.W. Kang ; H.-M. Kim
New Trends in Silicon Thin Films and Applications / J.-P. Kleider ; P. Roca i Cabarrocas ; C. Guedj
Novel Dielectric Thin Films for Frequency Agile Microwave Devices / M.W. Cole ; W. Nothwang ; C. Hubbard ; E. Ngo ; M. Ervin ; R.G. Geyer
Material Aspects in Emerging Nonvolatile Memories / T. Mikolajick ; C.U. Pinnow
Investigation of ru Thin Films Prepared by Chemical Vapor Deposition as Bottom Electrodes for Memory Applications / S.Y. Kang ; H.J. Lim ; C.S. Hwang ; H.J. Kim
Low-K and High-K Dielectrics / V.:
Characterization of Low-k to Extreme Low-k SiCOH Dielectrics / A. Grill ; D.A. Neumayer
High-Throughput Screening of Binary and Ternary Dielectric Oxides by Combinatorial Technology / H. Koinuma ; R. Takahashi ; H. Minami ; Y. Matsumoto ; K. Hasegawa ; Y. Yamamoto ; K. Itaka ; T. Chikyow
Progress in Novel Oxides for Gate Dielectrics And Surface Passivation of GaN/AlGaN Heterostructure Field Effect Transistors / C.R. Abernathy ; B.P. Gila ; A.H. Onstine ; S.J. Pearton ; J. Kim ; B. Luo ; R. Mehandru ; F. Ren ; J.K. Gillespie ; R.C. Fitch ; J. Sewell ; R. Dettmer ; G.D. Via ; A. Crespo ; T.J. Jenkins ; Y. Irokawa
Gas-Phase and Surface Reactions in Plasma Enhanced Chemical Etching of High-K Diectrics / L. Sha ; J. Chang
Investigation of Slow/Fast Interface States of Al2O3 / Si MOS System Using Deep Level Transient Spectroscopy / I.S. Jeon ; D. Eom ; M. Cho ; H.B. Park ; J. Park ; H. J. Kim
Characterization of a Potential Gate Dielectric: MOCVD-Grown Erbium Oxide on Silicon / M.P. Singh ; C.S. Thakur ; K. Shalini ; N. Bhat ; S.A. Shivashankar
HfO[subscript 2] Thin Films Deposited On SOI by Ion Beam Enhanced Deposition / K. Tao ; Y. Yu
Influence of the 5 A TaNx Interface Layer on Doped Metal Oxide High-k Dielectric Characterization / Y. Kuo ; J. Lu
Poster Session / VI.:
Potential Fluctuations in High-k Based Dielectric MOS Devices / J.-L. Autran ; D. Munteanu ; M. Houssa
Characterization of Thermally Evaporated ZrO2 / M. Bhaskaran ; P. K. Swain ; D. Misra
Synthesis and Characterization of Zinc Titanate Doped with Magnesium / Y.S. Chang ; Y.H. Chang ; I.G. Chen ; G.J. Chen
Investigation of High Dielectric Film on the Plastic Substrate by Novel Liquid-Phase Heterojunction Deposition / C.J. Huang ; W.R. Chen ; P.H. Chiu ; C.Z. Chen ; M.S. Lin ; S.L. Lee ; Z.Y. Lin
Thickness And Temperature Dependence Of The Ac Electrical Conductivity Of Porous Silicon Thin Films / M, Theodoropoulou ; P. Karahaliou ; S.N. Georga ; C.A. Krontiras ; N. Xanthopoulos ; M.N. Pisanias ; C. Tsamis ; A.G. Nassiopoulou
Author Index
Subject Index
Preface
Biosystems and Microsystems / I.:
Ion Track Nanostructuring of Dielectrics / K. Hjort ; E. Balanzat ; C. Trautmann ; M. Toulemonde ; A. Weidinger
69.

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図書
editors, R.E. Sah ... [et al.] ; sponsoring divisions, Dielecric Scoeice and Technology, Electronics
出版情報: Pennington, N.J. : Electrochemical Society, c2003  xii, 636 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2003-2
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目次情報: 続きを見る
Preface
Interface Characterization / I.:
Electrical Characterization Techniques for Semiconductor-Silicon Dioxide Interface - A Review / M.J. Deen
Si-SiO[subscript 2] Interface Trap Properties and Dependence with Oxide Thickness and with Electrical Stress in MOSFET's with Oxides in the 1-2 nm Range / D. Bauza ; F. Rahmoune
EPR Studies of SiC/SiO[subscript 2] Interfaces in n-type 4H-and 6H- Oxidized Porous SIC / H.J. von Bardeleben ; J.L. Cantin ; M. Mynbaeva ; S.E. Saddow ; Y. Shishkin ; R.P. Devaty ; W.J. Choyke
Related Oxides / II.:
Novel Germanium Technology and Devices for High Performance MOSFETs and Integrated On-Chip Optical Clocking / K.C. Saraswat ; C.O. Chui ; P.C. McIntyre ; B.B. Triplett
Properties of Ultrathin High-k Dielectrics on Si Probed by Electron Spin Resonance-Active Defects: Interfaces and Interlayers / A. Stesmans ; V.V. Afanas'ev
Role of Ultra Thin Silicon Oxide Interfacial Layer in High Performance High Dielectric Constant Gate Dielectrics / R. Singh ; M. Fakhruddin ; K.F. Poole ; S.V. Kondapi ; A. Gupta ; J. Narayan ; S. Kar
Quantum Mechanical Modeling of Capacitance-Voltage and Current-Voltage Behavior for SiO[subscript 2] and High-k Dielectrics / L.F. Register ; Y.-Y. Fan ; S.P. Mudanai ; S.K. Banerjee
Thermally Driven Atomic Transport in Silicon Oxynitride and High-k Films on Silicon / I.J.R. Baumvol ; F.C. Stedile ; J. Morais ; C. Krug ; C. Radtke ; E.B.O da Rosa ; K.P. Bastos ; R.P. Pezzi ; L. Miotti ; G.V. Soares
Investigations of the Structure and Stability of Alternative Gate Dielectrics / S. Stemmer ; Z.Q. Chen ; P.S. Lysaght ; J.A. Gisby ; J.R. Taylor
Comparison of Contamination Effects in Silicon Oxide with that in Hafnium Oxide and Zirconium Oxide Gate Dielectrics / F. Shadman ; P. Raghu ; N. Rana ; C. Yim ; E. Shero
Characteristics of Metal Gate MOS Capacitor with Hafnium Oxynitride Thin Film / K.-J. Choi ; S.-G. Yoon
Charge Trapping in High-Dose Ge-Implanted and Si-Implanted Silicon-Dioxide Thin Films / A.N. Nazarov ; I.N. Osiyuk ; I.P. Tyagulskii ; V.S. Lysenko ; T. Gebel ; W. Skorupa
Film Application / Device Characterization / Reliability / III.:
What Can Low-frequency Noise Learn us About the Quality of Thin-gate Dielectrics? / E. Simoen ; A. Mercha ; C. Claeys
Analysis of Short-channel MOSFET Behavior after Gate Oxide Breakdown and its Impact on Digital Circuit Reliability / G. Groeseneken ; B. Kaczer ; R. Degraeve
Cyanide Treatment to Improve Electrical Characteristics of Si-based MOS Diodes with an Ultrathin Oxide Layer / H. Kobayashi ; T. Kobayashi ; A. Asano ; O. Maida ; M. Takahashi
Process Dependence of Negative Bias Temperature Instability in PMOSFETS / S. Prasad ; E. Li ; L. Duong
Silicon Dioxide Insulating Films for Silicon-Germanium Technology / A. Vijh ; V.J. Kapoor ; R.L. Patterson ; J.E. Dickman
New Reliability Issues of CMOS Transistors with 1.3nm Thick Gate Oxide / M.F. Li ; B.J. Cho ; G. Chen ; W.Y. Loh ; D.L. Kwong
Improved Performance With Low Temperature Silicon Nitride Spacer Process / C.M. Reddy ; S.G.H. Anderson
Interface Studies / Defects / IV.:
Growth of SiO[subscript 2] at the Sc[subscript 2]O[subscript 3]/Si(100) Interface During Annealing / G.A. Botton ; E. Romain ; D. Landheer ; X. Wu ; M.-Y. Wu ; M. Lee ; Z.-H. Lu
A Review of Defect Generation in the SiO[subscript 2] and at Its Interface with Si / J.F. Zhang
Dipoles in SiO[subscript 2]: Border Traps or Not? / D.M. Fleetwood ; S.N. Rashkeev ; Z.Y. Lu ; C.J. Nicklaw ; J.A. Felix ; R.D. Schrimpf ; S.T. Pantelides
Stabilities and Electronic States of Incorporated Nitrogen Atoms at the Interface of SiO[subscript 2]/Si(001) / T. Yamasaki ; C. Kaneta
Electrical Properties and the Reliability of Silicon Nitride Gate Dielectrics Formed by Various Processes and Annealing Treatments / K.-S. Chang-Liao ; J.Y Pan ; C.L. Cheng ; T.K. Wang
Electronically Active Defects in Utra-thin Oxynitride Gate Dielectrics / D.A. Buchanan
Nitrogen Content and Interface Trap Reduction in SiO[subscript 2]/4H-SiC / K. McDonald ; R.A. Weller ; L.C. Feldman ; G.Y Chung ; C.C. Tin ; J.R. Williams
Cathodoluminescence of Thin Films of Silicon Oxide on Silicon / M.V. Zamoryanskaya ; V.I. Sokolov ; I.M. Kotina ; C.G. Konnikov
Predictive Simulation of Void Formation during the Deposition of Silicon Nitride and Silicon Dioxide Films / C. Heitzinger ; A. Sheikholeslami ; H. Puchner ; S. Selberherr
Film Preparation and Characterization I / V.:
Direct-Write Deposition of Silicon Oxide - The Express Lane towards patterned thin Films / H.D. Wanzenboeck ; S. Harasek ; E. Bertagnolli ; M. Gritsch ; H. Hutter ; J. Brenner ; H. Stoeri ; U. Grabner ; G. Hammer ; P. Pongratz
Comprehensive Optical and Compositional Characterization of Silicon-based Thin Films for Photonics / J. Wojcik ; E.A. Irving ; J.A. Davies ; W.N. Lennard ; P. Mascher
Hydrogenated Amorphous Silicon Nitride Deposited by Dc Magnetron Sputtering / K. Mokeddem ; M. Sayhi ; M. Aoucher ; A.C. Chami ; M. Abdessalem
Properties of Annealed Silicon Oxynitride Layers for Optical Applications / K. Worhoff ; G.M. Hussein ; C.G.H. Roeloffzen ; L.T.H. Hilderink
Optimum Structure of Deposited Ultra Thin Silicon Oxynitride Film to Minimize Leakage Current / K. Muraoka ; K. Kurihara ; N. Yasuda ; H. Satake
Plasma Damage in Ultra-thin Gate Oxide Induced by Dielectric Deposition Processes: An Overview on Main Mechanisms and Characterization Techniques / J.-P. Carrere ; J.-C. Oberlin ; S. Bruyere ; P. Ferreira
Electrical Characterization of Thin Oxide Layers by Impedance Spectroscopy Using Silicon/Oxide/Electrolyte (SOE) Structures / M. Chemla ; V. Bertagna ; R. Erre ; F. Rouelle ; S. Petitdidier ; D. Levy
Scaling / Film Preparation and Characterization II / VI.:
Ultrathin Silicon Oxynitride Gate Dielectrics / E.P. Gusev ; C.P. D'Emic ; T.H. Zabel ; M. Copel
Scaling Issues for Advanced SOI Devices: Gate Oxide Tunneling, Thin Buried Oxide, and Ultra-Thin Films / J. Pretet ; A. Ohata ; F. Dieudonne ; F. Allibert ; N. Bresson ; T. Matsumoto ; T. Poiroux ; J. Jomaah ; S. Cristoloveanu
The Effect of the Oxide Network Structure on the Irradiation Behavior of SiO[subscript 2] Films on Silicon / A.G. Revesz ; H.L. Hughes
Atomistic Characterization of Radical Nitridation Process on Si(100) Surfaces / Y. Yasuda ; A. Sakai ; S. Zaima
Atomic, Electronic Structure and Charge Transport Mechanism in Silicon Nitride and Oxynitride / V.A. Gritsenko ; K.A. Nasyrov
Decoupled Plasma Nitridation of Ultra-Thin Gate Oxides for 60-90 nm Technologies / M. Bidaud ; F. Boeuf ; C. Dachs ; C. Parthasarathy ; F. Guyader
A Neutron Reflectivity Study of Silicon Oxide Thin Films / A. Menelle ; M.-L Saboungi
Rapid Thermal and Anodic Oxidations of LPCVD Silicon Nitride Films / Y.-P. Lin ; J.-G. Hwu
MOSFET Degradation with Reverse Biased Source and Drain During High-Field Injection through Thin Gate Oxide / B. Patel ; R.K. Jarwal ; D. Misra
Modeling / Optimization / Characterization / VII.:
Modeling and Electrical Characterization of MOS Structures with Ultra-Thin Gate Oxide / R. Clerc ; G. Ghibaudo
Conduction Modeling of Thick Double-Layer Nitride/Oxide Dielectrics / S. Evseev
Contribution of Individual Process Steps on Particle Contamination during Plasma CVD Operation / H. Setyawan ; M. Shimada ; Y. Imajo ; K. Okuyama
Plasma Nitridation Optimization for Sub-15A Gate Dielectrics / F.N. Cubaynes ; J. Schmitz ; C. van der Marel ; J.H.M. Snijders ; A. Veloso ; A. Rothschild ; C. Olsen ; L. Date
Recovery and Reversibility of Electrical Instabilities in Double-Layer Dielectric Films / A. Cacciato
Low-Temperature Oxidation for Gate Dielectrics of Poly-Si TFTs using High-Density Surface Wave Plasma / K. Azuma ; M. Goto ; T. Okamoto ; Y. Nakata
Characterization of MIS Tunnel Junctions by Inelastic Electron Tunneling Spectroscopy (IETS) / C. Petit ; G. Salace ; D. Vuillaume
Authors Index
Subject Index
Preface
Interface Characterization / I.:
Electrical Characterization Techniques for Semiconductor-Silicon Dioxide Interface - A Review / M.J. Deen
70.

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図書
editors, M.D. Allendorf, F. Maury, F. Teyssandier ; sponsoring divisions, High Temperature Materials, Electronics, Dielectric Science and Technology
出版情報: Pennington, NJ : Electrochemical Society, c2003  2 v. (xxviii, 1570 p.) ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2003-8
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edited by R.B. Comizzoli, R.P. Frankenthal, J.D. Sinclair
出版情報: Pennington, NJ : Electrochemical Society, c1999  viii, 292 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 99-29
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図書
editors, G.S. Mathad ...[et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c2000  ix, 340 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 99-31
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editors, J.L. Davidson ... [et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c2000  xiv, 532 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 99-32
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editors, R.L. Opila ... [et al.]
出版情報: Pennington, N. J. : Electrochemical Society, c2000  xii, 644 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 99-37
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editor, Laura Mendicino
出版情報: Pennington, NJ : Electrochemical Society, c2000  viii, 230 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2000-7
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目次情報: 続きを見る
PFC Emissions Reduction / A.:
An Efficient, Highly Reliable Plasma Tool for PFC Abatement / X. Chen ; W. Holber ; M. Peter
Litmas Plasma Abatement Long-Term Reliability Test / V. Vartanian ; L. Beu ; T. Stephens ; J. Rivers ; B. Perez ; M. Kiehlbauch ; E. Tonnisand D. Graves
Optimization of a C[subscript 2]F[subscript 6] Clean for an Applied Materials' TEOS PECVD Process: Reduced PFC Emissions and Faster Clean Times / A. D. Johnson ; W. R. Entley ; R. N. Vrtis ; J. Langan ; P. Maroulis ; C. M. Chen ; C. T. Chen ; Y. C. Chang ; O. H. Yam
Chamber Clean Optimization for Silicon Carbide Films Using C[subscript 3]F[subscript 8] in a Novellus Concept One PECVD System / C. Beatty ; K. Sonti ; J. Williams ; L. Zazzera ; L. Tousignant ; S. Kesari
Evaluation of the Applied Materials Remote Clean Technology for Lamp Heated CVD Chambers for Perfluorocompound (PFC) Emissions Reduction / L. Mendicino ; C. Nauert ; J. Flood ; P. T. Brown ; A. Atherton ; T. Nowak ; D. Silvetti
Process Emissions Characterization / B.:
High Pressure Sampling Mass Spectrometry of Semiconductor Tool Process Emissions / B. Baker ; J. Arnold ; S. Quarmby ; M. Platt
Air Monitoring and Odor Elimination in a Semiconductor Photolithography Area / M. Villars ; A. Sevier ; D. Kaczmarik
Continuous Real-Time Detection of Molecular Fluorine (F2) Emitted as a By-Product Of CVD and Etch Processes / C. Laush
Point of Use Abatement for CVD Precursors and Reaction Products / P. Brown ; K. Reid ; J. Van Gompel
FTIR Analysis of a New High K Gate Material for MOCVD Applications / V. Cole
Alternative Clean Processes and Water Usage Reduction / C.:
Manufacturing Qualification of an All Dry DeVeil Plasma Process / D. Dopp ; L. Mikus ; A. Horn ; R. Bersin ; H. Xu ; M. Boumerzoug
EHS Concerns with Ozonated Water Spray Processing / K. McCormack ; K. Barbee
An Environmentally Benign BEOL Clean / K. Shrinivasan ; K. Reinhardt ; A. Shimanovich ; P. Sadkowski
Reduction of De-ionized Water Usage in Photoresist Stripping Processes / T. Kamal ; D. W. Hess
Microbial Control in Ultra-pure Water During Ultra-low Flow Conditions / B. Hoyt ; J. Molloy
General Technologies / D.:
Addressing the Environment, Safety and Health Challenges of the 1999 International Technology Roadmap for Semiconductors / S. Gibson
Risk-Based Evaluation of Bulk Anhydrous Hydrogen Chloride Delivery Alternatives Used in the Semiconductor Industry / P. T. Brow
Copper Removal from Chemical Mechanical Polishing Effluent / C. Riley ; J. Filson
The Environmental Value Systems (ENV-S) Analysis: Application to CMP Effluent Treatment Options / N. Krishnan ; S. Thurwachter ; P. Sheng ; T. Francis
Development and Implementation of an ISO Modeled Environmental, Health and Safety Management System / T. Nasi ; T. McCay ; R. Reblin
Safety and Environmental Concerns of CVD Copper Precursors / B. Zorich ; J. Norman ; M. Majors
Treatability of Chemical Mechanical Planarization (CMP) Wastewater / B. J. Davis ; S. Sue
PFC Emissions Reduction / A.:
An Efficient, Highly Reliable Plasma Tool for PFC Abatement / X. Chen ; W. Holber ; M. Peter
Litmas Plasma Abatement Long-Term Reliability Test / V. Vartanian ; L. Beu ; T. Stephens ; J. Rivers ; B. Perez ; M. Kiehlbauch ; E. Tonnisand D. Graves
76.

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図書
editors, A. Londergan ... [et al.] ; sponsoring division, Dielectric Science & Technology
出版情報: Pennington, NJ : Electrochemical Society, c2007-  v. ; 23 cm
シリーズ名: ECS transactions ; vol. 3, no. 15, vol. 11, no. 7, vol. 16, no. 4
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editors, I. Ali, S. Raghavan
出版情報: Pennington, NJ : Electrochemical Society, c1997  ix, 275 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 96-22
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editors, Cor L. Claeys ... [et al.]
出版情報: Pennington, NJ : Electrochemical Society, c1997  ix, 402 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 97-2
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editors, P.J. Hesketh, G. Barna, H. G. Hughes
出版情報: Pennington, NJ : Electrochemical Society, c1997  vii, 217 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 97-5
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edited by V. Swaminathan...[et al.]
出版情報: Pennington, NJ : Electrochemical Society, c1995  ix, 378 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 95-6
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editors, T.D. Moustakas, J.P. Dismukes, S.J. Pearton
出版情報: Pennington, NJ : Electrochemical Society, c1996  vii, 234 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 96-11
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editors, G.S. Mathad, M. Meyyappan ; [sponsored by] Dielectric Science and Technology and electronics Divisions
出版情報: Pennington, NJ : the Electrochemical Society, Inc., c1996  xi, 720 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 96-12
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editor, Yue Kuo
出版情報: Pennington, NJ : Electrochemical Society, c1997  xii, 404 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; 96-23
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editors, D. J. Lockwood ... [et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c1996  ix, 495 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 95-25
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editors, T. M. Besmann ... [et al.]
出版情報: Pennington, NJ : Electrochemical Society, c1996  xxii, 892 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 96-5
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edited by F. Ren ... [et al.]
出版情報: Pennington, NJ : Electrochemical Society, c1995  xi, 510 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 95-21
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edited by S. S. Li ... [et al.]
出版情報: Pennington, NJ : The Electrochemical Society, c1995  viii, 264 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 95-28
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editors, D. Denton, P.J. Hesketh, H. Hughes
出版情報: Pennington, NJ : Electrochemical Society, c1995  ix, 362 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 95-27
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edited by Hazara S. Rathore
出版情報: Pennington, NJ : Electrochemical Society, c1995  viii, 245 p. ; 23
シリーズ名: Proceedings / [Electrochemical Society] ; v. 95-3
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図書
editors, Cor L. Claeys ... [et al.]
出版情報: Pennington, NJ : Electrochemical Society, c1995  xi, 446 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 95-9
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editors, K. V. Ravi, J. P. Dismukes ; co-organizers, K.E. Spear ... [et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c1995  xx, 731 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 95-4
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edited by Martin A. Schmidt ... [et al. ; sponsored by the] Electronics and Dielectric Science and Technology Divisions
出版情報: Pennington, NJ : Electrochemical Society, c1993  x, 485 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 93-29
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edited by Kurt R. Hebert, George E. Thompson
出版情報: Pennington, NJ : Electrochemical Society, c1994  ix, 312 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 94-25
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editors [sic], Yue Kuo
出版情報: Pennington, NJ : Electrochemical Society, c1995  x, 410 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; 94-35
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edited by R.B. Comizzoli, R.P. Frankenthal, and J.D. Sinclair ; assistant editors, K.J. Hanson, R.L. Opila, K.M. Takahashi
出版情報: Pennington, NJ : Electrochemical Society, c1994  ix, 417 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 94-29
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図書
edited by S. Srinivasan ... [et al.] ; [sponsored by] the Electrochemical Society. Energy Technology, Battery, Physical Electrochemistry, and High Temperature Materials Divisions
出版情報: Pennington, NJ : The Electrochemical Society, c1994  ix, 509 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 94-23
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97.

図書

図書
edited by G.S. Mathad, D.W. Hess ; [sponsored by] Dielectric Science and Technology and electronics Divisions, the Electrochemical Society
出版情報: Pennington, NJ : the Electrochemical Society, Inc., c1994  xi, 606 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 94-20
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98.

図書

図書
edited by M. Cahay ... [et al.] ; [sponsored by] the Electrochemical Society. Dielectric Science and Technology, Electronics and Luminescence and Display Materilas Divisions
出版情報: Pennington, NJ : The Electrochemical Society, c1994  ix, 437 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 94-17
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99.

図書

図書
editors, V.J. Kapoor, W.D. Brown ; Dielectric Science and Technology and Electronics Divisions
出版情報: Pennington, NJ : Electrochemical Society, c1994  xiii, 625 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 94-16
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100.

図書

図書
edited by P.J. Hesketh ... [et al.] ; [sponsored by] the Electrochemical Society. Sensors, Electronics and Dielectric Science and Technology Divisions
出版情報: Pennington, NJ : The Electrochemical Society, c1994  viii, 255 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 94-14
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