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図書
図書
1. Proceedings ICT2001, XX International Conference on Thermoelectrics : 8-11th June 2001, Beijing, the People's Republic of China
hosted by China Industrial Association of Power Sources ; Sponsored by Tianjin Lantian High-Tech Power Sources, Joint-Stock Co., Ltd ; supported by the International Thermoelectric Society, Tianjin Institute of Power Sources
出版情報: Piscataway, NJ : IEEE Service Center, c2001  xix, 541 p. ; 28 cm
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2.

図書
図書
2. Electrical performance of electronic packaging, October 22-31, 2001, Radisson Royal Sonesta Hotel, Cambridge, Massachusetts
sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
出版情報: [New York] : Institute of Electrical and Electronics Engineers, [c2001]  xi, 344 p. ; 28 cm
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3.

図書
図書
3. Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Jose, CA USA, March 20-22, 2001 : proceedings 2001 (: soft.)
sponsored by IEEE, Components, Packaging, and Manufacturing Technology Society
出版情報: Piscataway, N.J. : IEEE Service Center, c2001  xi, 260 p. ; 28 cm
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図書
図書
4. 2001 proceedings : 51st Electronic Components & Technology Conference, Orlando, Florida USA/ sponsored jointly by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE and the Electronic Components, Assemblies & Materials Association (ECA) the electronic components sector of the Electronic Industries Alliance (: bound ed.)
Electronic Components & Technology Conference ; Components, Packaging & Manufacturing Technology Society ; Electronic Components, Assemblies & Materials Association (ECA) ; Electronic components sector of the Electronic Industries Alliance
出版情報: [United States] : IEEE, c2001  xxxii, 1518 p. ; 28 cm
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5.

図書
図書
5. 2001 IEEE International Symposium on Semiconductor Manufacturing : conference proceedings, October 8-10, 2001, San Jose, California (: softbound)
[sponsored by IEEE Electron Devices Society, IEEE Components Packaging and Manufacturing Technology Society, Semiconductor Equipment & Materials International (SEMI), and Society of Applied Physics of Japan]
出版情報: Piscataway, N.J. : IEEE Service Center, c2001  xi, 525 p. ; 28 cm
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6.

図書
図書
6. Electrical contacts-2001 : proceedings of the forty-seventh IEEE Holm Conference on Electrical Contacts (:case)
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers
出版情報: Piscataway, NJ : IEEE Service Center, c2001  xv, 310 p. ; 28 cm
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7.

図書
図書
7. Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001 (: soft.)
co-sponsored by : International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packing, and Manufacturing Technology (CPMT), Georgia Institute of Technology, Packaging Research Center (PRC) ; general chair, James E. Morris ; technical chairs, Andreas Schubert
出版情報: Washington, DC : IMAPS , Piscataway, N.J. : IEEE, [2001]  ix, 414 p. ; 28 cm
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