close
1.

図書
図書
1. Silicon Nitride and Silicon Dioxide Thin Insulating Films : proceedings of the sixth International Symposium
editors, K.B. Sundaram ... [et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  x, 286 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-7
所蔵情報: loading…
目次情報: 続きを見る
Preface
Organizers
Oxide Wear-Out, Reliability, Stress and Interfaces / I：
A Review of Oxide Wearout, Breakdown, and Reliability / D. Dumin
Surface And Interface Study Of Ion Beam Deposited Silicon oxide Thin films / Heinz D. Wazenboeck ; Emmerich Bertagnolli ; Bernhard Basnar ; Juergen Smoliner ; Martin Gritsch ; Herbert Hutter ; Josef Brenner ; C. Tomastik ; Herbert Storri
Study of Inversion Layer Hole Mobility In p-Mosfet During High-field Stressing / R. Jarawal ; D. Misra
Two Limiting Thinnesses Of The Ultrathin Gate Oxide / Samares Kar
SiO[subscript 2] Stress and Interfaces / II：
The Connection Between oxide leakage currents and Si/SiO[subscript 2] Interface Trap Generation / P. M. Lenahan
Charging Damage During Plasma Enhanced Dielectric Deposition / K. Cheung
Kinetics and Mechanisms of Organic Contaminant Interactions at Silicon Surfaces in High Temperature Processes / N. Rana ; P. Raghu ; F. Shadman
SiO[subscript 2] Films and Properties / III：
Remote Plasma Deposited Gate Dielectrics on Si and SiGe Mosfets / T. Ngai ; R. Sharma ; J. Fretwell ; X. Chen ; J. Chen ; W. Brookover ; S. Banerjee
Rapid Thermal Processes of High Permittivity Films on Silicon for ULSI Gate Dielectrics Applications / S. P. Tay ; R. Sharangpani ; Y. Z. Hu
Processing of Thick Thermal Gate Oxides in Trenchs / C. T. Wu ; R. Ridley ; G. Dolny ; T. Grebs ; J. Hao ; S. Suliman ; B. Venkataraman ; O. Awadelkarim ; R. Williams ; P. Roman ; J. Ruzyllo
Electrical Properties of SiO[subscript 2]-Films Prepared by VUV Chemical Vapor Deposition / Y. Motoyama ; J. Miyano ; K. Tosikawa ; Y. Yagi ; K. Kurosawa ; A. Yokotani ; W. Sasaki
SiO[subscript 2] Film Deposition on Different Substrate Materials by Photo- CVD Using Vacuum Ultraviolet Radiation / K. Toshikawa
Silicon Nitrides/ Oxynitrides / IV：
Low Energy Ion Irradiation of Silicon: Compound Formation and Segregation of Impurities / M. Petravic ; J. S. Williams ; P. N. K. Deenapanray
Characteristics of Silicon Oxynitrides Made By ECR Plasmas / J. A. Diniz ; P. J. Tatsch ; J. Swart
Radiation Hardening of Oxynitrides Formed By Low Nitrogen Implantation into Silicon Prior to Oxidation / J. Godoy Fo
Silicon Nitrides/ Oxynitrides II / V：
Material and Process Considerations of Ultra thin Silicon (Oxy) Nitride Films Grown on Silicon and SiO[subscript 2] Surfaces / C. P. D'Emic ; E. P. Gusev ; K. K. Chan ; T. Zabel ; M. Copel ; R. Murphy ; P. Kozolowski ; J. Newbury
Silicon OxyNitride: A Versatile Material for Integrated Optics Application / K. Worhoff ; A. Driessen ; P. V. Lambeck
Characterization of Silicon Oxynitride Thin Films Deposited By ECR-PECVD / C. Simionescu ; J. Wojcik ; H. K. Haugen ; J. A. Davies ; P. Mascher
Silicon Nitrides/ Oxynitrides III / VI：
Characterization of Low- Temperature Magnetoplasma- Grown Si Oxynitride and Si Oxide / H. Ikoma
Advances in Single Wafer Chemical Deposition of Oxide and Nitride films / W. Palmer ; Z. Gabric
High Integrity Direct Oxidation/Nitridation at Low Temperatures Using Radicals / T. Ohmi ; S. Sugawa ; M. Hirayama
Silicon Nitride
Thermally Induced Stress Changes in High Density Plasma Deposited Silicon Nitride Films / R. E. Shah ; H. Baumann ; D. Serries ; M. Mikulla ; R. Keiffer
Effect of Oxygen in Deposited Ultra Thin Silicon Nitride Film on Electrical Properties / K. Muraoka ; K. Kurihara
Influence of Low- energy argon Ion Bombardment and Vacuum Annealing on the Silicon Nitride Surface Properties / I. P. Petrenko ; V. A. Gritsenko ; L. M. Logvinsky ; H. Wong
Authors Index
Subject Index
Preface
Organizers
Oxide Wear-Out, Reliability, Stress and Interfaces / I：
2.

図書
図書
2. Quantum confinement VI: nanostructured materials and devices : proceedings of the international symposium
editors, M. Cahay ...[et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  ix, 398 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-19
所蔵情報: loading…
3.

図書
図書
3. Thin film materials, processes, and reliability : proceedings of the international symposium
editor, G.S. Mathad ; assistant editors, M. Engelhardt ...[et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  viii, 216 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-24
所蔵情報: loading…
4.

図書
図書
4. Environmental Issues with Materials and Processes for the Electronics and Semiconductor Industries : proceedings of the fourth International Symposium
editor, L. Mendicino ; [jointly sponsored by the Dielectric Science and Technology Division]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  vii, 212 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-6
所蔵情報: loading…
5.

図書
図書
5. Thin Film Transistor Technologies V : proceedings of the International Symposium
editor, Y. Kuo ; [sponsored by] Electronics and Dielectric Science and Technology Divisions [of the Electrochemical Society]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  xi, 340 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; 2000-31
所蔵情報: loading…
目次情報: 続きを見る
Preface
Reviews of TFT Research Activities
Advances in Printed Liquid Crystal Displays with Plastic Substrates / E. Lueder
A Brief Review of Thin-Film Transistor Research Done in Tokyo Institute of Technology / M. Matsumura
Amorphous and Microcrystalline Silicon TFTs
ECR-PECVD of Silicon Nitride and Hydrogenated Amorphous Silicon at 80[degree]C For TFTs / A. J. Flewitt ; A. P. Dyson ; J. Robertson ; W. I. Milne
Amorphous Silicon Thin Film Transistor Fabricated with a New Copper Dry Etching Method / S. Lee ; Y. Kuo ; J. P. Donnely ; J.-Y. Tewg ; H. Lee
Microcrystalline Silicon TFTs For AMLCDs / I. D. French ; P. Roca i Cabarrocas ; S. C. Deane ; R. B. Wehrspohn ; M. J. Powell
Use of 120[degree]C n[superscript +] [mu]c-Si:H in Low Temperature TFT Fabrication / T. Charania ; A. Sazonov ; A. Nathan
Process Considerations for Small Area a-Si:H Vertical Thin Film Transistors / I. Chan ; B. Park
Polycrystalline Silicon TFTs
Future Trends in Low Temperature Poly-Si TFT-LCD by Excimer Laser Anneal / S. Uchikoga
Low Temperature Process Technologies and "Process Integration" for High Performance Polycrystalline Silicon Thin-Film Transistors / S. Higashi
Top-Gate Amorphous Si Air-Gap Transistors with Poly-Si Contacts / P. Mei ; J. Ho ; R. Lau ; J. P. Lu ; B. Street ; J. Boyce
Full Optimized Process of Polysilicon TFT's Using Very Large Excimer Laser / Y. Helen ; G. Gautier ; K. Mourgues ; T. Mohammed-Brahim ; F. Raoult ; O. Bonnaud ; C. Prat ; D. Zahorski ; D. Lemoine
Polycrystalline Silicon Thin Film Transistors Free from Large Angle Grain Boundaries / M. Maekawa ; Y. Nakamura ; Y. Umenaka ; J. Takagi ; M. Hijikigawa
Low Temperature Poly-Si TFT-LCDs Using P-type Technology / K.-J. Kim ; Y.-M. Ha ; J.-C. Yeo ; B.-K. Kim ; H.-S. Choi ; D.-G. Kim
High Performance Low Temperature Polysilicon TFT'S with Ultra-thin Liquidphase Deposited Gate Oxide and N[subscript 2]O Plasma Treatment / C.-F. Yeh ; S.-C. Wang ; J.-N. Jeng ; C.-Y. Lu
Crystallization, Etching, Deposition, Hydrogenation, and Metallization
Silicide Mediated Crystallization of Patterned Amorphous Silicon in the Electric Field / S. J. Park ; K. H. Kim ; B. R. Cho ; A. Y. Kim ; S. Y. Yoon ; J. Jang
Two-Dimensionally Position-Controlled Ultra-Large Grain Growth Based on Phase-Modulated Excimer-Laser Annealing Method / M. Nakata
The Lateral Grain Growth of ELA Poly-Si by Employing Selective Melting and Lateral Heat Sink / J.-H. Jeon ; M.-C. Lee ; J.-W. Park ; M.-K. Han
Novel Wet Taper Etching of Interconnects on Large Area Substrates Using Galvanic Reaction / T. Kaneko ; Y. Hashimoto ; K. Ono ; K. Fujii ; K. Onisawa
High Quality Silicon Oxide Deposited with A Multipolar Electron Cyclotron Resonance Plasma Source / G. Isai ; A. Kovalgin ; J. Holleman ; P. Woerlee ; H. Wallinga
Effects of NH[subscript 3]/N[subscript 2] Plasma Treatment on Very-Low-Temperature (100[degree]C) Oxides / C.-H. Kim ; S.-H. Jung ; W.-J. Nam
Electroless Deposition of Ni-P Alloy in Electronics / T.N. Khoperia
Devices and Modeling
Mechanisms Underlying the Off Characteristics of a-Si:H Thin Film Transistors / P. Servati
Analysis of the Leakage Current of Poly-Si TFT Using Counter-Doping Process / J. Y. Yang ; S. H. Yu ; J. H. Kim
Low Temperature Poly-Si TFT with Lateral Body Terminal for Stability Improvement / J. S. Yoo ; M. C. Lee ; I. H. Song ; M. K. Han
Low Frequency Noise in CdSe Thin-Film Transistors / M. J. Deen ; S. L. Rumyantsev ; I. Glick ; A. Smozh ; M. Westcott ; D. Waechter
Materials
Defect Reduction Technologies Used to Improve Characteristics of Polycrystalline Silicon Thin Film Transistors / Y. Tsunoda ; T. Sameshima
Polysilicon Thin Film Transistors on Glass-Ceramic Substrates / S. M. Krasulya ; N. I. Nemchuk ; D. G. Ast ; J. G. Couillard
Structural Differences between Deuterated and Hydrogenated Hydrogenated Silicon Nitride/Oxynitride / A. Shih ; S.-C. Lee ; T. R. Yang ; C. C. Lu
Highly Packed and Ultra-Large Si Grains Grown by a Single-Shot Irradiation of Excimer-Laser Light Pulse / Y. Sano ; W-C. Yeh
Low-Pressure CVD of Germanium-Silicon Films Using Silane and Germane Sources / C. Salm
Unhydrogenated Polycrystalline Silicon-Germanium Thin Film Transistors by LPCVD / D. Guillet ; R. Rogel ; M. Sarret
New and Novel Applications
Flat Panel X-Ray Image Detectors for Medical Imaging Applications / Y. Izumi ; Y. Yamane ; F. Funada ; S. Adachi ; S. Yamada
Analog Addressed Microdisplays / A. Van Calster
Polysilicon Thin Film Transistor Development for Smart Power Applications / Y. Wu ; F. Robb ; J. Shen ; S. Robb ; K. Kamekona
Polysilicon Thin Film Transistor and EEPROM Characteristics for Three Dimensional Memory / J. R. Lindsey ; T. S. Kalkur
Active Pixel TFT Array for Digital Imaging Applications / K.S. Karim
Author Index
Subject Index
Preface
Reviews of TFT Research Activities
Advances in Printed Liquid Crystal Displays with Plastic Substrates / E. Lueder
6.

図書
図書
6. Cold cathodes : proceedings of the first International Symposium
editors, M. Cahay ... [et. al] ; [sponsored by] Dielectric Science and Technology, Electronics, and Luminescence and Display Materials Divisions [of the Electrochemical Society]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  viii, 280 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2000-28
所蔵情報: loading…
目次情報: 続きを見る
Preface
Field Emitter Arrays
Tip Self-Heating to Enhance Microfabricated Cold Cathode Operation Lifetime / P.R. Schwoebel ; C.A. Spindt ; C.E. Holland ; J.A. Panitz
Laser Assisted Fabrication of Single Crystalline Tungsten Rods for use as Field Emitting Cathodes / K. Larsson Bjorklund ; C. Ribbing ; H. Norde ; M. Boman
Theory of H Induced Enhancement of Field Emission from and O Covered Mo(110) Surface / P. von Allmen ; R. Ramprasad ; L.R.C. Fonseca ; P. Ordejon
Process Simulation of a Silicon Field Electron Emitter with Integrated Double-gated Beam Focusing Lens / G. Oleszek ; M. Rodriquez
Carbon Nanotubes
Carbon Nanotube Cold Cathodes Fabrication and Properties / C. Bower ; W. Zhu
Calculating the Field Emission Current from a Carbon Nanotube
Scanning Anode Field Emission Microscopy on Carbon Nanotube Thin Film Emitters / L.O. Nilsson ; O. Groenig ; P. Groenig ; L. Schlapbach
Template Based Carbon Nanotubes as A Field Emitter / S.-H. Jeong ; H.-Y. Hwang ; K.-H. Lee ; W.-K. Cho ; K.-Y. Kim ; H.-S. Jeong
Field Emission Cathode from Aligned Arrays of Carbon Nanotubes / A. Govyadinov ; P. Mardilovich ; D. Routkevich
Electron Emission Cooling
Cooling by Field Emission into the Vacuum with Resonant Tunneling: Design Parameters / R. Tsu
New Results on Microelectronic Cooling Using the Inverse Nottingham Effect: Low Temperature Operation and Efficiency / P.H Cutler ; N.M. Miskovsky ; N. Kumar ; M.S. Chung
Theory and Simulation
The Semiconductor Statistical Hyperbolic-Ellipsoidal Model For Evaluation of Current From Microstructures / K.L. Jensen
Non Equilibrium Field Emission from Wide Bandgap Semiconductors / G.L. Bilbro
Onset of Current Self-Quenching in an InP/CdS/LaS Cold Cathode / Y. Modukuru ; M. Cahay ; P.D. Mumford
Negative Electron Affinity/ Low Electron Affinity
Novel Electron Sources / V.T. Binh ; V. Semet ; J.P. Dupin
Effect of Surface Properties on Electron Energy Distribution from C(111) and C(100) Surfaces / J. Yater ; A. Shih
Synthesis and Work Function Measurement of LaS and NdS Bulk Samples / J. Thachery ; H. Tang ; P. Boolchand
Carbons, Diamond, and a-Silicon
Electron Emission from Carbon Films / R.J. Nemanich ; F.A.M. Kock ; J.M. Garguilo
Fabrication and Characterization of Cathodoluminescent Devices made Using Porous Silicon as a Cold-Cathode Field Emitter / D. Heyde Elqaq ; M.-A. Hasan
Monolithic Thin Film Edge Emission Diodes / H.R. Kim ; L. Karpov ; V. Bhatia ; M. Weichold
Electron Emission Characteristics of Diamond / B. Pate
Conditioning of Amorphous Cathodes via Current Stressing / S.R.P. Silva ; J.D. Carey ; C.H. Poa ; J.M. Shannon
Field Emission Display Development at Motorola / A.A Talin ; B.F.Coll. Yi Wei ; K.A. Dean ; J.E. Jaskie
Rehybridization of Atomic Orbitals and Field Emission Properties of Nanostructured Graphite-like Materials / A.N. Obraztsov ; A.P. Volkov ; A.I. Boronin ; S.V. Kosheev
Author Index
Subject Index
Preface
Field Emitter Arrays
Tip Self-Heating to Enhance Microfabricated Cold Cathode Operation Lifetime / P.R. Schwoebel ; C.A. Spindt ; C.E. Holland ; J.A. Panitz
7.

図書
図書
7. Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium ([I] ; II)
editor, G.S. Mathad ; assistant editors, H.S. Rathore ... [et al.] ; [cosponsored by] Dielectric Science & Technology, Electronics, and Electrodeposition Divisions [of the Electrochemical Society]
出版情報: Pennington, N.J. : Electrochemical Society, c2001-2003  2 v. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2000-27, 2003-10
所蔵情報: loading…
目次情報: 続きを見る
Preface
Copper Deposition
Relation of Contact Resistance Reduction and Process Parameters of Bonded Copper Interconnects in Three-Dimensional Integration Technology / K.N. Chen ; A. Fan ; C.S. Tan ; R. Reif
ECD Seed Copper Layer for Seed Enhancement in Advanced Interconnects / P.H. Haumesser ; S. Da Silva ; M. Cordeau ; X. Avale ; O. Pollet ; T. Mourier ; G. Passemard ; R. Baskaran ; T. Ritzdorf
Ultra-thin Tungsten CVD Nucleation Layer for Sub-100 nm Contact Applications / J. Gupta ; J. Sudijono ; L.C. Hsia ; S. Singh
Three-Dimensional Simulation of Superconformal Copper Deposition Based on the Curvature-Enhanced Acceletator Coverage Mechanism / E. Bar ; J. Lorenz ; H. Ryssel
Copper Electrodeposition of High Aspect Ratio Vias for Three-Dimensional Packaging / K. Kondo ; T. Yonezawa ; M. Tomisaka ; H. Yonemura ; M. Hoshino ; Y. Taguchi ; K. Takahashi
Copper Electroplating Process with Improved Stability, Conductivity and Total. Cost of Ownership / R. Preisser ; T. Dretschkow ; H. Fuerhaupter
Electroplating of Copper-Tin Alloys / R. Chebiam ; C-C. Cheng ; H. Simka ; A. Budrevich ; V. Dubin
Interactions between the Conditions of Copper Electrodeposition and the Density of Hillocks / S. Petitdidier ; M. Gregoire ; S. Segaud ; S. Courtas ; M. Juhel ; J.P. Jacquemin ; L. Dumas
Detection of Accelerator Breakdown Products in Copper Plating Baths / M. Pavlov ; E. Shalyt ; P. Bratin ; D.M. Tench
Copper Nucleation on Platinum in the Presence of Additives in Acid Copper Solution / J. Han ; M. King ; M. Stawasz ; T. Baum
An in-situ FTIR Study on Palladium Displacement Reaction for Autocatalytic Electroless Copper Deposition / Y-J. Oh ; C-H. Chung
New Additives for Super-Conformal Electroplating of Ag Thin Film for ULSI / J.J. Kim ; E.J. Ahn ; J.M. Seo
The Role of Chloride Ion in Copper Electrodeposition from Acidic Baths Containing Cl[superscript -], PEG, and SPS / M. Tan ; J.N. Harb
The Influence of 2,2'-Dipyridyl on Non-Formaldehyde Electroless Copper Plating / J. Li ; H. Hayden ; P.A. Kohl
Influence of the Anode in the Damascene Process Investigated by Electro-Chemical Impedance Spectroscopy / C. Gabrielli ; P. Mocotrguy ; H. Perrot ; A. Zdunek ; D. Nieto-Sanz ; M.C. Clech
Investigation of Copper Bath Ageing in the Damascene Process by Electro-chemical Impedance Spectroscopy / P. Mocoteguy
Barrier Films
The Proposal of All-Wet Fabrication Process for ULSI Interconnects Technologies--Application of Electroless NiB Deposition to Capping and Barrier Layers / M. Yoshino ; Y. Nonaka ; T. Yokoshima ; T. Osaka
Thickness Effect on the Diffusion Barrier Properties of ZrN in Cu/ZrN/Si Systems / C-S. Chen ; C-P. Liu ; H-G. Yang ; C-Y. A. Tsao
Characterization of Electroless Plated CoWB Barrier Films / V. Mathew ; R. Chatterjee ; S. Garcia ; L. Svedberg ; Z-X. Jiang ; R. Gregory ; K-H. Lie ; K. Yu
Effect of Ta[subscript 2]N Crystallinity on Diffusion Barrier Properties / H-C. Chung
Use of Ti[subscript x]TiN as Cap Layer for the Formation of Cobalt Silicide / M. Vulpio ; D. Fazio ; M. Bileci ; D. Mello ; C. Gerardi
Ruthenium-Based Copper Diffusion Barrier: Studied by Electrochemistry, SIMS Depth Profiling, and Sheet Resistance Measurements / O. Chyan ; R. Chan ; T. Arunagiri ; R.M. Wallace ; M.J. Kim ; T. Hurd
Low-k Inter Level Dielectric Films and CMP
A Novel Approach for Dual Damascene Trench Etch for 90 nm Low-k Inter-Connect with No Middle Etch Stop Layer / T.Q. Chen ; H. Cong ; W.P. Liu ; Y.K. Siew ; Y. Pradeep ; R. Jaiswal ; A. Jain ; I. Sim
Electrical and Mechanical Properties of Nitrogen and Fluorine Incorporated Organosilicate Glass Prepared by Plasma Enhanced Chemical Vapor Deposition / S-K. JangJian ; W-S. Hwang ; S-W. Chen ; K-H. Wei ; Y-L. Wang
Development of Spin-on Dielectric (SiLK) Etch Process for 0.13 [mu] Cu-Low k Interconnects Technology / B. Ramana Murthy ; Y.W. Chen ; X.T. Chen
The Pore Structure, Property, and Performance of a Spin-on Porous Low-k Dielectric / Y. Liu ; B. Foran ; D. Gidley ; W-L. Wu ; H. Shirataki ; H. Hanahata
Evaluation of Low-k Porous Silica Film Incorporated with Ethylene Groups / Y. Uchida ; M. Oikawa ; Y. Itoh ; K. Ishida
Strip Process Optimization for Porous ULK Films / I.J. Kalinowski ; C. Bourlot ; A. Marfoure ; O. Louveau ; S. Li ; J. Su ; G.W. Hills ; D. Louis
Characterization of Plasma Strip Processes on OSG Low-k Dielectric Films / K. Ostrowski ; I.J. Kalinovski
Reliability Characterization of Organic Ultra Low-k Film Using Voltage Breakdown / A. Krishnamoorthy ; B. Ramany Murthy ; K.Y. Yiang ; W.J. Yoo
Process-Induced Voiding in Copper Interconnect Metallization / P. Lindgren ; K. Downes ; S. Kole ; W. Murphy ; E. Cooney III ; M. Goldstein ; J. Chapple-Sokol
Planarization of Copper Layer for Damascene Interconnection by Electrochemical Polishing in Alkali-Based Solution / G-S. Park ; C-W. Chung
Characterization of a Colloidal Silica Slurry for 0.13 [mu]m Devices in a Copper CMP Process / J. Cadenhead ; G. Huffman ; D. Lewis ; A. Pamatat ; J. Verizzo ; S. Usmani ; J. Siddiqui
Mechanisms of Using Organic Acids to Clean Copper Surfaces / T. Yagishita ; K. Ishikawa ; M. Nakamura
Advanced Packaging
3-Dimensional Chip Stacking for High-Density Electronic Packaging / K. Tanida ; M. Umemoto ; K. Kojiama ; M. Ishino ; M. Bonkohara
Author Index
Subject Index
Preface
Copper Deposition
Relation of Contact Resistance Reduction and Process Parameters of Bonded Copper Interconnects in Three-Dimensional Integration Technology / K.N. Chen ; A. Fan ; C.S. Tan ; R. Reif
文献の複写および貸借の依頼を行う
 文献複写・貸借依頼