| 1.
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edited by Mahadevan K. Iyer, Toh Kok Chuan, Mui Yew Cheong ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ; technically co-sponsored by IEEE CPMT Society, IMAPS
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| 2.
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hosted by China Industrial Association of Power Sources ; Sponsored by Tianjin Lantian High-Tech Power Sources, Joint-Stock Co., Ltd ; supported by the International Thermoelectric Society, Tianjin Institute of Power Sources
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| 3.
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図書
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sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
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| 4.
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図書
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[sponsored by] IEEE, Components, Packaging, and Manufacturing Technology Society
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| 5.
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図書
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Electronic Components & Technology Conference ; Components, Packaging & Manufacturing Technology Society ; Electronic Components, Assemblies & Materials Association (ECA) ; Electronic components sector of the Electronic Industries Alliance
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| 6.
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図書
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sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
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| 7.
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図書
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sponsored by IEEE Electron Device Society, IEEE Components, Packaging & Manufacturing Technology Society, Association for Computing Machinery, ACM Special Interest Group on Design Automation
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| 8.
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図書
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[sponsored by] IEEE, Components, Packaging, and Manufacturing Technology Society, NIST
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| 9.
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図書
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sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
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| 10.
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図書
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[sponsored by IEEE Electron Devices Society, IEEE Components Packaging and Manufacturing Technology Society, Semiconductor Equipment & Materials International (SEMI), and Society of Applied Physics of Japan]
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