Preface |
The Evolution of Silicon Electronics / 1: |
Introduction / 1.1: |
The Early Days of Semiconductor Electronics / 1.2: |
Moore's Law / 1.3: |
Further trends and the ITRS / 1.4: |
Improved MOSFET Designs / 1.5: |
MOSFETs for High-Frequency Operation? / 1.6: |
MOSFET Theory / 2: |
Different MOSFET Versions / 2.1: |
Definitions of Threshold Voltage / 2.1.2: |
MOS Fundamentals / 2.2: |
Conventional Two-Terminal MOS Structure / 2.2.1: |
Single-Gate and Double-Gate SOI MOS Structures / 2.2.2: |
An Approximated Sheet Concentration Versus Gate Voltage Relationship / 2.2.3: |
MOSFET Current -- Voltage Characteristics / 2.3: |
Classical MOSFET Model / 2.3.1: |
Two-Region MOSFET Model / 2.3.3: |
Modified Two-Region Model / 2.3.4: |
Effective Mobility / 2.3.5: |
Scattering Model / 2.3.6: |
Comparison and Assessment of the Four Transistor Models / 2.3.7: |
Subthreshold Current / 2.3.8: |
Series Resistances / 2.3.9: |
Short-Channel Effects / 2.3.10: |
The Concept of Scale Lengths / 2.3.12: |
Nanoscale MOSFETs / 3: |
MOSFET Scaling Theory / 3.1: |
Constant-Field and Constant-Voltage Scaling / 3.1.1: |
Generalized Scaling Approaches / 3.1.2: |
Good Technology Rules / 3.1.3: |
Nanoscale MOSFET Concepts -- An Overview / 3.2: |
Nanoscale Bulk MOSFETs / 3.3: |
Basic Structure / 3.3.1: |
Doping Profiles / 3.3.2: |
Mobility Enhancement Techniques / 3.4: |
Strained Silicon / 3.4.1: |
Hybrid-Orientation Technology / 3.4.2: |
High-k Dielectrics and Metal Gates / 3.5: |
Nanoscale Single-Gate SOI MOSFETs / 3.6: |
Nanoscale Multiple-Gate MOSFETs / 3.7: |
Double-Gate MOSFETs / 3.7.1: |
Tri-Gate MOSFETs and Gate-All-Around MOSFETs / 3.7.2: |
Nanowire MOSFETs / 3.7.3: |
MOSFETs with Alternative Channel Materials / 3.8: |
The Effect of Multiple Technology Boosters / 3.9: |
MOSFETs for RF Applications / 4: |
RF Transistor Figures of Merit / 4.1: |
Gains / 4.2.1: |
Minimum Noise Figure and Associated Gain / 4.2.2: |
Output Power and Power-Added Efficiency / 4.2.4: |
Small-Signal Equivalent Circuits / 4.3: |
RF MOSFET Design and Performance / 4.4: |
RF Small-Signal MOSFETs / 4.4.1: |
RF Power MOSFETs / 4.4.2: |
Comparison of RF CMOS and Competing RF Transistor Technologies / 4.4.3: |
Why are Si MOSFETs so Fast? / 4.4.4: |
Overview of Nanometer CMOS Technology / 5: |
Lithography / 5.1: |
Optical Lithography / 5.2.1: |
Extremely Ultraviolet Lithography (EUV) / 5.2.3: |
Electron Beam Lithography (E-Beam) / 5.2.4: |
Imprint Lithography / 5.2.5: |
Plasma Etching / 5.3: |
Thin Film Formation Techniques / 5.4: |
Overview / 5.4.1: |
Chemical Vapor Deposition (CVD) / 5.4.2: |
Metal-Organic Chemical Vapor Deposition (MOCVD) / 5.4.3: |
Molecular Beam Epitaxy (MBE) / 5.4.4: |
Atomic Layer Deposition (ALD) / 5.4.5: |
Metal Film Deposition / 5.4.6: |
Junction Formation / 5.5: |
Ion Implantation / 5.5.1: |
Plasma Doping / 5.5.2: |
Interconnects / 5.6: |
Summary / 5.7: |
Outlook / 6: |
Critical Scaling Issues / 6.1: |
Issues Related to Device Physics / 6.2.1: |
Power Consumption and Self-Heating / 6.2.2: |
Interconnect Delays / 6.2.3: |
Will There be a Mainstream Beyond-Scaling, Post-CMOS Technology? / 6.3: |
Frequently Used Symbols / Appendix A: |
Physical Constants and Unit Conversions / Appendix B: |
Carrier Concentrations, Energy, and Potential / Appendix C: |
Frequently Used Abbreviations / Appendix E: |
Index |
Preface |
The Evolution of Silicon Electronics / 1: |
Introduction / 1.1: |