B.R. McAvoy, editor ; sponsored by the IEEE Group on Sonics & Ultrasonics

sponsored by the Materials and Fabrication Committee, Pressure Vessels and Piping Division, ASME [and] the Metal Properties Council, Inc. ; edited by R.A. Swift

edited by Frank C. Townsend and G.M. Norris

International Conference on Frequency Control and Synthesis ; Institution of Electronic and Radio Engineers ; University of Surrey

Coating Conference ; Technical Association of the Pulp and Paper Industry

Research and Development Conference ; Technical Association of the Pulp and Paper Industry

co-sponsors TAPPI ... [et al.]

Pierre Barrette, editor

SSC central design group

International Symposium on Microencapsulation

editor, M. H. Hamza

H.O. Fuchs, editor

editors, John S. Jackson, Klaus Fellbaum ; sponsored by Technical University Berlin ... [et al.]

sponsored by the IEEE Computer Society, Test Technology Committee, IEEE Philadelphia Section

co-sponsored by Chinese Computer Federation, the Computer Society of the IEEE in cooperation with the National Natural Science Foundation of China

editor N.G. Guy

G.M. Thiels

sponsored by ASME Solid Waste Processing Division

prepared by the ASME Safety Division ; under the sponsorship of the National Institute for Occupational Safety and Health

sponsored by the Design Engineering Division, ASME ; edited by Simon Braun

prepared by the Equipment Testing Procedures Committee

prepared by the Equipment Testing Procedures Committee

sponsored by the Institute of Electrical and Electronic Engineers, IEEE San Diego Section

editor, John S. Jackson ; publishing edotor, R. William de Vore ; sponsored by College of Engineering, University of Kentucky, Department of Electrical Engineering ... [et al.] ; incorporation with, Technical Groups of the Institute of Electrical and Electronics Engineers ... [et al.]